GB1434596A - Non-aqueous colloidal polyamic acid electrodeposition compositions - Google Patents
Non-aqueous colloidal polyamic acid electrodeposition compositionsInfo
- Publication number
- GB1434596A GB1434596A GB1682473A GB1682473A GB1434596A GB 1434596 A GB1434596 A GB 1434596A GB 1682473 A GB1682473 A GB 1682473A GB 1682473 A GB1682473 A GB 1682473A GB 1434596 A GB1434596 A GB 1434596A
- Authority
- GB
- United Kingdom
- Prior art keywords
- solvent
- salt
- polyamide
- aqueous
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/1028—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous
- C08G73/1032—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous characterised by the solvent(s) used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0016—Plasticisers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/44—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications
- C09D5/4419—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications with polymers obtained otherwise than by polymerisation reactions only involving carbon-to-carbon unsaturated bonds
- C09D5/4461—Polyamides; Polyimides
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Molecular Biology (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Paints Or Removers (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
Abstract
1434596 Polyamide-acid electrodeposition composition WESTINGHOUSE ELECTRIC CORP 9 April 1973 [19 April 1972] 16824/73 Heading C3R [Also in Division C7] A method of making a non-aqueous, colloidal polyamide-acid electrodeposition composition comprises reacting 1 part (weight) polyamide acid in 29 to 37 parts non-aqueous non-electrolysable organic solvent with 0À8 to 1À2 parts of an imidazole or tertiary amine to form an organic salt and adding the resulting salt solution to 50 to 150 parts of a non-aqueous non-electrolysable organic non-solvent for the salt to provide a colloidal dispersion thereof in the solvent/non- solvent mixture. Finely divided pigments or lubricants may be added to the composition. Numerous suitable aromatic tri- or tetracarboxy compounds and diamines for forming the polyamide acid, tertiary amines, solvents and non-solvents are specified. In specific examples a proprietary solution of polyamideacid in N-methyl pyrrolidone is diluted with dimethyl sulphoxide to the required concentration; triethylamine, 1-methyl imidazole or N,N-dimethyl benzylamine is used to form the salt; and acetone is used as the non-solvent. An 18 wt. per cent solution of a polyamideacid from pyromellitic dianhydride and 3,4<SP>1</SP>- diaminobenzanilide may be used in place of the proprietary solution. The resin is electrodeposited on aluminium, copper, nickel, stainless steel or platinum.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US24539672A | 1972-04-19 | 1972-04-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1434596A true GB1434596A (en) | 1976-05-05 |
Family
ID=22926484
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1682473A Expired GB1434596A (en) | 1972-04-19 | 1973-04-09 | Non-aqueous colloidal polyamic acid electrodeposition compositions |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPS526745B2 (en) |
CA (1) | CA1033091A (en) |
GB (1) | GB1434596A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10465080B2 (en) | 2015-07-02 | 2019-11-05 | Mitsubishi Materials Corporation | Water-dispersed electrodeposition solution for forming insulating film |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2400086A1 (en) * | 1973-01-02 | 1974-07-04 | Gen Electric | FOAMABLE POLYCARBONATE RESIN |
JPH0776440B2 (en) * | 1986-10-29 | 1995-08-16 | 三井東圧化学株式会社 | Metal coating method |
WO2017002666A1 (en) * | 2015-07-02 | 2017-01-05 | 三菱マテリアル株式会社 | Water-dispersed electrodeposition liquid for forming insulating coating film |
-
1973
- 1973-02-16 CA CA163,943A patent/CA1033091A/en not_active Expired
- 1973-04-09 GB GB1682473A patent/GB1434596A/en not_active Expired
- 1973-04-19 JP JP48043761A patent/JPS526745B2/ja not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10465080B2 (en) | 2015-07-02 | 2019-11-05 | Mitsubishi Materials Corporation | Water-dispersed electrodeposition solution for forming insulating film |
Also Published As
Publication number | Publication date |
---|---|
CA1033091A (en) | 1978-06-13 |
JPS4921426A (en) | 1974-02-25 |
JPS526745B2 (en) | 1977-02-24 |
AU5413573A (en) | 1974-10-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |