GB1348659A - Thin film crossover structure and method of making it - Google Patents

Thin film crossover structure and method of making it

Info

Publication number
GB1348659A
GB1348659A GB3351771A GB3351771A GB1348659A GB 1348659 A GB1348659 A GB 1348659A GB 3351771 A GB3351771 A GB 3351771A GB 3351771 A GB3351771 A GB 3351771A GB 1348659 A GB1348659 A GB 1348659A
Authority
GB
United Kingdom
Prior art keywords
making
thin film
crossover structure
film crossover
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3351771A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Microsystems International Ltd
Original Assignee
Microsystems International Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microsystems International Ltd filed Critical Microsystems International Ltd
Publication of GB1348659A publication Critical patent/GB1348659A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
GB3351771A 1970-11-02 1971-07-16 Thin film crossover structure and method of making it Expired GB1348659A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA97155 1970-11-02

Publications (1)

Publication Number Publication Date
GB1348659A true GB1348659A (en) 1974-03-20

Family

ID=4087929

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3351771A Expired GB1348659A (en) 1970-11-02 1971-07-16 Thin film crossover structure and method of making it

Country Status (3)

Country Link
CA (1) CA911064A (en)
DE (1) DE2146328A1 (en)
GB (1) GB1348659A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2227887A (en) * 1988-12-24 1990-08-08 Technology Applic Company Limi Making printed circuits
WO2005034598A1 (en) * 2003-09-26 2005-04-14 Medtronic Minimed, Inc. High reliability multilayer circuit substrates and methods for their formation
US7781328B2 (en) 2002-09-27 2010-08-24 Medtronic Minimed, Inc. Multilayer substrate
US8003513B2 (en) 2002-09-27 2011-08-23 Medtronic Minimed, Inc. Multilayer circuit devices and manufacturing methods using electroplated sacrificial structures

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3240425A1 (en) * 1982-11-02 1984-05-03 Telefonbau Und Normalzeit Gmbh, 6000 Frankfurt Miniature wire link for producing connections on assemblies
US5030385A (en) * 1988-03-25 1991-07-09 E. I. Du Pont De Nemours And Company Process of inhibiting corrosion
US5180311A (en) * 1991-01-22 1993-01-19 Hughes Aircraft Company Resilient interconnection bridge
US5283949A (en) * 1992-11-03 1994-02-08 Jurisich Peter L Method of producing a printed circuit board having a conductive pattern thereon
DE19936198A1 (en) * 1999-07-31 2001-02-01 Mannesmann Vdo Ag Circuit board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2227887A (en) * 1988-12-24 1990-08-08 Technology Applic Company Limi Making printed circuits
US7138330B2 (en) 2002-09-27 2006-11-21 Medtronic Minimed, Inc. High reliability multilayer circuit substrates and methods for their formation
US7659194B2 (en) 2002-09-27 2010-02-09 Medtronic Minimed, Inc. High reliability multilayer circuit substrates and methods for their formation
US7781328B2 (en) 2002-09-27 2010-08-24 Medtronic Minimed, Inc. Multilayer substrate
US8003513B2 (en) 2002-09-27 2011-08-23 Medtronic Minimed, Inc. Multilayer circuit devices and manufacturing methods using electroplated sacrificial structures
WO2005034598A1 (en) * 2003-09-26 2005-04-14 Medtronic Minimed, Inc. High reliability multilayer circuit substrates and methods for their formation

Also Published As

Publication number Publication date
CA911064A (en) 1972-09-26
DE2146328A1 (en) 1972-05-10

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees