GB201503089D0 - Hybrid electronic circuit - Google Patents

Hybrid electronic circuit

Info

Publication number
GB201503089D0
GB201503089D0 GB201503089A GB201503089A GB201503089D0 GB 201503089 D0 GB201503089 D0 GB 201503089D0 GB 201503089 A GB201503089 A GB 201503089A GB 201503089 A GB201503089 A GB 201503089A GB 201503089 D0 GB201503089 D0 GB 201503089D0
Authority
GB
United Kingdom
Prior art keywords
electronic circuit
hybrid electronic
hybrid
circuit
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GB201503089A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cobham Mission Systems Wimborne Ltd
Original Assignee
Flight Refuelling Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Flight Refuelling Ltd filed Critical Flight Refuelling Ltd
Priority to GB201503089A priority Critical patent/GB201503089D0/en
Publication of GB201503089D0 publication Critical patent/GB201503089D0/en
Priority to GBGB1603019.9A priority patent/GB201603019D0/en
Priority to GB1603218.7A priority patent/GB2537218B/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49894—Materials of the insulating layers or coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
GB201503089A 2015-02-24 2015-02-24 Hybrid electronic circuit Ceased GB201503089D0 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB201503089A GB201503089D0 (en) 2015-02-24 2015-02-24 Hybrid electronic circuit
GBGB1603019.9A GB201603019D0 (en) 2015-02-24 2016-02-22 Hybrid electronic circuit
GB1603218.7A GB2537218B (en) 2015-02-24 2016-02-24 Hybrid electronic circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB201503089A GB201503089D0 (en) 2015-02-24 2015-02-24 Hybrid electronic circuit

Publications (1)

Publication Number Publication Date
GB201503089D0 true GB201503089D0 (en) 2015-04-08

Family

ID=52822111

Family Applications (3)

Application Number Title Priority Date Filing Date
GB201503089A Ceased GB201503089D0 (en) 2015-02-24 2015-02-24 Hybrid electronic circuit
GBGB1603019.9A Ceased GB201603019D0 (en) 2015-02-24 2016-02-22 Hybrid electronic circuit
GB1603218.7A Active GB2537218B (en) 2015-02-24 2016-02-24 Hybrid electronic circuit

Family Applications After (2)

Application Number Title Priority Date Filing Date
GBGB1603019.9A Ceased GB201603019D0 (en) 2015-02-24 2016-02-22 Hybrid electronic circuit
GB1603218.7A Active GB2537218B (en) 2015-02-24 2016-02-24 Hybrid electronic circuit

Country Status (1)

Country Link
GB (3) GB201503089D0 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11772791B2 (en) * 2018-03-15 2023-10-03 Unmanned Systems and Solutions, LLC Unmanned aerial vehicle tether system

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2097998B (en) * 1981-05-06 1985-05-30 Standard Telephones Cables Ltd Mounting of integrated circuits
WO1996008037A1 (en) * 1994-09-06 1996-03-14 Sheldahl, Inc. Printed circuit substrate having unpackaged integrated circuit chips directly mounted thereto and method of manufacture
JP3973402B2 (en) * 2001-10-25 2007-09-12 株式会社日立製作所 High frequency circuit module
US20040126547A1 (en) * 2002-12-31 2004-07-01 Coomer Boyd L. Methods for performing substrate imprinting using thermoset resin varnishes and products formed therefrom
JP4592333B2 (en) * 2004-05-31 2010-12-01 三洋電機株式会社 Circuit device and manufacturing method thereof
US8536954B2 (en) * 2010-06-02 2013-09-17 Siklu Communication ltd. Millimeter wave multi-layer packaging including an RFIC cavity and a radiating cavity therein
US9496593B2 (en) * 2011-02-21 2016-11-15 Siklu Communication ltd. Enhancing operation of laminate waveguide structures using an electrically conductive fence

Also Published As

Publication number Publication date
GB201603218D0 (en) 2016-04-06
GB201603019D0 (en) 2016-04-06
GB2537218A (en) 2016-10-12
GB2537218B (en) 2020-01-29

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)