GB1195567A - Light Weight Printed Circuit Boards and method of making same - Google Patents
Light Weight Printed Circuit Boards and method of making sameInfo
- Publication number
- GB1195567A GB1195567A GB3261467A GB3261467A GB1195567A GB 1195567 A GB1195567 A GB 1195567A GB 3261467 A GB3261467 A GB 3261467A GB 3261467 A GB3261467 A GB 3261467A GB 1195567 A GB1195567 A GB 1195567A
- Authority
- GB
- United Kingdom
- Prior art keywords
- printed circuit
- july
- circuit boards
- light weight
- making same
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08C—TREATMENT OR CHEMICAL MODIFICATION OF RUBBERS
- C08C19/00—Chemical modification of rubber
- C08C19/30—Addition of a reagent which reacts with a hetero atom or a group containing hetero atoms of the macromolecule
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0245—Flakes, flat particles or lamellar particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0278—Polymeric fibers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0284—Paper, e.g. as reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0293—Non-woven fibrous reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2045—Protection against vibrations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Laminated Bodies (AREA)
Abstract
1,195,567. Boards for printed circuits. TRW Inc. 14 July, 1967 [21 July, 1966], No. 32614/67. Heading C3P. [Also in Division H1] A printed circuit board comprises a thermoset resin formed from a polymeric mixture containing a polyfunctional polydiene prepolymer having mainly pendant vinyl groups on alternate carbon atoms of an elongate carbon chain, a polyfimctional organic chain extender capable of reacting with the functional groups on the polydiene, and a peroxide free radical initiator for promoting cyclization of the pendant vinyl groups and cross-linking of adjacent chains. The resins are preferably OH-terminated poly- 1,2-butadienes reacted with organic diisoeyanates and ditertiary butyl peroxide.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US56672466A | 1966-07-21 | 1966-07-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1195567A true GB1195567A (en) | 1970-06-17 |
Family
ID=24264110
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB3261467A Expired GB1195567A (en) | 1966-07-21 | 1967-07-14 | Light Weight Printed Circuit Boards and method of making same |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE1690285B1 (en) |
GB (1) | GB1195567A (en) |
NL (2) | NL6710005A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0490211A2 (en) * | 1990-12-07 | 1992-06-17 | International Business Machines Corporation | Electronic circuit packages with tear resistant organic cores |
EP0707038A1 (en) * | 1994-10-13 | 1996-04-17 | Rogers Corporation | Polybutadiene and polyisopropene based thermosetting compositions and method of manufacture thereof |
US5858887A (en) * | 1994-10-13 | 1999-01-12 | World Properties, Inc. | Single resin polybutadiene and polyisoprene thermosetting compositions and method of manufacture thereof |
US6048807A (en) * | 1998-08-12 | 2000-04-11 | World Properties, Inc. | Polybutadiene and polyisoprene based thermosetting compositions and method of manufacture |
US6071836A (en) * | 1994-10-13 | 2000-06-06 | World Properties, Inc. | Polybutadiene and polyisoprene thermosetting compositions and method of manufacture thereof |
US6291374B1 (en) | 1994-10-13 | 2001-09-18 | World Properties, Inc. | Polybutadiene and polyisoprene based thermosetting compositions and method of manufacture |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3052823A (en) * | 1958-06-12 | 1962-09-04 | Rogers Corp | Printed circuit structure and method of making the same |
US3134753A (en) * | 1958-06-24 | 1964-05-26 | Gen Electric | Oxidation of aryloxy-substituted phenols |
-
0
- NL NL135413D patent/NL135413C/xx active
-
1967
- 1967-07-13 DE DE19671690285 patent/DE1690285B1/en active Pending
- 1967-07-14 GB GB3261467A patent/GB1195567A/en not_active Expired
- 1967-07-19 NL NL6710005A patent/NL6710005A/xx unknown
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0490211A2 (en) * | 1990-12-07 | 1992-06-17 | International Business Machines Corporation | Electronic circuit packages with tear resistant organic cores |
EP0490211A3 (en) * | 1990-12-07 | 1992-12-23 | International Business Machines Corporation | Electronic circuit packages with tear resistant organic cores |
EP0707038A1 (en) * | 1994-10-13 | 1996-04-17 | Rogers Corporation | Polybutadiene and polyisopropene based thermosetting compositions and method of manufacture thereof |
US5571609A (en) * | 1994-10-13 | 1996-11-05 | Rogers Corporation | Polybutadiene and polyisoprene based thermosetting compositions and method of manufacture thereof |
US5858887A (en) * | 1994-10-13 | 1999-01-12 | World Properties, Inc. | Single resin polybutadiene and polyisoprene thermosetting compositions and method of manufacture thereof |
US5972811A (en) * | 1994-10-13 | 1999-10-26 | World Properties, Inc. | Polybutadiene and polyisoprene thermosetting compositions and method of manufacture thereof |
US6071836A (en) * | 1994-10-13 | 2000-06-06 | World Properties, Inc. | Polybutadiene and polyisoprene thermosetting compositions and method of manufacture thereof |
US6291374B1 (en) | 1994-10-13 | 2001-09-18 | World Properties, Inc. | Polybutadiene and polyisoprene based thermosetting compositions and method of manufacture |
US6048807A (en) * | 1998-08-12 | 2000-04-11 | World Properties, Inc. | Polybutadiene and polyisoprene based thermosetting compositions and method of manufacture |
Also Published As
Publication number | Publication date |
---|---|
DE1690285B1 (en) | 1971-05-13 |
NL135413C (en) | |
NL6710005A (en) | 1968-01-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
694A | Case decided by the comptroller (rule 94(3)/1968) | ||
PS | Patent sealed | ||
PLNP | Patent lapsed through nonpayment of renewal fees |