GB201507631D0 - Component temperature control - Google Patents

Component temperature control

Info

Publication number
GB201507631D0
GB201507631D0 GBGB1507631.8A GB201507631A GB201507631D0 GB 201507631 D0 GB201507631 D0 GB 201507631D0 GB 201507631 A GB201507631 A GB 201507631A GB 201507631 D0 GB201507631 D0 GB 201507631D0
Authority
GB
United Kingdom
Prior art keywords
temperature control
component temperature
component
control
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GBGB1507631.8A
Other versions
GB2522151B (en
GB2522151A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lumentum Technology UK Ltd
Original Assignee
Oclaro Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oclaro Technology Ltd filed Critical Oclaro Technology Ltd
Publication of GB201507631D0 publication Critical patent/GB201507631D0/en
Publication of GB2522151A publication Critical patent/GB2522151A/en
Application granted granted Critical
Publication of GB2522151B publication Critical patent/GB2522151B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/345—Arrangements for heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02453—Heating, e.g. the laser is heated for stabilisation against temperature fluctuations of the environment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/06804—Stabilisation of laser output parameters by monitoring an external parameter, e.g. temperature
GB1507631.8A 2012-11-07 2013-10-25 Component temperature control Expired - Fee Related GB2522151B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB1220004.4A GB2507732A (en) 2012-11-07 2012-11-07 Laser temperature control
PCT/GB2013/052790 WO2014072681A2 (en) 2012-11-07 2013-10-25 Component temperature control

Publications (3)

Publication Number Publication Date
GB201507631D0 true GB201507631D0 (en) 2015-06-17
GB2522151A GB2522151A (en) 2015-07-15
GB2522151B GB2522151B (en) 2017-02-08

Family

ID=47429275

Family Applications (2)

Application Number Title Priority Date Filing Date
GB1220004.4A Withdrawn GB2507732A (en) 2012-11-07 2012-11-07 Laser temperature control
GB1507631.8A Expired - Fee Related GB2522151B (en) 2012-11-07 2013-10-25 Component temperature control

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB1220004.4A Withdrawn GB2507732A (en) 2012-11-07 2012-11-07 Laser temperature control

Country Status (2)

Country Link
GB (2) GB2507732A (en)
WO (1) WO2014072681A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9368941B1 (en) 2014-08-14 2016-06-14 Google Inc. Temperature compensation in an optical transmitter
GB2531261A (en) 2014-10-13 2016-04-20 Bae Systems Plc Optical transmitter
EP3059760A1 (en) * 2015-02-18 2016-08-24 Siemens Aktiengesellschaft Electronic device
CN109219908B (en) * 2016-01-04 2021-10-01 汽车交通安全联合公司 Heater on radiator
CN105698151A (en) * 2016-01-11 2016-06-22 中国科学院上海光学精密机械研究所 Controllable low-temperature mercury vapor source for ultrahigh vacuum system
CN108227350B (en) * 2016-12-14 2021-06-08 台达电子工业股份有限公司 Digital miniature reflective projector
EP3675295A1 (en) * 2018-12-28 2020-07-01 Nokia Solutions and Networks Oy Laser assemblies
WO2021038803A1 (en) * 2019-08-29 2021-03-04 三菱電機株式会社 Optical module and optical module control method
CN112578510B (en) * 2020-12-01 2022-03-04 四川华拓光通信股份有限公司 Circuit compatible with TEC and Heater in optical module and application method
CN116124728A (en) * 2023-02-24 2023-05-16 上海烨映微电子科技股份有限公司 Thermopile infrared detector, preparation method thereof and NDIR detection system

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3433869B2 (en) * 1995-11-17 2003-08-04 住友電気工業株式会社 Semiconductor module
JPH09148581A (en) * 1995-11-17 1997-06-06 Sharp Corp Manufacture of thin film semiconductor device
DE69822158T2 (en) * 1997-04-04 2005-02-17 Unisys Corp. Method and device for thermally conductive connection of an electronic circuit to a heat exchanger
JP4587503B2 (en) * 1999-09-30 2010-11-24 京セラ株式会社 Semiconductor laser device mounting substrate and semiconductor laser module
US7492798B2 (en) * 2005-12-20 2009-02-17 Finisar Corporation Modular transistor outline can with internal components
JP2007180378A (en) * 2005-12-28 2007-07-12 Sumitomo Electric Ind Ltd Laser module and control method therefor
US7655553B2 (en) * 2006-01-11 2010-02-02 Texas Instruments Incorporated Microstructure sealing tool and methods of using the same
US20080080575A1 (en) * 2006-09-28 2008-04-03 Applied Optoelectronics, Inc. Laser with heater to reduce operating temperature range and method of using same
JP2009064829A (en) * 2007-09-04 2009-03-26 Nec Corp Optical communication module, and optical transmission device
WO2011061952A1 (en) * 2009-11-19 2011-05-26 富士通株式会社 Loop heat pipe system and information processing device
DE102010014100A1 (en) * 2010-04-07 2011-10-13 Osram Opto Semiconductors Gmbh Semiconductor laser element, has laser diode and positive temperature co-efficient resistor that are thermally connected with one another and arranged on heat sink and thermal conductive intermediate medium

Also Published As

Publication number Publication date
WO2014072681A3 (en) 2014-08-14
WO2014072681A2 (en) 2014-05-15
GB2522151B (en) 2017-02-08
GB2522151A (en) 2015-07-15
GB2507732A (en) 2014-05-14
GB201220004D0 (en) 2012-12-19

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20171025