GB1469685A - Method and apparatus for soldering - Google Patents

Method and apparatus for soldering

Info

Publication number
GB1469685A
GB1469685A GB4177374A GB4177374A GB1469685A GB 1469685 A GB1469685 A GB 1469685A GB 4177374 A GB4177374 A GB 4177374A GB 4177374 A GB4177374 A GB 4177374A GB 1469685 A GB1469685 A GB 1469685A
Authority
GB
United Kingdom
Prior art keywords
plungers
plate
circuit
soldering
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4177374A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electrovert Ltd
Original Assignee
Electrovert Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electrovert Ltd filed Critical Electrovert Ltd
Priority to GB4177374A priority Critical patent/GB1469685A/en
Publication of GB1469685A publication Critical patent/GB1469685A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/087—Soldering or brazing jigs, fixtures or clamping means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0557—Non-printed masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

1469685 Soldering ELECTROVERT Ltd 25 Sept 1975 [25 Sept 1974] 41773/74 Heading B3R In apparatus for holding a thin flexible plastics circuit 11, e.g. printed, during selective soldering or tinning, the flexible circuit 11 is held between a solder masking plate 12, having holes 14 corresponding to the areas to be soldered, and a pressure applying means, comprising an array of individually sprung plungers 15, so that solder will only contact the circuit 11 through the holes 14. The plate 12 may comprise a stainless steel sheet coated at least on its underside with P.T.F.E. In operation, the circuit 11 is placed between the plungers 15 and the masking plate 12 and pressure is applied to the plungers either by the weight of a plate 16 acting alone on springs 17 or by additional manual force on the plate 16, the plate then being held in position by a quick-release clamp. The separate plungers ensure that the masking plate 12 seals off each area to be soldered so preventing the spread of solder, applied as by dip, drag, cascade or wave soldering apparatus. The plungers are hollow and have vents 15b to allow the escape of any process gases. The individually sprung plungers 15 allow warping in the circuit during soldering to be accommodated.
GB4177374A 1975-09-25 1975-09-25 Method and apparatus for soldering Expired GB1469685A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB4177374A GB1469685A (en) 1975-09-25 1975-09-25 Method and apparatus for soldering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB4177374A GB1469685A (en) 1975-09-25 1975-09-25 Method and apparatus for soldering

Publications (1)

Publication Number Publication Date
GB1469685A true GB1469685A (en) 1977-04-06

Family

ID=10421311

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4177374A Expired GB1469685A (en) 1975-09-25 1975-09-25 Method and apparatus for soldering

Country Status (1)

Country Link
GB (1) GB1469685A (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4506820A (en) * 1983-07-29 1985-03-26 Brucker John P Desoldering device
US5038706A (en) * 1988-05-27 1991-08-13 Teledyne Industries, Inc. Printed circuits board soldering apparatus
WO2007096752A3 (en) * 2006-02-22 2008-01-17 Ses Soc D En Solaire Sa Method of coupling photovoltaic cells and film for implementing it
WO2008068397A1 (en) * 2006-12-06 2008-06-12 Aircelle Brazing method and corresponding device
CN102275025A (en) * 2011-08-01 2011-12-14 东莞生益电子有限公司 Jig for reflux-welding metal substrate
CN103231191A (en) * 2013-04-27 2013-08-07 昆山禾旺电子有限公司 Copper foil tin-soldering jag
CN108067701A (en) * 2017-12-13 2018-05-25 北京华航无线电测量研究所 A kind of pressure-resistant airtight cold plate vacuum brazing universal fixture
CN109865910A (en) * 2019-03-27 2019-06-11 路川金域电子(上海)有限公司 A kind of configurable flexible production line of light modulator assembling
CN110605452A (en) * 2018-09-30 2019-12-24 中航光电科技股份有限公司 Radio frequency contact piece reflow soldering frock
CN111438417A (en) * 2020-03-27 2020-07-24 深圳市大富科技股份有限公司 Dielectric resonator welding clamp and dielectric resonator processing method
CN112620858A (en) * 2020-12-08 2021-04-09 上海无线电设备研究所 Flexible welding tool and welding method for antenna radiation unit array
CN113681106A (en) * 2021-09-06 2021-11-23 天津津航计算技术研究所 Surface-mounted through hole mixed printed board assembly step-by-step selective wave soldering system
CN113714593A (en) * 2021-07-29 2021-11-30 京信通信技术(广州)有限公司 Pressing block assembly, welding tool, bending device and welding method
CN114346345A (en) * 2022-01-17 2022-04-15 合肥聚能电物理高技术开发有限公司 Brazing tool and brazing process for tungsten copper sheet and chromium zirconium copper heat sink
CN114378459A (en) * 2021-12-20 2022-04-22 江苏双梦源精密成型科技有限公司 Sheet metal drilling equipment for intelligent workshop

