GB1197272A - Improvements relating to Semiconductor Circuit Assemblies - Google Patents

Improvements relating to Semiconductor Circuit Assemblies

Info

Publication number
GB1197272A
GB1197272A GB409068A GB409068A GB1197272A GB 1197272 A GB1197272 A GB 1197272A GB 409068 A GB409068 A GB 409068A GB 409068 A GB409068 A GB 409068A GB 1197272 A GB1197272 A GB 1197272A
Authority
GB
United Kingdom
Prior art keywords
gold
pillars
wafer
pedestals
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB409068A
Other languages
English (en)
Inventor
John Tudor Roberts
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ferranti International PLC
Original Assignee
Ferranti PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ferranti PLC filed Critical Ferranti PLC
Priority to GB409068A priority Critical patent/GB1197272A/en
Priority to NL6900980A priority patent/NL145096B/xx
Priority to DE19691903433 priority patent/DE1903433A1/de
Publication of GB1197272A publication Critical patent/GB1197272A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
GB409068A 1968-01-26 1968-01-26 Improvements relating to Semiconductor Circuit Assemblies Expired GB1197272A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB409068A GB1197272A (en) 1968-01-26 1968-01-26 Improvements relating to Semiconductor Circuit Assemblies
NL6900980A NL145096B (nl) 1968-01-26 1969-01-21 Werkwijze voor het vervaardigen van een halfgeleiderstelsel en het met deze werkwijze verkregen halfgeleiderstelsel.
DE19691903433 DE1903433A1 (de) 1968-01-26 1969-01-24 Halbleiterschaltkreisanordnung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB409068A GB1197272A (en) 1968-01-26 1968-01-26 Improvements relating to Semiconductor Circuit Assemblies

Publications (1)

Publication Number Publication Date
GB1197272A true GB1197272A (en) 1970-07-01

Family

ID=9770554

Family Applications (1)

Application Number Title Priority Date Filing Date
GB409068A Expired GB1197272A (en) 1968-01-26 1968-01-26 Improvements relating to Semiconductor Circuit Assemblies

Country Status (3)

Country Link
DE (1) DE1903433A1 (de)
GB (1) GB1197272A (de)
NL (1) NL145096B (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5323035A (en) * 1992-10-13 1994-06-21 Glenn Leedy Interconnection structure for integrated circuits and method for making same
US5245750A (en) * 1992-02-28 1993-09-21 Hughes Aircraft Company Method of connecting a spaced ic chip to a conductor and the article thereby obtained

Also Published As

Publication number Publication date
NL145096B (nl) 1975-02-17
DE1903433A1 (de) 1969-08-28
NL6900980A (de) 1969-07-29

Similar Documents

Publication Publication Date Title
US4182781A (en) Low cost method for forming elevated metal bumps on integrated circuit bodies employing an aluminum/palladium metallization base for electroless plating
US4442967A (en) Method of providing raised electrical contacts on electronic microcircuits
US3952404A (en) Beam lead formation method
US3761309A (en) Ctor components into housings method of producing soft solderable contacts for installing semicondu
EP1020903B1 (de) Leiterrahmen für eine Halbleiteranordnung und dessen Herstellungsverfahren
US3760238A (en) Fabrication of beam leads
US3680206A (en) Assemblies of semiconductor devices having mounting pillars as circuit connections
US3993515A (en) Method of forming raised electrical contacts on a semiconductor device
US3501681A (en) Face bonding of semiconductor devices
US3462349A (en) Method of forming metal contacts on electrical components
JP4058619B2 (ja) 半導体ウエハ
GB1373008A (en) Electronic components
US4485553A (en) Method for manufacturing an integrated circuit device
GB1053069A (de)
US4197631A (en) Method of manufacturing semiconductor components
US3567506A (en) Method for providing a planar transistor with heat-dissipating top base and emitter contacts
GB1240977A (en) Improvements in or relating to semiconductor components
US3408271A (en) Electrolytic plating of metal bump contacts to semiconductor devices upon nonconductive substrates
US4596069A (en) Three dimensional processing for monolithic IMPATTs
US3669734A (en) Method of making electrical connections to a glass-encapsulated semiconductor device
JPH0239097B2 (de)
KR20000047626A (ko) 반도체 장치의 제조 방법
GB1197272A (en) Improvements relating to Semiconductor Circuit Assemblies
GB1259602A (de)
US3801477A (en) Method of depositing electrode leads

Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee