GB1172940A - Improvements in and relating to a Semiconductor Arrangement - Google Patents

Improvements in and relating to a Semiconductor Arrangement

Info

Publication number
GB1172940A
GB1172940A GB4959868A GB4959868A GB1172940A GB 1172940 A GB1172940 A GB 1172940A GB 4959868 A GB4959868 A GB 4959868A GB 4959868 A GB4959868 A GB 4959868A GB 1172940 A GB1172940 A GB 1172940A
Authority
GB
United Kingdom
Prior art keywords
relating
oct
semiconductor arrangement
semi
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4959868A
Inventor
Eduard Keller
Otto Scharli
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Switzerland
Original Assignee
BBC Brown Boveri AG Switzerland
Brown Boveri und Cie AG Switzerland
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC Brown Boveri AG Switzerland, Brown Boveri und Cie AG Switzerland filed Critical BBC Brown Boveri AG Switzerland
Publication of GB1172940A publication Critical patent/GB1172940A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/074Stacked arrangements of non-apertured devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12043Photo diode
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Die Bonding (AREA)

Abstract

1,172,940. Semi-conductor device. BROWN, BOVERI & CO. Ltd. 18 Oct., 1968 [20 Oct., 1967], No. 49598/68. Heading H1K. An over-voltage protector has two semiconductor diodes 3 in series opposition and held against the end walls 2 of their container by spring washers 7 acting on thrust discs 6. Tinfoil is provided between each disc and its associated semi-conductor wafer and between each wafer and the associated end wall.
GB4959868A 1967-10-20 1968-10-18 Improvements in and relating to a Semiconductor Arrangement Expired GB1172940A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1473967A CH465064A (en) 1967-10-20 1967-10-20 Arrangement with several semiconductor diodes in one housing

Publications (1)

Publication Number Publication Date
GB1172940A true GB1172940A (en) 1969-12-03

Family

ID=4403448

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4959868A Expired GB1172940A (en) 1967-10-20 1968-10-18 Improvements in and relating to a Semiconductor Arrangement

Country Status (6)

Country Link
CH (1) CH465064A (en)
DE (1) DE1992603U (en)
FR (1) FR1587132A (en)
GB (1) GB1172940A (en)
NL (1) NL159233B (en)
SE (1) SE351520B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH533362A (en) * 1971-06-25 1973-01-31 Bbc Brown Boveri & Cie Semiconductor component
JPS6194362A (en) * 1984-10-15 1986-05-13 Mitsubishi Electric Corp Thyristor device
US4939619A (en) * 1987-01-26 1990-07-03 Northern Telecom Limited Packaged solid-state surge protector

Also Published As

Publication number Publication date
DE1992603U (en) 1968-08-29
SE351520B (en) 1972-11-27
NL6814894A (en) 1969-04-22
FR1587132A (en) 1970-03-13
NL159233B (en) 1979-01-15
CH465064A (en) 1968-11-15

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Legal Events

Date Code Title Description
PS Patent sealed
746 Register noted 'licences of right' (sect. 46/1977)
PCNP Patent ceased through non-payment of renewal fee