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4506820A (en) * 1983-07-29 1985-03-26 Brucker John P Desoldering device
US5038706A (en) * 1988-05-27 1991-08-13 Teledyne Industries, Inc. Printed circuits board soldering apparatus
WO2007096752A3 (en) * 2006-02-22 2008-01-17 Ses Soc D En Solaire Sa Method of coupling photovoltaic cells and film for implementing it
WO2008068397A1 (en) * 2006-12-06 2008-06-12 Aircelle Brazing method and corresponding device
FR2909576A1 (en) * 2006-12-06 2008-06-13 Aircelle Sa BRAZING METHOD AND CORRESPONDING DEVICE.
CN101528402B (en) * 2006-12-06 2012-02-22 埃尔塞乐公司 Brazing method and corresponding device
RU2449866C2 (en) * 2006-12-06 2012-05-10 Эрсель Method of soldering and device to this end
US8220698B2 (en) 2006-12-06 2012-07-17 Aircelle Brazing method and corresponding device
CN102275025A (en) * 2011-08-01 2011-12-14 东莞生益电子有限公司 Jig for reflux-welding metal substrate
CN103231191B (en) * 2013-04-27 2015-07-01 昆山禾旺电子有限公司 Copper foil tin-soldering jag
CN103231191A (en) * 2013-04-27 2013-08-07 昆山禾旺电子有限公司 Copper foil tin-soldering jag
CN108067701A (en) * 2017-12-13 2018-05-25 北京华航无线电测量研究所 A kind of pressure-resistant airtight cold plate vacuum brazing universal fixture
CN108067701B (en) * 2017-12-13 2020-07-17 北京华航无线电测量研究所 Pressure-resistant airtight cold plate vacuum brazing universal tool
CN110605452B (en) * 2018-09-30 2021-09-03 中航光电科技股份有限公司 Radio frequency contact piece reflow soldering frock
CN110605452A (en) * 2018-09-30 2019-12-24 中航光电科技股份有限公司 Radio frequency contact piece reflow soldering frock
CN109865910A (en) * 2019-03-27 2019-06-11 路川金域电子(上海)有限公司 A kind of configurable flexible production line of light modulator assembling
CN109865910B (en) * 2019-03-27 2021-04-27 路川金域电子(上海)有限公司 Configurable flexible production line for assembling light modulator
CN111438417A (en) * 2020-03-27 2020-07-24 深圳市大富科技股份有限公司 Dielectric resonator welding clamp and dielectric resonator processing method
CN112620858A (en) * 2020-12-08 2021-04-09 上海无线电设备研究所 Flexible welding tool and welding method for antenna radiation unit array
CN113714593A (en) * 2021-07-29 2021-11-30 京信通信技术(广州)有限公司 Pressing block assembly, welding tool, bending device and welding method
CN113681106A (en) * 2021-09-06 2021-11-23 天津津航计算技术研究所 Surface-mounted through hole mixed printed board assembly step-by-step selective wave soldering system
CN114378459A (en) * 2021-12-20 2022-04-22 江苏双梦源精密成型科技有限公司 Sheet metal drilling equipment for intelligent workshop
CN114346345A (en) * 2022-01-17 2022-04-15 合肥聚能电物理高技术开发有限公司 Brazing tool and brazing process for tungsten copper sheet and chromium zirconium copper heat sink

Similar Documents

Publication Publication Date Title
GB1469685A (en) Method and apparatus for soldering
JPS55128583A (en) Method and apparatus for pretreating substrate and coating membrane
ES411957A1 (en) Process for the application of an adhesive layer in alloy welding
IL59818A0 (en) Method and apparatus for flow coating with suck back control
DE2861869D1 (en) Method and apparatus for aligning flat and thin workpieces
AT369684B (en) MIG WELDING METHOD FOR FORCED PLANE WELDING HIGH ALLOY STEELS AND DEVICE FOR CARRYING OUT THE SAME
JPS549132A (en) Method of welding laminated sheed metals
JPS52101244A (en) Method and apparatus for applying liquid on longsized material
JPS5422203A (en) Method and liquid for correcting nonnwater flat printing plate
JPS55139864A (en) Device for continuously mounting uniform coating on material sheet
JPS5296649A (en) Coating method and apparatus thereof
DK604089D0 (en) PROCEDURE AND APPARATUS FOR ACTIVATING A METAL SURFACE
JPS5229832A (en) Method and apparatus for the coating and wiping of liquid substance
JPS52125007A (en) Apparatus for closely contacting printing form and plate material on printing apparatus
JPS52107076A (en) Process and apparatus for recovering peeled coating erom barrshaped carrier especlally welding electrode
JPS5340306A (en) Ink concentration control method and device for lithographic press
JPS5283244A (en) Preparation of liquid crystal cell
SU642791A1 (en) Device for applying coating onto cathode
JPS5399082A (en) High frequency sputtering apparatus
JPS5243844A (en) Method and apparatus for applying coating material on substrate layer
JPS5274634A (en) Method and apparatus for coating nonn absorbing sheet
JPS5233191A (en) Applying methd of label material to rotatable grinder plate
JPS5791766A (en) Method and apparatus for coating printed circuit board with adhesive
JPS51145270A (en) Method of errosive-printing elaborate pattern on metal plate, semicond uctor, etc.
JPS51129444A (en) An automatic marking apparatus

Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee