GB1186558A - Improvements in Metallization of Insulating Subtrates - Google Patents

Improvements in Metallization of Insulating Subtrates

Info

Publication number
GB1186558A
GB1186558A GB2982467A GB2982467A GB1186558A GB 1186558 A GB1186558 A GB 1186558A GB 2982467 A GB2982467 A GB 2982467A GB 2982467 A GB2982467 A GB 2982467A GB 1186558 A GB1186558 A GB 1186558A
Authority
GB
United Kingdom
Prior art keywords
june
phenolic resin
epoxy
subtrates
metallization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2982467A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of GB1186558A publication Critical patent/GB1186558A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0236—Plating catalyst as filler in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Chemically Coating (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

1,186,558. Epoxy and phenolic resin compositions. PHOTOCIRCUITS CORP. 28 June, 1967 [28 June, 1966], No. 29824/67. Headings C3B and C3R. [Also in Divisions C7 and H1] A catalytic adhesive for use in forming a printed circuit by electroless deposition comprises (g./1.) ethylene glycol monoethyl ether acetate 600, epoxy resin 109, acrylonitrile butadiene copolymer rubber 204, phenolic resin 60, silicon dioxide 50, wetting agent 17À5 mixed with an equal part by weight of a solution of any one of palladium, cupric or auric chloride or silver nitrate in N-methyl-2-pyrrolidone.
GB2982467A 1966-06-28 1967-06-28 Improvements in Metallization of Insulating Subtrates Expired GB1186558A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US56112366A 1966-06-28 1966-06-28

Publications (1)

Publication Number Publication Date
GB1186558A true GB1186558A (en) 1970-04-02

Family

ID=24240722

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2982467A Expired GB1186558A (en) 1966-06-28 1967-06-28 Improvements in Metallization of Insulating Subtrates

Country Status (8)

Country Link
JP (3) JPS5110329B1 (en)
AT (2) AT310843B (en)
CH (1) CH504830A (en)
DE (1) DE1665374B1 (en)
ES (1) ES342451A1 (en)
FR (1) FR1605382A (en)
GB (1) GB1186558A (en)
NL (1) NL162816C (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5026022B1 (en) * 1970-11-16 1975-08-28
GB2188194A (en) * 1986-03-21 1987-09-23 Plessey Co Plc Carrier for high frequency integrated circuits
GB2200122A (en) * 1987-01-14 1988-07-27 Kollmorgen Corp Bonding compositions for printed circuit boards
US4767665A (en) * 1985-09-16 1988-08-30 Seeger Richard E Article formed by electroless plating
EP3652359A4 (en) * 2017-07-10 2021-04-14 Catlam LLC Semi-additive process for printed circuit boards

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2001647A1 (en) * 1968-02-07 1969-09-26 Photocircuits Corp
JPS5914882U (en) * 1982-07-19 1984-01-28 川上　規久雄 drainage device
JPS60190403U (en) * 1984-05-30 1985-12-17 川崎製鉄株式会社 Roll cooling device
JPH0748583B2 (en) * 1989-04-03 1995-05-24 喜平 大津 Method for manufacturing electrical inspection jig board for high-density printed wiring board
WO2000015015A1 (en) 1998-09-03 2000-03-16 Ibiden Co., Ltd. Multilayer printed wiring board and method for manufacturing the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB938365A (en) * 1959-01-08 1963-10-02 Photocircuits Corp Method of making printed circuits
US3143484A (en) * 1959-12-29 1964-08-04 Gen Electric Method of making plated circuit boards
US3171756A (en) * 1961-05-04 1965-03-02 Ibm Method of making a printed circuit and base therefor

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5026022B1 (en) * 1970-11-16 1975-08-28
US4767665A (en) * 1985-09-16 1988-08-30 Seeger Richard E Article formed by electroless plating
GB2188194A (en) * 1986-03-21 1987-09-23 Plessey Co Plc Carrier for high frequency integrated circuits
GB2200122A (en) * 1987-01-14 1988-07-27 Kollmorgen Corp Bonding compositions for printed circuit boards
DE3800891A1 (en) * 1987-01-14 1988-07-28 Kollmorgen Corp ADHESIVE MEDIUM MIXTURE FOR THE PRODUCTION OF CIRCUIT BOARDS BY THE ADDITIVE PROCESS
GB2200122B (en) * 1987-01-14 1990-10-17 Kollmorgen Corp Bonding compositions for the manufacture of additive printed wiring boards and articles made with the bonding composition
EP3652359A4 (en) * 2017-07-10 2021-04-14 Catlam LLC Semi-additive process for printed circuit boards

Also Published As

Publication number Publication date
JPS5110329B1 (en) 1976-04-03
NL162816C (en) 1980-06-16
FR1605382A (en) 1975-02-28
JPS5031940B1 (en) 1975-10-16
JPS5746679B1 (en) 1982-10-05
NL162816B (en) 1980-01-15
CH504830A (en) 1971-03-15
AT310843B (en) 1973-10-25
NL6709035A (en) 1967-12-29
ES342451A1 (en) 1968-07-16
AT314010B (en) 1974-03-11
DE1665374B1 (en) 1971-09-09

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Legal Events

Date Code Title Description
PS Patent sealed
PE20 Patent expired after termination of 20 years