GB201812595D0 - Liquid cooled server module - Google Patents
Liquid cooled server moduleInfo
- Publication number
- GB201812595D0 GB201812595D0 GBGB1812595.5A GB201812595A GB201812595D0 GB 201812595 D0 GB201812595 D0 GB 201812595D0 GB 201812595 A GB201812595 A GB 201812595A GB 201812595 D0 GB201812595 D0 GB 201812595D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- server module
- liquid cooled
- cooled server
- liquid
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20836—Thermal management, e.g. server temperature control
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1812595.5A GB2576032B (en) | 2018-08-02 | 2018-08-02 | Liquid cooled server module |
PCT/EP2019/070715 WO2020025717A1 (en) | 2018-08-02 | 2019-07-31 | Liquid cooled server module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1812595.5A GB2576032B (en) | 2018-08-02 | 2018-08-02 | Liquid cooled server module |
Publications (3)
Publication Number | Publication Date |
---|---|
GB201812595D0 true GB201812595D0 (en) | 2018-09-19 |
GB2576032A GB2576032A (en) | 2020-02-05 |
GB2576032B GB2576032B (en) | 2021-04-21 |
Family
ID=63518373
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1812595.5A Active GB2576032B (en) | 2018-08-02 | 2018-08-02 | Liquid cooled server module |
Country Status (2)
Country | Link |
---|---|
GB (1) | GB2576032B (en) |
WO (1) | WO2020025717A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11042406B2 (en) | 2018-06-05 | 2021-06-22 | Intel Corporation | Technologies for providing predictive thermal management |
US11917790B2 (en) | 2019-04-26 | 2024-02-27 | Intel Corporation | Thermal control for processor-based devices |
US11678444B2 (en) | 2019-05-15 | 2023-06-13 | Intel Corporation | Loading mechanism with integrated heatsink |
US11842943B2 (en) | 2019-08-06 | 2023-12-12 | Intel Corporation | Electronic systems with inverted circuit board with heat sink to chassis attachment |
CN111409414A (en) * | 2020-03-19 | 2020-07-14 | 英业达科技有限公司 | Liquid cooling seal box and case lid, on-vehicle cooling system thereof |
CN112650373A (en) * | 2020-12-04 | 2021-04-13 | 中国船舶重工集团公司第七一六研究所 | Heterogeneous liquid cooling server with semiconductor dehumidification device |
US11792962B2 (en) | 2021-05-05 | 2023-10-17 | Microsoft Technology Licensing, Llc | Systems and methods for immersion-cooled datacenters |
TWI833311B (en) * | 2022-08-02 | 2024-02-21 | 緯創資通股份有限公司 | Immersion cooling unit and electronic apparatus |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8164901B2 (en) * | 2008-04-16 | 2012-04-24 | Julius Neudorfer | High efficiency heat removal system for rack mounted computer equipment |
CN103168509B (en) * | 2010-08-26 | 2016-03-23 | 阿塞泰克丹麦公司 | For the liquid-cooling system of server |
CN103376850A (en) * | 2012-04-27 | 2013-10-30 | 鸿富锦精密工业(深圳)有限公司 | Container data center |
US9655286B2 (en) * | 2012-10-10 | 2017-05-16 | International Business Machines Corporation | Facilitating fluid level sensing |
US9049800B2 (en) * | 2013-02-01 | 2015-06-02 | Dell Products L.P. | Immersion server, immersion server drawer, and rack-mountable immersion server drawer-based cabinet |
KR20150009344A (en) * | 2013-07-16 | 2015-01-26 | 엘에스산전 주식회사 | Inverter Cabinet with A Heat Sink Bonded with Pulsating Heat Pipe Typed Fins |
US9313920B2 (en) * | 2013-10-21 | 2016-04-12 | International Business Machines Corporation | Direct coolant contact vapor condensing |
US9258926B2 (en) * | 2014-06-24 | 2016-02-09 | David Lane Smith | System and method for fluid cooling of electronic devices installed in a sealed enclosure |
US9575521B1 (en) * | 2015-07-30 | 2017-02-21 | Dell Products L.P. | Chassis external wall liquid cooling system |
-
2018
- 2018-08-02 GB GB1812595.5A patent/GB2576032B/en active Active
-
2019
- 2019-07-31 WO PCT/EP2019/070715 patent/WO2020025717A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2020025717A1 (en) | 2020-02-06 |
GB2576032A (en) | 2020-02-05 |
GB2576032B (en) | 2021-04-21 |
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