GB1196054A - Apparatus for the Mechanical Tin Soldering of Metallic Surfaces. - Google Patents

Apparatus for the Mechanical Tin Soldering of Metallic Surfaces.

Info

Publication number
GB1196054A
GB1196054A GB14754/68A GB1475468A GB1196054A GB 1196054 A GB1196054 A GB 1196054A GB 14754/68 A GB14754/68 A GB 14754/68A GB 1475468 A GB1475468 A GB 1475468A GB 1196054 A GB1196054 A GB 1196054A
Authority
GB
United Kingdom
Prior art keywords
roller
solder
metallic surfaces
laubmeyer
smits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB14754/68A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zeva Eliktrizitats Ges Smits &
Original Assignee
Zeva Eliktrizitats Ges Smits &
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zeva Eliktrizitats Ges Smits & filed Critical Zeva Eliktrizitats Ges Smits &
Priority to GB14754/68A priority Critical patent/GB1196054A/en
Priority to DE19691911809 priority patent/DE1911809A1/en
Priority to DE19702009233 priority patent/DE2009233A1/en
Publication of GB1196054A publication Critical patent/GB1196054A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0692—Solder baths with intermediary means for bringing solder on workpiece, e.g. rollers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
    • C23C2/08—Tin or alloys based thereon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1394—Covering open PTHs, e.g. by dry film resist or by metal disc
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement

Abstract

1,196,054. Apparatus for applying tin solder. G. LAUBMEYER and M.SMITS [trading as ZEVA ELEKTRIZIT TS GESELLSCHAFT SMITS & LAUBMEYER K.G. March 27, 1968, No.14754/68 Heading C7F. Apparatus for applying tin solder to a fluxed metal surface 6 comprises a rotating grooved roller 1 dipping into solder bath 4 and co-operating with a synchronously driven pressure roller 2. The grooved roller transfers liquid solder from bath 4 on to the metal surface 6 e. g. a printed circuit which is rolled between 1 and 2. The grooves in the roller may be coaxial with the roller or up to right angles to the roller axis and are V-shaped.
GB14754/68A 1968-03-27 1968-03-27 Apparatus for the Mechanical Tin Soldering of Metallic Surfaces. Expired GB1196054A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB14754/68A GB1196054A (en) 1968-03-27 1968-03-27 Apparatus for the Mechanical Tin Soldering of Metallic Surfaces.
DE19691911809 DE1911809A1 (en) 1968-03-27 1969-03-08 Process for the mechanical thick tinning of metallic surfaces, especially in the manufacture of printed circuits
DE19702009233 DE2009233A1 (en) 1968-03-27 1970-02-27 Tinning of printed circuit plates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB14754/68A GB1196054A (en) 1968-03-27 1968-03-27 Apparatus for the Mechanical Tin Soldering of Metallic Surfaces.

Publications (1)

Publication Number Publication Date
GB1196054A true GB1196054A (en) 1970-06-24

Family

ID=10046908

Family Applications (1)

Application Number Title Priority Date Filing Date
GB14754/68A Expired GB1196054A (en) 1968-03-27 1968-03-27 Apparatus for the Mechanical Tin Soldering of Metallic Surfaces.

Country Status (1)

Country Link
GB (1) GB1196054A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2136764A (en) * 1983-03-21 1984-09-26 American Flange & Mfg A container closure assembly
CN102581422A (en) * 2012-03-15 2012-07-18 青岛琴岛控制器有限公司 Rolling scaling powder device
CN107858725A (en) * 2017-12-12 2018-03-30 铜陵有色金属集团铜冠建筑安装股份有限公司 Copper bus-bar interval tinning stack

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2136764A (en) * 1983-03-21 1984-09-26 American Flange & Mfg A container closure assembly
CN102581422A (en) * 2012-03-15 2012-07-18 青岛琴岛控制器有限公司 Rolling scaling powder device
CN107858725A (en) * 2017-12-12 2018-03-30 铜陵有色金属集团铜冠建筑安装股份有限公司 Copper bus-bar interval tinning stack
CN107858725B (en) * 2017-12-12 2023-10-10 铜陵有色金属集团铜冠建筑安装股份有限公司 Copper busbar interval tinning device

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees