GB1592525A - Single sided wire wrapping electrical interconnection board - Google Patents
Single sided wire wrapping electrical interconnection board Download PDFInfo
- Publication number
- GB1592525A GB1592525A GB700/78A GB70078A GB1592525A GB 1592525 A GB1592525 A GB 1592525A GB 700/78 A GB700/78 A GB 700/78A GB 70078 A GB70078 A GB 70078A GB 1592525 A GB1592525 A GB 1592525A
- Authority
- GB
- United Kingdom
- Prior art keywords
- board
- wire wrapping
- socket contacts
- pins
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
- H01R9/15—Connectors for wire wrapping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/222—Completing of printed circuits by adding non-printed jumper connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/53—Fixed connections for rigid printed circuits or like structures connecting to cables except for flat or ribbon cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/10—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation
- H01R4/14—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by wrapping
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
Description
(54) SINGLE SIDED WIRE WRAPPING ELECTRICAL
INTERCONNECTION BOARD
(71) We, AUGAT INC., a corporation of the Commonwealth of Massachusetts,
United States of America, of 33 Perry Avenue, Attleboro, Massachusetts 02703, United
States of America, do hereby declare the invention, for which we pray that a patent may be granted to us, and the method by which it is to be performed, to be particularly described in and by the following statement:
This invention relates generally to electrical interconnection boards and more specifically to a wire wrapping board having both the wire wrapping pins and electronic components together with interconnecting wires on one side thereof.
The most common type of wire wrapping board presently available includes means such as socket contacts, plated through holes and dual-in-line molded insulators for receiving the electrical leads of dual-in-line packages (DIP's) on one side of the board, and having elongated wire wrapping pins projecting from the other side of the board.
The leads of the DIP's are normally arranged on the axis of and connected to the wire wrapping pins, and wires interconnecting various of the pins are laid out in random fashion on the non-component side of the board between and among the wire wrapping pins. Attempts have been made to include the wire wrapping pins on the component side of the board but because of the location of the DIP's, the connecting wires had to go around the DIP positions. Because of the restrictions in wire placement, a relatively large number of wires were laid in parallel contacting relationship which tended to create electrical "glitches" and crosstalk. Additionally, where computer programs are used for machine positioning purposes during the wire wrapping process, it would have to account for the restricted areas for wire placement thereby adding complications and costs to the assembly of such boards.
Broadly speaking, this invention is concerned with an improved wire wrapping electrical interconnection board having both wire wrapping pins and electronic components such as DIP's on the same side. The use of socket contacts in what may be termed a "high" position enables the pluggability of
DIP's in a position raised above the board surface adjacent the wire wrapping pins to thereby permit relatively direct and random location of interconnecting wires connected to the pins.
The raised position of the DIP's also permits complete visibility of the top side of the board for soldering individual socket contacts or pins, and for inspection and repair, while opening up channels for improved air circulation. Additionally, the lead sockets, which have a downward facing shoulder, and the DIP's both tend to prevent the wire wrapping interconnecting wires from tending to pop up, a common occurrence on standard wire wrapping boards when many wires occupy the same channel.
By permitting direct and relatively random interconnecting wire location, the likelihood of "glitches" and crosstalk is significantly reduced compared with single sided wire wrapping boards having the DIP's mounted close to the surface or to molded insulators on the surface.
The term "glitches" as used herein, and as known in the relevant art, refers to noise which may cause spurious electrical signals in a circuit, particularly in low level digital circuits where the signals are small.
"Glitches" can be caused by external noise or by signals which are cross-coupled within a circuit itself.
According to one aspect thereof the invention provides an electrical interconnection board comprising:
a flat board having a plurality of dual-inline arrays of holes for socket contacts and a multiplicity of holes for wire wrapping pins arranged therein;
socket contacts mounted in at least some of said holes in said dual-in-line arrays, the opening of said socket contacts extending above and being spaced from one surface of said board;
a wire wrapping pin mounted in at least some of said wire wrapping pin holes in said board, said pin extending upwardly from said one surface of said board parallel with said socket contacts; and
metalized areas on the other surface of said board for electrically selectively interconnecting said wire wrapping pins to said socket contacts.
According to another aspect thereof. the invention provides an electrical interconnection board comprising:
a flat board comprised partially of dielectric material having a plurality of dual-inline arrays of holes and a multiplicity of wire wrapping pin holes arranged therein;
socket contacts mounted in at least some of said holes in said dual-in-line arrays, the opening of said socket contacts extending above and being spaced from one surface of said board, said opening being adapted to pluggably receive leads of dual-in-line electronic circuit packages wherein said packages are spaced from said one surface of said board;
a wire wrapping pin mounted in at least some of said wire wrapping pin holes in said borad, said pin extending upwardingly from said one surface of said board parallel with said socket contacts;
metalized areas on the other side of said board for electrically selectively interconnecting said wire wrapping pins to said socket contacts; and
a plurality of interconnecting wires located adjacent said one surface of said hoard, each said wire being connected to at least one of said wire wrapping pins, said interconnecting wire being arranged in a relatively direct route between said wire wrapping pins to which it is connected and extending among the others of said wire wrapping pins and said socket contacts in said arrays, some of said interconn(+cthlg wires proceeding in a relatively direct route from one wire wrapping pin to another through at least one of said dual-in-line arrays between at least two socket contacts in said one array, said interconnecting wires being normally located below the tops of said socket contacts containing said opening.
A specific embodiment of the invention will now be described, by way of example, with reference to the accompanying drawing in which:
Fig. 1 is a perspective view of a portion of a prior art wire wrapping interconnection board;
Fig. 2 is a cross-sectional view taken along cutting plane 2-2 of Fig. 1 showing a detail of the prior art;
Fig. 3 is a partial perspective view of an interconnection board constructed in accor dance :th the present invention; and Fig. 4 is a sectional view taken along cutting plane 4 of Fig. 3.
Referring now to the drawing and more particularly to Figs. 1 and 2 thereof, there is shown an interconnection or panel board 11 having dual-in-line arrays 12 of holes with a lead socket 13 having a wire wrapping pin 14 projecting therefrom mounted in each of the holes in the arrays. A DIP 15 is pluggably mounted in each array with each of its leads
16 removably inserted in one of the socket contacts 13, the leads being on the same axis as pins 14. The ends of interconnecting wires
17 are wrapped in coil form 18 around pins
14 on the wire wrapping side of the board, and discrete components 21 may also be interconnected between wire wrapping pins if desired. Note that the wire wrapping pins extending from one side of the prior art board while the electronic components, normally DlP's, are mounted on the other side.
In cases where it is desired to stack boards in face-to-face relationship, it can be seen that a significant distance is necessary between adjacent boards with this configuration.
When boards are so mounted, the relationship of the average distance between them is referred to as Z-plane density.
With reference now to Figs. 3 and 4, there is shown the interconnection board 22 of the present invention. This is shown as a multilayer panel board commonly used in electrical interconnection but it may also be a common board having a power plane and a ground plane on the opposite sides thereof. A voltage or power plane 23 covers a significant portion of the top side of the board and has paths 24 which may be termed "avenues" extending between rows of socket contacts 25 in dualin-line arrays 26 and between rows of wire wrapping pins 27. If desired, narrower interconnection paths 31 which may be termed "streets" extend between the wire wrapping pins and the socket contacts in the respective rows to interconnect avenues 24. Pluggably mounted in socket contacts 25 are leads 32 of
DIP's 33. If desired, paths 24 may also exist between a row of contacts 25 and a row of pins 27.
Socket contacts 25 are preferably conventional devices having a tapered opening adapted to receivethe smaller elongated portion of each lead 32, the taper 34 of each lead normally being seated in the tapered opening of the socket contact. With specific reference now to Fig. 4, socket contacts 25 are shown mounted in the high position to plated through holes 35 wherein pin 36 extends through the opposite side of board 22 and is soldered thereto as indicated by reference numeral 37. Because pin 36 is substantially smaller in diameter than is the body of contact 25, plated through hole 35 may be relatively small, thereby permitting electrical circuit traces to pass between the mounting positions of contacts 25. However, it should be noted that plated through holes are not necessary and that socket contacts 25 may be inserted into holes formed in board 22 and then secured by means of solder to a circuit path on the bottom side of the board. Wire wrapping pins 27 and socket contacts 25 are preferably selectively interconnected on the bottom side of board 22 by means of metalized areas or circuit traces, as indicated by path 47 in Fig. 4. Reference numeral 48 indicates the existence of other circuit traces on the bottom side of the board. Such traces, as is common with printed circuit board, may interconnect any one or more of pins 27 with any one or more of contacts 25.
Wire wrapping pins 27 are formed with a
T-head 41 which provides a mechanical stop upon insertion of the pin from the bottom side. A body portion 42 passes through board 22 and head 41 is soldered to a trace on the bottom side thereof as indicated by reference numeral 43. Pins 27 extending from body 42 may also be mounted in plated through holes or may be inserted into holes in board 22 and merely secured to a circuit path by means of solder as shown. Coils 44 of wires 45 are wrapped around pin 27 and form an electrical contact between the pin and interconnecting wires. Note that there may be one or more levels of wrap 44 on each pin 27.
When several interconnecting wires 45 extend along a common path, they tend to pop up. The downward facing should 46 of each socket contact 25 helps to maintain wires 45 in a position close to or slightly spaced from the surface of the board but still below the position of DIP's 33. However, in instances where the wires do not lie along the side of one or more contacts 25, they may also be held in place by the DIP's themselves where they pass through a dual-in-line array 26. Wires 45 are shown terminated at the edge of the board in Fig. 3. It is understood that these wires may interconnect pins 27 on a single board, or may connect a pin on one board to a pin located elsewhere in a composite electronic assembly.
It may now be appreciated that the computer programming for wire wrapping of a board constructed in accordance with this invention is substantially the same as that necessary for prior art wire wrapping boards and that the location of interconnecting wires is also substantially the same as previously.
When the wire wrapping has been complete and the interconnecting wires located and pushed down toward the top surface of the board, DIP's may be plugged into socket contacts 25 in the arrays 26 as desired for completion of the panel board. Thus it is now possible for the interconnecting wires of wire wrapping boards to be laid along streets as well as avenues all over the board while at the same time allowing the electronic components, normally DIP's, to be pluggably connected to the same side of the board. It is apparent that with such a configuration, greater Z-plane density of panel boards may be obtained. Efforts are continually being made to improve such density in switching circuitry where it is desired to accomplish the greatest amount of electrical switching in the smallest amount of space and the structure of this invention materially improves upon that aspect of electronic packaging density.
With this configuration for pluggably mounting DIP's to panel boards without employing conventional type dual-in-line insulators, individual socket contacts are easily accessible for soldering to a conductive plane or trace. Further, air circulation for cooling purposes is improved and the areas around and under the DIP's are open for inspection, repair and cleaning.
The interconnection board may be formed with multiple metalized layers, at least one metal layer being sandwiched between layers of dielectric material.
The top of each said socket contact is, conveniently, spaced from said one surface of the board by a distance which is substantially equal to the thickness of the board.
WHAT WE CLAIM IS: 1. An electrical interconnection board comprising:
a flat board having a plurality of dual-inline arrays of holes for socket contacts and a multiplicity of holes for wire wrapping pins arranged therein;
socket contacts mounted in at least some of said holes in said dual-in-line arrays, the opening of said socket contacts extending above and being spaced from one surface of said board;
a wire wrapping pin mounted in at least some of said wire wrapping pin holes in said board, said pin extending upwardly from said one surface of said board parallel with said socket contacts; and
metalized areas on the other surface of said board for electrically selectively interconnecting said wire wrapping pins to said socket contacts.
2. An electrical interconnection board according to claim 1, further comprising a plurality of interconnecting wires, each connected to at least one of said wire wrapping pins.
3. An electrical interconnection board according to-claim 2, wherein each said interconnecting wire is arranged in a relatively direct route between said wire wrapping pins to which it is connected, extending between the others of said wire wrapping pins and between said socket contacts in said arrays.
4. An electrical interconnection board according to claim 3, wherein some of said interconnecting wires are located closely adjacent said one surface of said board and below the level of the tops of said socket contacts.
5. An electrical interconnection board
**WARNING** end of DESC field may overlap start of CLMS **.
Claims (13)
1. An electrical interconnection board comprising:
a flat board having a plurality of dual-inline arrays of holes for socket contacts and a multiplicity of holes for wire wrapping pins arranged therein;
socket contacts mounted in at least some of said holes in said dual-in-line arrays, the opening of said socket contacts extending above and being spaced from one surface of said board;
a wire wrapping pin mounted in at least some of said wire wrapping pin holes in said board, said pin extending upwardly from said one surface of said board parallel with said socket contacts; and
metalized areas on the other surface of said board for electrically selectively interconnecting said wire wrapping pins to said socket contacts.
2. An electrical interconnection board according to claim 1, further comprising a plurality of interconnecting wires, each connected to at least one of said wire wrapping pins.
