GB1291970A - Photopolymerisable elements containing hydrophilic colloids and polymerisable monomers for making plate resists - Google Patents

Photopolymerisable elements containing hydrophilic colloids and polymerisable monomers for making plate resists

Info

Publication number
GB1291970A
GB1291970A GB1959172A GB1959172A GB1291970A GB 1291970 A GB1291970 A GB 1291970A GB 1959172 A GB1959172 A GB 1959172A GB 1959172 A GB1959172 A GB 1959172A GB 1291970 A GB1291970 A GB 1291970A
Authority
GB
United Kingdom
Prior art keywords
etching
phenanthraquinone
gelatine
oct
elements containing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1959172A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of GB1291970A publication Critical patent/GB1291970A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F291/00—Macromolecular compounds obtained by polymerising monomers on to macromolecular compounds according to more than one of the groups C08F251/00 - C08F289/00
    • C08F291/18—Macromolecular compounds obtained by polymerising monomers on to macromolecular compounds according to more than one of the groups C08F251/00 - C08F289/00 on to irradiated or oxidised macromolecules
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0537—Transfer of pre-fabricated insulating pattern

Abstract

1291970 Photopolymerization E I DU PONT DE NEMOURS & CO 8 Oct 1969 [9 Oct 1968 7 Aug 1969] 19591/72 Divided out of 1290727 Heading C3P [Also in Division G2] A photopolymerizable element comprises an etchable support bearing a photopolymerizable layer comprising a hydrophilic macromolecular organic polymer dispersion medium including a dispersed phase containing as the sole imageforming system ; (1) at least one addition polymerizable ethylenically unsaturated monomer at boiling point above 100‹ C. at normal atmospheric pressure, and (2) an organic photoinitiator system, activatable by actinic light, in an amount of from 0À01 to 20À0% by weight of the total solids in said dispersion. Preferred dispersing media are aqueous solutions or dispersions of gelatine or polyvinyl alcohol; pre ferred monomers are pentaerythritol triacrylate and/or trimethylolpropane triacrylate, and preferred initiators are 9,10-phenanthraquinone and/or 4,4<SP>1</SP> - bis - dimethylaminobenzophenone, or a 2-(o-chlorophenyl)-4,5-diphenylimidazolyl dimer and certain dyes. Resist images are formed by imagewise exposing the element, etching the etchable surface, and washing to remove residual etching solution and the resist. In this way, printed circuits may be produced. An example describes the exposure and etching of a copper plate coated with a composition in which the hydrophilic polymer is gelatine, the monomer is diacetone acrylamide mixed with trimethylolpropane triacrylate and the initiator is 9,10-phenanthraquinone and 4,4<SP>1</SP>-methenylbis - [1 - (p - sulfophenyl) - 3 - methylpyrazolone- 5].
GB1959172A 1968-10-09 1969-10-08 Photopolymerisable elements containing hydrophilic colloids and polymerisable monomers for making plate resists Expired GB1291970A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US76632968A 1968-10-09 1968-10-09
US84929769A 1969-08-07 1969-08-07
GB4953969 1969-09-08

Publications (1)

Publication Number Publication Date
GB1291970A true GB1291970A (en) 1972-10-04

Family

ID=27260093

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1959172A Expired GB1291970A (en) 1968-10-09 1969-10-08 Photopolymerisable elements containing hydrophilic colloids and polymerisable monomers for making plate resists

Country Status (1)

Country Link
GB (1) GB1291970A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5045429A (en) * 1985-08-07 1991-09-03 Hoechst Aktiengesellschaft Light-sensitive photopolymerizable and diazonium resin containing composition and recording material including reaction product of anhydride with carboxylic acid and vinyl alcohol

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5045429A (en) * 1985-08-07 1991-09-03 Hoechst Aktiengesellschaft Light-sensitive photopolymerizable and diazonium resin containing composition and recording material including reaction product of anhydride with carboxylic acid and vinyl alcohol

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Legal Events

Date Code Title Description
PS Patent sealed
PE20 Patent expired after termination of 20 years