GB1502554A - Electronic circuit for an electronic timepiece - Google Patents

Electronic circuit for an electronic timepiece

Info

Publication number
GB1502554A
GB1502554A GB18901/76A GB1890176A GB1502554A GB 1502554 A GB1502554 A GB 1502554A GB 18901/76 A GB18901/76 A GB 18901/76A GB 1890176 A GB1890176 A GB 1890176A GB 1502554 A GB1502554 A GB 1502554A
Authority
GB
United Kingdom
Prior art keywords
electronic
circuit
lead frame
timepiece
encapsulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB18901/76A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP50059149A external-priority patent/JPS51133765A/en
Priority claimed from JP1975068553U external-priority patent/JPS5737535Y2/ja
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Publication of GB1502554A publication Critical patent/GB1502554A/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G04—HOROLOGY
    • G04C—ELECTROMECHANICAL CLOCKS OR WATCHES
    • G04C3/00—Electromechanical clocks or watches independent of other time-pieces and in which the movement is maintained by electric means
    • G04C3/008—Mounting, assembling of components
    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/02—Component assemblies
    • G04G17/04—Mounting of electronic components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H05K1/187—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding the patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate, e.g. on a temporary carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10075—Non-printed oscillator
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Clocks (AREA)
  • Electromechanical Clocks (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Adornments (AREA)
  • Inorganic Insulating Materials (AREA)

Abstract

1502554 Component assemblies DAINI SEIKOSHA KK 7 May 1976 [16 May 1975 20 May 1975] 18901/76 Heading H1R [Also in Division G3] In an electronic circuit for an electronic watch an integrated circuit chip 2 is mounted on a lead frame 1, together with other circuit elements such as a resistor 3 and trimmer condenser 4<SP>1</SP> (Fig. 2C), a portion of the lead frame 1 being enclosed by electrically insulating material, such as resin encapsulation 5, and the remainder of the frame 1 being exposed for connection to at least one other circuit element, such as a quartz crystal vibrator. Fig. 3 shows a gear train 9 of the watch mechanism mounted in holes 10 in the encapsulation 5.
GB18901/76A 1975-05-15 1976-05-07 Electronic circuit for an electronic timepiece Expired GB1502554A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP50059149A JPS51133765A (en) 1975-05-15 1975-05-15 Method of mounting electronic timekeeper circuit
JP1975068553U JPS5737535Y2 (en) 1975-05-20 1975-05-20

Publications (1)

Publication Number Publication Date
GB1502554A true GB1502554A (en) 1978-03-01

Family

ID=39271194

Family Applications (1)

Application Number Title Priority Date Filing Date
GB18901/76A Expired GB1502554A (en) 1975-05-15 1976-05-07 Electronic circuit for an electronic timepiece

Country Status (5)

Country Link
CH (1) CH615313GA3 (en)
DE (1) DE2620861C2 (en)
FR (1) FR2311344A1 (en)
GB (1) GB1502554A (en)
HK (1) HK48882A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5015904A (en) * 1986-05-21 1991-05-14 Robert Bosch Gmbh Stator for an electrical machine
EP1081992A2 (en) * 1999-09-02 2001-03-07 Kabushiki Kaisha Toshiba Component mounting circuit board with resin-molded section covering circuit pattern and inner components
US6370895B1 (en) 1999-09-21 2002-04-16 Kabushiki Kaisha Toshiba Refrigerator with two evaporators

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2931357C2 (en) * 1979-08-02 1981-11-19 Gebrueder Junghans Gmbh, 7230 Schramberg Method for producing a complete electronic watch module
DE3207616C3 (en) * 1982-03-03 1995-10-26 Vdo Schindling Electrical clockwork, in particular quartz clockwork

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3782102A (en) * 1971-04-29 1974-01-01 Time Co Inc Solid state watch with magnetic setting

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5015904A (en) * 1986-05-21 1991-05-14 Robert Bosch Gmbh Stator for an electrical machine
EP1081992A2 (en) * 1999-09-02 2001-03-07 Kabushiki Kaisha Toshiba Component mounting circuit board with resin-molded section covering circuit pattern and inner components
EP1081992A3 (en) * 1999-09-02 2001-10-10 Kabushiki Kaisha Toshiba Component mounting circuit board with resin-molded section covering circuit pattern and inner components
US7203071B2 (en) 1999-09-02 2007-04-10 Kabushiki Kaisha Toshiba Component mounting circuit board with resin-molded section covering circuit pattern and inner components
US6370895B1 (en) 1999-09-21 2002-04-16 Kabushiki Kaisha Toshiba Refrigerator with two evaporators

Also Published As

Publication number Publication date
FR2311344B1 (en) 1981-07-31
DE2620861A1 (en) 1976-11-25
FR2311344A1 (en) 1976-12-10
DE2620861C2 (en) 1985-12-19
CH615313B (en)
CH615313GA3 (en) 1980-01-31
HK48882A (en) 1982-12-03

Similar Documents

Publication Publication Date Title
GB1510040A (en) Electric timepiece
GB1503098A (en) Method of forming electronic circuitry for an electronic watch
GB2009466A (en) Electronic watch movement construction
FR2311344B1 (en)
GB1535292A (en) Electronic watch
JPS53108478A (en) Integrated circuit for timepiece
GB1337814A (en) Electronic timepiece movements
JPS5229259A (en) Electronic clock
GB2055232B (en) Crystal oscillator circuit module for a timepiece
GB1530073A (en) Watch module for a small electronic timepiece
JPS5310272A (en) Ic unit of electronic watch
JPS5349470A (en) Integrated circuit for use in electronic timepiece
GB1499617A (en) Electronic timepiece
JPS5724878A (en) Movement construction of mini pointer indication type electronic wrist watch
JPS5286374A (en) Digital type electronic clock
JPS533155A (en) Electronic watch
GB1519700A (en) Circuit board assembly eg for use in an eletronic timepiece
JPS5328465A (en) Electronic watch
JPS5249069A (en) Electronic watch construction
JPS5345570A (en) Electronic wristwatch
JPS5381163A (en) Electronic watch
JPS55123205A (en) Electronic watch
JPS51147294A (en) Tuning fork type crystal oscillator
JPS5280162A (en) Electronic circuit for watches
JPS52136596A (en) Piezoelectric resonator

Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PE20 Patent expired after termination of 20 years

Effective date: 19960506