GB201416174D0 - Improvements to coating apparatus - Google Patents

Improvements to coating apparatus

Info

Publication number
GB201416174D0
GB201416174D0 GB201416174A GB201416174A GB201416174D0 GB 201416174 D0 GB201416174 D0 GB 201416174D0 GB 201416174 A GB201416174 A GB 201416174A GB 201416174 A GB201416174 A GB 201416174A GB 201416174 D0 GB201416174 D0 GB 201416174D0
Authority
GB
United Kingdom
Prior art keywords
coating apparatus
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB201416174A
Other versions
GB2519656A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teer Coatings Ltd
Original Assignee
Teer Coatings Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teer Coatings Ltd filed Critical Teer Coatings Ltd
Publication of GB201416174D0 publication Critical patent/GB201416174D0/en
Publication of GB2519656A publication Critical patent/GB2519656A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3417—Arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3452—Magnet distribution
GB1416174.9A 2013-09-13 2014-09-12 Improvements to coating apparatus Withdrawn GB2519656A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB1316366.2A GB201316366D0 (en) 2013-09-13 2013-09-13 Improvements to coating apparatus

Publications (2)

Publication Number Publication Date
GB201416174D0 true GB201416174D0 (en) 2014-10-29
GB2519656A GB2519656A (en) 2015-04-29

Family

ID=49552656

Family Applications (2)

Application Number Title Priority Date Filing Date
GBGB1316366.2A Ceased GB201316366D0 (en) 2013-09-13 2013-09-13 Improvements to coating apparatus
GB1416174.9A Withdrawn GB2519656A (en) 2013-09-13 2014-09-12 Improvements to coating apparatus

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GBGB1316366.2A Ceased GB201316366D0 (en) 2013-09-13 2013-09-13 Improvements to coating apparatus

Country Status (1)

Country Link
GB (2) GB201316366D0 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4230290A1 (en) * 1992-09-10 1994-03-17 Leybold Ag Appts. for producing plasma using cathode sputtering - comprises plasma chamber, target connected to electrode, magnetron, and microwave emitter
US20030209431A1 (en) * 2001-04-10 2003-11-13 Brown Jeffrey T. Magnetron sputtering source with improved target utilization and deposition rate
JP5147000B2 (en) * 2005-10-07 2013-02-20 国立大学法人東北大学 Magnetron sputtering equipment
CN105256276B (en) * 2010-06-10 2018-10-26 应用材料公司 The low-resistivity tungsten PVD of ionization and the coupling of RF power with enhancing
US8846451B2 (en) * 2010-07-30 2014-09-30 Applied Materials, Inc. Methods for depositing metal in high aspect ratio features

Also Published As

Publication number Publication date
GB201316366D0 (en) 2013-10-30
GB2519656A (en) 2015-04-29

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)