GB1401724A - Cooled enclosure - Google Patents

Cooled enclosure

Info

Publication number
GB1401724A
GB1401724A GB3229873A GB3229873A GB1401724A GB 1401724 A GB1401724 A GB 1401724A GB 3229873 A GB3229873 A GB 3229873A GB 3229873 A GB3229873 A GB 3229873A GB 1401724 A GB1401724 A GB 1401724A
Authority
GB
United Kingdom
Prior art keywords
chambers
vapour
condensed
baths
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3229873A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Borg Warner Corp
Original Assignee
Borg Warner Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Borg Warner Corp filed Critical Borg Warner Corp
Publication of GB1401724A publication Critical patent/GB1401724A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20936—Liquid coolant with phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
GB3229873A 1972-09-18 1973-07-06 Cooled enclosure Expired GB1401724A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00290028A US3818983A (en) 1972-09-18 1972-09-18 Cooled enclosure

Publications (1)

Publication Number Publication Date
GB1401724A true GB1401724A (en) 1975-07-30

Family

ID=23114231

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3229873A Expired GB1401724A (en) 1972-09-18 1973-07-06 Cooled enclosure

Country Status (8)

Country Link
US (1) US3818983A (enrdf_load_stackoverflow)
JP (1) JPS4970137A (enrdf_load_stackoverflow)
AU (1) AU473754B2 (enrdf_load_stackoverflow)
CA (1) CA990088A (enrdf_load_stackoverflow)
FR (1) FR2200488B1 (enrdf_load_stackoverflow)
GB (1) GB1401724A (enrdf_load_stackoverflow)
IT (1) IT1006068B (enrdf_load_stackoverflow)
ZA (1) ZA734475B (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2389174A (en) * 2002-05-01 2003-12-03 Rolls Royce Plc An apparatus with a plurality of heat exchanges using an evaporating liquid means for cooling a component

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51101252A (ja) * 1975-03-04 1976-09-07 Mitsubishi Electric Corp Futsutoreikyakusochi
US4027728A (en) * 1975-03-31 1977-06-07 Mitsubishi Denki Kabushiki Kaisha Vapor cooling device for semiconductor device
JPS51145043A (en) * 1975-06-06 1976-12-13 Mitsubishi Electric Corp Boiling type refrigeration system
JPS51145042A (en) * 1975-06-06 1976-12-13 Mitsubishi Electric Corp Boiling type refrigeration system
US4084406A (en) * 1976-01-22 1978-04-18 Fedders Corporation Chiller controls
GB1597469A (en) * 1977-12-14 1981-09-09 Jackson P A Cooling of a shelter containing a heat source
DE2837353C2 (de) * 1978-08-26 1986-01-02 Brown, Boveri & Cie Ag, 6800 Mannheim Kühleinrichtung zur Kühlung verlustwärmeerzeugender elektronischer Leistungshalbleiterbauelemente mit einem Kühlmittelkreislauf
FR2446455A1 (fr) * 1979-01-12 1980-08-08 Daikin Ind Ltd Systeme de refroidissement pour local
US4998181A (en) * 1987-12-15 1991-03-05 Texas Instruments Incorporated Coldplate for cooling electronic equipment
AU617957B2 (en) * 1989-10-26 1991-12-05 Mitsubishi Denki Kabushiki Kaisha Boiling and condensing heat transfer type cooler device for power semiconductor switching elements
AU629761B2 (en) * 1989-10-26 1992-10-08 Mitsubishi Denki Kabushiki Kaisha Boiling and condensing heat transfer type cooler device for power semiconductor switching elements
US5285347A (en) * 1990-07-02 1994-02-08 Digital Equipment Corporation Hybird cooling system for electronic components
JP3067399B2 (ja) * 1992-07-03 2000-07-17 株式会社日立製作所 半導体冷却装置
GB9311404D0 (en) * 1993-06-02 1993-07-21 Ovington Limited Apparatus for controlling temperature
US6515383B1 (en) 2000-11-06 2003-02-04 Satcon Technology Corporation Passive, phase-change, stator winding end-turn cooled electric machine
GB0327641D0 (en) * 2003-11-28 2003-12-31 Rolls Royce Plc Control arrangement
US7353662B2 (en) * 2004-12-22 2008-04-08 York International Corporation Medium voltage starter for a chiller unit
US8590329B2 (en) 2004-12-22 2013-11-26 Johnson Controls Technology Company Medium voltage power controller
US8045329B2 (en) * 2009-04-29 2011-10-25 Raytheon Company Thermal dissipation mechanism for an antenna
JP5401419B2 (ja) * 2010-08-31 2014-01-29 株式会社日立製作所 鉄道車両用電力変換装置
CA3021959C (en) 2016-05-11 2019-05-21 Hypertechnologie Ciara Inc Cpu cooling system with direct spray cooling

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB706209A (en) * 1950-11-30 1954-03-24 Thomson Houston Comp Francaise Apparatus for cooling electronic tubes
GB1016186A (en) * 1963-01-10 1966-01-05 Electrical Res Ass Improvements relating to cooling systems for power transformers
US3270250A (en) * 1963-02-06 1966-08-30 Ariel R Davis Liquid vapor cooling of electrical components
JPS4415152Y1 (enrdf_load_stackoverflow) * 1965-09-21 1969-06-30
BE754580A (fr) * 1969-08-08 1971-01-18 Balcke Maschbau Ag Procede pour l'exploitation d'une tour de refrigeration a sec sous des temperatures d'air elevees
US3609991A (en) * 1969-10-13 1971-10-05 Ibm Cooling system having thermally induced circulation
US3718850A (en) * 1970-07-17 1973-02-27 Tokyo Shibaura Electric Co Semiconductor rectifier device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2389174A (en) * 2002-05-01 2003-12-03 Rolls Royce Plc An apparatus with a plurality of heat exchanges using an evaporating liquid means for cooling a component
US6931834B2 (en) 2002-05-01 2005-08-23 Rolls-Royce Plc Cooling systems
GB2389174B (en) * 2002-05-01 2005-10-26 Rolls Royce Plc Cooling systems

Also Published As

Publication number Publication date
FR2200488B1 (enrdf_load_stackoverflow) 1976-10-01
DE2337573A1 (de) 1974-04-04
ZA734475B (en) 1974-07-31
AU473754B2 (en) 1976-07-01
FR2200488A1 (enrdf_load_stackoverflow) 1974-04-19
US3818983A (en) 1974-06-25
CA990088A (en) 1976-06-01
JPS4970137A (enrdf_load_stackoverflow) 1974-07-06
DE2337573B2 (de) 1976-05-13
IT1006068B (it) 1976-09-30
AU5848073A (en) 1975-01-30

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee