GB1352656A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
GB1352656A
GB1352656A GB3728472A GB1352656DA GB1352656A GB 1352656 A GB1352656 A GB 1352656A GB 3728472 A GB3728472 A GB 3728472A GB 1352656D A GB1352656D A GB 1352656DA GB 1352656 A GB1352656 A GB 1352656A
Authority
GB
United Kingdom
Prior art keywords
collar
mounting
rod
anodized
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3728472A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Publication of GB1352656A publication Critical patent/GB1352656A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Waveguides (AREA)

Abstract

1352656 Gunn diode circuits STANDARD TELEPHONES & CABLES Ltd 10 Aug 1972 37284/72 Heading H3T [Also in Division H1] A mounting for a Gunn diode or semi-conductor laser 1 gives two sided cooling for the element. The mounting shown is clamped into a massive, optionally-finned, split copper cooling block (Fig. 2, not shown). The mounting has a casing 5 within which the element is secured, either directly on the base 2 or, as shown, on a pedestal 3 which may be of right cylindrical form or frustoconical. The other electrode of the element 1 is contacted by a gold-plated copper rod, which is initially a sliding fit within a twopart collar consisting of a gold-plated copper sleeve 8 press-fitted into a thin aluminium sleeve 7 which is then anodized on its outer surface 9. The collar is itself shrunk into the casing. In assembly the element is placed between solder preforms (not shown), a solder ring is placed in groove 11, a weight is placed on rod 10 and the assembly is furnace soldered in a hydrogen atmosphere. The anodized collar acts as an inductor. A coaxial connection (13) attached to the copper cooling block (not shown) allows supply of an input bias and output, if optical, is taken directly via aperture 4 or, if microwave, is taken via a coaxial connector having a rod (14) extending through a PTFE collar (15) to meet pedestal 3. Other connection systems, such as triplate microstrip or waveguide, may be used. When the device is operated in the LSA relaxation mode the mounting provides the necessary lumped circuit combination of parallel inductance and parallel resistance to operate in the 3-6GHz range.
GB3728472A 1972-08-10 1972-08-10 Semiconductor device Expired GB1352656A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3728472 1972-08-10

Publications (1)

Publication Number Publication Date
GB1352656A true GB1352656A (en) 1974-05-08

Family

ID=10395228

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3728472A Expired GB1352656A (en) 1972-08-10 1972-08-10 Semiconductor device

Country Status (1)

Country Link
GB (1) GB1352656A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4069498A (en) * 1976-11-03 1978-01-17 International Business Machines Corporation Studded heat exchanger for integrated circuit package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4069498A (en) * 1976-11-03 1978-01-17 International Business Machines Corporation Studded heat exchanger for integrated circuit package

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees