GB201005430D0 - Semiconductor apparatus - Google Patents
Semiconductor apparatusInfo
- Publication number
- GB201005430D0 GB201005430D0 GBGB1005430.2A GB201005430A GB201005430D0 GB 201005430 D0 GB201005430 D0 GB 201005430D0 GB 201005430 A GB201005430 A GB 201005430A GB 201005430 D0 GB201005430 D0 GB 201005430D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- semiconductor apparatus
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1005430A GB2479174A (en) | 2010-03-31 | 2010-03-31 | Semiconductor apparatus with heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1005430A GB2479174A (en) | 2010-03-31 | 2010-03-31 | Semiconductor apparatus with heat sink |
Publications (2)
Publication Number | Publication Date |
---|---|
GB201005430D0 true GB201005430D0 (en) | 2010-05-19 |
GB2479174A GB2479174A (en) | 2011-10-05 |
Family
ID=42228685
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1005430A Withdrawn GB2479174A (en) | 2010-03-31 | 2010-03-31 | Semiconductor apparatus with heat sink |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2479174A (en) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4504156A (en) * | 1982-07-06 | 1985-03-12 | Sperry Corporation | Cooling system monitor assembly and method |
US6362522B1 (en) * | 2000-06-28 | 2002-03-26 | Advanced Micro Devices, Inc. | Cool frame for protecting packaged electronic devices |
TWI300261B (en) * | 2003-07-02 | 2008-08-21 | Advanced Semiconductor Eng | Chip package structur |
US20060208365A1 (en) * | 2005-03-17 | 2006-09-21 | Chipmos Technologies Inc. | Flip-chip-on-film package structure |
US7446412B2 (en) * | 2006-03-28 | 2008-11-04 | Intel Corporation | Heat sink design using clad metal |
JP2009206390A (en) * | 2008-02-29 | 2009-09-10 | Nec Electronics Corp | Semiconductor laser device, heat sink, and manufacturing method of semiconductor laser device |
TWI369767B (en) * | 2008-03-11 | 2012-08-01 | Advanced Semiconductor Eng | Heat sink structure and semiconductor package as well as method for configuring heat sinks on a semiconductor package |
US20100019379A1 (en) * | 2008-07-24 | 2010-01-28 | Broadcom Corporation | External heat sink for bare-die flip chip packages |
-
2010
- 2010-03-31 GB GB1005430A patent/GB2479174A/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
GB2479174A (en) | 2011-10-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |