GB1266378A - - Google Patents

Abstract

1,266,378. Photosensitive polymers and polymeric compositions. GENERAL ELECTRIC CO. 1 Oct., 1969 [1 Oct., 1968], No. 48327/69. Addition to 1,149,697. Heading C3R. [Also in Division G2] A photosensitive material comprises (1) a mixture of (a) an acetylenic polymer of formula where m is 0 or 1, n is at least 10 and R is an arylene, alkyl substituted arylene, haloarylene, alkyl substituted haloarylene, or, when m is 0, R may be alkylene or, when m is 1, R may be -R<SP>1</SP>-X-R<SP>1</SP>- where R<SP>1</SP> is phenylene, halophenylene or alkyl substituted phenylene and X is where R<SP>11</SP> is hydrogen or alkyl, or (b) an acetylenic polymer of formula where n is as above and R<SP>a</SP> is a radical of formula where R<SP>b</SP> is arylene, R<SP>c</SP> is a trivalent aromatic radical and R<SP>d</SP> is alkyl or aryl, or (c) a copolymer having at least 10 repeating units of both (a) and (b), and a photopolymerization sensitizing agent which absorbs actinic radiation and accelerates the cross-linking of the polymer and which is other than a ketone having an aryl substituent directly attached to the carbonyl group, or the material comprises (2) a polymer having at least 10 units, some of the units having the formula and other units the formula where R<SP>f</SP> is as defined above for R when m is 1 and R<SP>g</SP> is alkylene or p-arylene. Suitable photosensitizers mentioned are p-diethynyl benzene, hemoporphyrin, tetraiodofluorescein, Rose Bengal dye, dibenzylidenecyclohexanone, dimethyldiphenyldiphenoquinone, p-diiodobenzene, p-benzoquinone, chalcone, terephthalaldehyde, maleic anhydride, m-dibenzoylbenzene, diphenyl-distyryl-diphenoquinone, dimethyldistyryl-diphenoquinone, chloranil, anthracene, methylene blue, azobenzene, m-dinitrobenzene, m-benzenedisulphonylazide, diacetyl, eosin B, ethyl butyl ketene, acridine yellow, crystal violet and nitrobenzene. The materials may be dissolved in suitable solvents and the solutions used to form films on substrates, the films being exposed to ultraviolet light while certain portions of the film are masked, the unexposed portions subsequently being dissolved leaving the exposed areas which may be used as a resist e.g. in etching or plating operations on the substrate, or the polymer remaining may be thermally decomposed to carbon to provide electrically conductive circuits. Examples are given.