3. An electrical interconnection board according to-claim 2, wherein each said interconnecting wire is arranged in a relatively direct route between said wire wrapping pins to which it is connected, extending between the others of said wire wrapping pins and between said socket contacts in said arrays.
4. An electrical interconnection board according to claim 3, wherein some of said interconnecting wires are located closely adjacent said one surface of said board and below the level of the tops of said socket contacts.
5. An electrical interconnection board
according to claim 4, further comprising dual-in-line electronic circuit packages having their leads pluggably mounted in said socket contacts in at least some of said arrays.
6. An electrical interconnection board according to claim 5, wherein those of said interconnecting wires passing between socket contacts of one of said arrays in which a dual-in-line package is mounted are always retained below the level of said dual-in-line package.
7. An electrical interconnection board according to any one of claims I to 6, wherein said wire wrapping pins and their holes are arranged in rows parallel to and spaced from said dual-in-line arrays.
8. An electrical interconnection board according to any one of claims I to 7, wherein said holes in said dual-in-line arrays are formed as plated through holes.
9. An electrical interconnection board according to any one of claims I to 8, wherein said board is formed with multiple metalized layers, at least one metal layer being sandwiched between layers of dielectric material.
10. An electrical interconnection board according to any one of claims I to 9, wherein at least some of said socket contacts and said wire wrapping pins are soldered to said metalized areas on said other side of said board.
11. An electrical interconnection board according to any one of claims I to 10, wherein the top of each said socket contact is spaced from said one surface of the board by a distance which is substantially equal to the thickness of the board.
12. An electrical interconnection board comprising:
a flat board comprised partially of dielectric material having a plurality of dual-inline arrays of holes and a multiplicity of wire wrapping pin holes arranged therein;
socket contacts mounted in at least some of said holes in said dual-in-line arrays, the opening of said socket contacts extending above and being spaced from one surface of said board, said opening being adapted to pluggably receive leads of dual-in-line electronic circuit packages wherein said packages are spaced from said one surface of said board;
a wire wrapping pin mounted in at least some of said wire wrapping pin holes in said board. said pin extending upwardly from said one surface of said board parallel with said socket contacts;
metalized areas on the other side of said board for electrically selectively interconnecting said wire wrapping pins to said socket contacts; and
a plurality of interconnecting wires located adjacent said one surface of said board, each said wire being connected to at least one of said wire wrapping pins, said interconnecting wire being arranged in a relatively direct route between said wire wrapping pins to which it is connected and extending among the others of said wire wrapping pins and said socket contacts in said arrays, some of said interconnecting wires proceeding in a relatively direct route from one wire wrapping pin to another through at least one of said dual-in-line arrays between at least two socket contacts in said one array, said interconnecting wires being normally located below the tops of said socket contacts containing said opening.
13. An electrical interconnection board according to claim 1 or claim 12, substantially as hereinbefore described with reference to, and as illustrated in, Figures 3 and 4 of the accompanying drawing.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US78283177A | 1977-03-30 | 1977-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1592525A true GB1592525A (en) | 1981-07-08 |
Family
ID=25127305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB700/78A Expired GB1592525A (en) | 1977-03-30 | 1978-01-09 | Single sided wire wrapping electrical interconnection board |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPS53122768A (en) |
| DE (1) | DE2806246A1 (en) |
| GB (1) | GB1592525A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE9201083U1 (en) * | 1992-01-30 | 1992-03-26 | Schroff Gmbh, 75334 Straubenhardt | Multilayer backplane bus board |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0244456Y2 (en) * | 1984-10-29 | 1990-11-26 | ||
| FR2604591A1 (en) * | 1986-09-26 | 1988-04-01 | Delattre Fabrice | Modular element for supporting electronic and/or electrical components |
| US5159536A (en) * | 1988-05-13 | 1992-10-27 | Mupac Corporation | Panel board |
| DE4408356A1 (en) * | 1994-03-14 | 1995-09-21 | Ralf Dipl Ing Bierschenk | Circuit adaptor device |
-
1978
- 1978-01-09 GB GB700/78A patent/GB1592525A/en not_active Expired
- 1978-01-31 JP JP979378A patent/JPS53122768A/en active Pending
- 1978-02-15 DE DE19782806246 patent/DE2806246A1/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE9201083U1 (en) * | 1992-01-30 | 1992-03-26 | Schroff Gmbh, 75334 Straubenhardt | Multilayer backplane bus board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS53122768A (en) | 1978-10-26 |
| DE2806246A1 (en) | 1978-10-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |