GB1563722A - Method and means for soldering electric conductors to circuit boards - Google Patents

Method and means for soldering electric conductors to circuit boards Download PDF

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Publication number
GB1563722A
GB1563722A GB36016/76A GB3601676A GB1563722A GB 1563722 A GB1563722 A GB 1563722A GB 36016/76 A GB36016/76 A GB 36016/76A GB 3601676 A GB3601676 A GB 3601676A GB 1563722 A GB1563722 A GB 1563722A
Authority
GB
United Kingdom
Prior art keywords
circuit board
solder
strip
holes
elongate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB36016/76A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bunker Ramo Corp
Original Assignee
Bunker Ramo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bunker Ramo Corp filed Critical Bunker Ramo Corp
Publication of GB1563722A publication Critical patent/GB1563722A/en
Expired legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0235—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for applying solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Multi-Conductor Connections (AREA)

Description

(54) A METHOD AND MEANS FOR SOLDERING ELECTRIC CONDUCTORS TO CIRCUIT BOARDS (71) We, BUNKER RAMO CORPOR ATION, a Corporation organised and existing under the laws of the State of Delaware, United States of America, of 900 Commerce Drive, Oak Brook, Illinois, United States of America, do hereby declare the invention, for which we pray that a patent may be granted to us, and the method by which it is to be performed, to be particularly described in and by the following statement: This invention pertains to the field of art concerning the preparation of electronic circuit boards, and more particularly but not exclusively to the soldering of elongate conductors perpendicular to double-sided circuit boards.
The continuing trend to miniaturization of electronic devices, has led to utilization of printed circuit cards having conduction paths on both surfaces. Electrical connection between conduction paths on opposite sides of the card is effected by either a metallized hole through the card, a terminal soldered on both sides of the card, or by means of a connector in contact with both sides of the card.
The separate operation of metallizing the walls of holes through the circuit board is a time consuming process. Soldering a terminal first to one surface and then to the other surface of a circuit board is uneconomical and inefficient, since two operations are required. Use of a connector is only possible at the edges of the board, and a great number of contact points may be necessary to accomplish all of the connections.
The prior art also includes the technique consisting of using tubular adapters, through which the solder flows by capillary action. Such a procedure requires enlarged holes through the circuit board, and requires the additional step of installing the tubular adapters.
According to the present invention there is provided a method of soldering elongate conductors perpendicular to a circuit board, comprising the steps of: providing an elongate strip of fusable solder material comprising a plurality of interconnected sections each comprising a substantially flat base portion and a central portion protruding from one face of the base portion, each of said central portions having a central opening extending therethrough and through the base portion to receive an elongate conductor to be soldered to said board, and said base portions of adjacent sections being joined by neck portions of the solder material, said neck portions being narrower than said base portions; placing said strip on a circuit board with said elongate conductors passing through said openings in the strip at selected locations relative to the board; and fusing said strip to sever said neck portions by surface tension of the fused solder material and to form from each said section a meniscus about the conductor passing through said opening.
Further according to the invention there is provided an elongate strip of fusable solder material comprising a plurality of interconnected sections each comprising a substantially flat base portion and a central portion protruding from one face of the base portion, and wherein: each of said central portions has a central opening extending therethrough and through the base portion to receive an elongate conductor to be soldered to a board supporting the solder strip; and said base portions of adjacent sections are joined by neck portions of the solder material, said neck portions being narrow compared with said base portions.
Figure lis a perspective enlarged view of a portion of a circuit board, including a section of the solder strip.
Figure 2 is a cross-sectional view of a terminal in place through the soldering strip and circuit board before melting of the solder.
As shown in Figure 1, a circuit board 1 of insulated material supports metal conduction paths 2 and has connecting holes 3 positioned at a standardized spacing.
A strip 4 of solder material, composed of a plurality of generally cylindrical parts 5 containing holes 6 through their longitudinal axes, is placed over a set of holes 3 in the circuit board. The holes 6 in the solder strip 4 are slightly greater in diameter than that of the extremities 7a of the terminals 7. Each cylinder 5 includes a flange 8 at its base, and the total volume of solder contained in the cylinder and flange is sufficient to fill the annular space around the terminal extremity 7a in the hole 3 of circuit board 1, to connect with the conduction path 2' (Figure 2) on the bottom of the circuit board 1, and form a meniscus on the upper surface of the circuit board.
A bridging strip of solder 9 connects the two flanges 8 of adjoining cylinders.
Shoulders 7b having diameters slightly greater than that of the holes in the circuit board limit the depth of penetration of the terminals 7 into the circuit board.
Figure 2 shows a terminal 7 in place in the circuit board 1 before the solder is melted.
The extremity 7a of the terminal 7 extends through the cylinder 5 and into the circuit board 1 through hole 3. Upon applying heat to the extremity 7a, the solder will melt and flow into hole 3, providing electrical connection between conduction path 2 on the upper surface and conduction path 2' on the lower surface of the circuit board.
In order to solder a terminal 7 to a double-sided circuit board 1, using the method of the present invention, the following procedure is used: a. The solder strip 4, such as described above, is placed on the upper surface of the circuit board 1, in such a way that the holes 6 align with the holes 3 in the circuit board 1; b. The extremities 7a of the terminals 7 are inserted through the holes 6 of the solder strip 4, the conduction path 2 about holes 3, the holes 3 of the circuit board 1, and the conduction path 2'; c. A downward force is maintained on the terminals 7, so that when the solder melts the terminals will move downward so that the shoulders 7b will come into solder contact with the conduction path 2; d. A source of heat is applied to the extremities 7a of the terminals 7 which extend below the circuit board 1, causing the solder to melt and flow through the annular spaces between the extremities 7a and the walls of the holes 3 through the circuit board, and form menisci of solder on the conduction paths 2 on the upper surface of the circuit board 1 and on the conduction paths 2 on the lower surface of the circuit board.
When the solder melts, the bridging strips 9 will separate due to the effect of the surface tension of the solder on the insulating material of the circuit board 1. Therefore, all of the solder formerly contained in the shape of the bridging strip will flow into and about the holes 3 in the circuit board where it becomes part of the menisci on the conduction paths.
WHAT WE CLAIM IS: 1. A method for soldering elongate conductors perpendicular to a circuit board, comprising the steps of: providing an elongate strip of fusable solder material comprising a plurality of interconnected sections each comprising a substantially flat base portion and a central portion protruding from one face of the base portion, each of said central portions having a central opening extending therethrough and through the base portion to receive an elongate conductor to be soldered to said board, and said base portions of adjacent sections being joined by neck portions of the solder material, said neck portions being narrower than said base portions; placing said strip on a circuit board with said elongate conductors passing through said openings in the strip at selected locations relative to the board; and fusing said strip to sever said neck portions by surface tension of the fused solder material and to form from each said section a meniscus about the conductor passing through said opening.
2. The method as claimed in Claim 1, further comprising the steps of passing said elongate conductors through openings in said board corresponding to openings in said strip with ends of said conductors protruding from an underneath face of said board, wherein said fusing step comprises heating said protruding ends of the conductors and wherein a further meniscus of solder is formed about the end of each conductor protruding from the said underneath face.
3. An elongate strip of fusable solder material comprising a plurality of interconnected sections each comprising a substantially flat base portion and a central portion protruding from one face of the base portion, and wherein: each of said central portions has a central opening extending therethrough and through the base portion to receive an elongate conductor to be soldered to a board supporting the solder strip; and said base portions of adjacent sections are joined by neck portions of the solder material, said neck portions being narrow compared with said base portions.
**WARNING** end of DESC field may overlap start of CLMS **.

Claims (5)

**WARNING** start of CLMS field may overlap end of DESC **. terminal in place through the soldering strip and circuit board before melting of the solder. As shown in Figure 1, a circuit board 1 of insulated material supports metal conduction paths 2 and has connecting holes 3 positioned at a standardized spacing. A strip 4 of solder material, composed of a plurality of generally cylindrical parts 5 containing holes 6 through their longitudinal axes, is placed over a set of holes 3 in the circuit board. The holes 6 in the solder strip 4 are slightly greater in diameter than that of the extremities 7a of the terminals 7. Each cylinder 5 includes a flange 8 at its base, and the total volume of solder contained in the cylinder and flange is sufficient to fill the annular space around the terminal extremity 7a in the hole 3 of circuit board 1, to connect with the conduction path 2' (Figure 2) on the bottom of the circuit board 1, and form a meniscus on the upper surface of the circuit board. A bridging strip of solder 9 connects the two flanges 8 of adjoining cylinders. Shoulders 7b having diameters slightly greater than that of the holes in the circuit board limit the depth of penetration of the terminals 7 into the circuit board. Figure 2 shows a terminal 7 in place in the circuit board 1 before the solder is melted. The extremity 7a of the terminal 7 extends through the cylinder 5 and into the circuit board 1 through hole 3. Upon applying heat to the extremity 7a, the solder will melt and flow into hole 3, providing electrical connection between conduction path 2 on the upper surface and conduction path 2' on the lower surface of the circuit board. In order to solder a terminal 7 to a double-sided circuit board 1, using the method of the present invention, the following procedure is used: a. The solder strip 4, such as described above, is placed on the upper surface of the circuit board 1, in such a way that the holes 6 align with the holes 3 in the circuit board 1; b. The extremities 7a of the terminals 7 are inserted through the holes 6 of the solder strip 4, the conduction path 2 about holes 3, the holes 3 of the circuit board 1, and the conduction path 2'; c. A downward force is maintained on the terminals 7, so that when the solder melts the terminals will move downward so that the shoulders 7b will come into solder contact with the conduction path 2; d. A source of heat is applied to the extremities 7a of the terminals 7 which extend below the circuit board 1, causing the solder to melt and flow through the annular spaces between the extremities 7a and the walls of the holes 3 through the circuit board, and form menisci of solder on the conduction paths 2 on the upper surface of the circuit board 1 and on the conduction paths 2 on the lower surface of the circuit board. When the solder melts, the bridging strips 9 will separate due to the effect of the surface tension of the solder on the insulating material of the circuit board 1. Therefore, all of the solder formerly contained in the shape of the bridging strip will flow into and about the holes 3 in the circuit board where it becomes part of the menisci on the conduction paths. WHAT WE CLAIM IS:
1. A method for soldering elongate conductors perpendicular to a circuit board, comprising the steps of: providing an elongate strip of fusable solder material comprising a plurality of interconnected sections each comprising a substantially flat base portion and a central portion protruding from one face of the base portion, each of said central portions having a central opening extending therethrough and through the base portion to receive an elongate conductor to be soldered to said board, and said base portions of adjacent sections being joined by neck portions of the solder material, said neck portions being narrower than said base portions; placing said strip on a circuit board with said elongate conductors passing through said openings in the strip at selected locations relative to the board; and fusing said strip to sever said neck portions by surface tension of the fused solder material and to form from each said section a meniscus about the conductor passing through said opening.
2. The method as claimed in Claim 1, further comprising the steps of passing said elongate conductors through openings in said board corresponding to openings in said strip with ends of said conductors protruding from an underneath face of said board, wherein said fusing step comprises heating said protruding ends of the conductors and wherein a further meniscus of solder is formed about the end of each conductor protruding from the said underneath face.
3. An elongate strip of fusable solder material comprising a plurality of interconnected sections each comprising a substantially flat base portion and a central portion protruding from one face of the base portion, and wherein: each of said central portions has a central opening extending therethrough and through the base portion to receive an elongate conductor to be soldered to a board supporting the solder strip; and said base portions of adjacent sections are joined by neck portions of the solder material, said neck portions being narrow compared with said base portions.
4. A method of soldering elongate con
ductors perpendicular to a circuit board substantially as hereinbefore described with reference to the accompanying drawings.
5. An elongate strip of fusable solder material substantially as hereinbefore de scribed with reference to and as shown at 4 in Figure 1 of the accompanying drawings.
GB36016/76A 1975-08-29 1976-08-31 Method and means for soldering electric conductors to circuit boards Expired GB1563722A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7526662A FR2322466A1 (en) 1975-08-29 1975-08-29 CONNECTION PROCEDURE FOR COMPONENTS AND DEVICE FOR IMPLEMENTING THE PROCESS

Publications (1)

Publication Number Publication Date
GB1563722A true GB1563722A (en) 1980-03-26

Family

ID=9159469

Family Applications (1)

Application Number Title Priority Date Filing Date
GB36016/76A Expired GB1563722A (en) 1975-08-29 1976-08-31 Method and means for soldering electric conductors to circuit boards

Country Status (5)

Country Link
BE (1) BE845616A (en)
DE (1) DE2638469A1 (en)
FR (1) FR2322466A1 (en)
GB (1) GB1563722A (en)
NL (1) NL7609524A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3815736A1 (en) * 1988-05-07 1989-11-16 Messerschmitt Boelkow Blohm Multilayer circuit board

Also Published As

Publication number Publication date
BE845616A (en) 1976-12-16
DE2638469A1 (en) 1977-03-10
FR2322466A1 (en) 1977-03-25
FR2322466B1 (en) 1978-12-01
NL7609524A (en) 1977-03-02

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee