GB1146273A - Method for the preparation of semiconductor monocrystalline or polycrystalline layers - Google Patents
Method for the preparation of semiconductor monocrystalline or polycrystalline layersInfo
- Publication number
- GB1146273A GB1146273A GB1335666A GB1335666A GB1146273A GB 1146273 A GB1146273 A GB 1146273A GB 1335666 A GB1335666 A GB 1335666A GB 1335666 A GB1335666 A GB 1335666A GB 1146273 A GB1146273 A GB 1146273A
- Authority
- GB
- United Kingdom
- Prior art keywords
- silicon
- reaction
- zone
- gas
- reaction gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/14—Feed and outlet means for the gases; Modifying the flow of the reactive gases
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/02—Silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4584—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally the substrate being rotated
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
1,146,273. Semi-conductor crystal layers. WACKER-CHEMIE G.m.b.H. 25 March, 1966 [25 March, 1965], No. 13356/66. Heading C1A. Monocrystalline or polycrystalline silicon layers are deposited on to a heated silicon subtrate, which may, if desired, have been previously polished by etching, by the reduction or thermal decomposition of a halogen and/or hydrogen compound of silicon, which deposition reaction is carried out in a reaction vessel in a zone of substantially static reaction gas, movement of gas into or out of the zone being effected solely by diffusion and/or random turbulences that do not constitute a directional gas stream. In a reaction chamber 1, a rotatable rod 7 mounted in silicon carbide bearing 8 and carrying a disc-shaped substrate carrier of silicon 5, is rotated by means of magnet 12 and socket 11, and held in position by rod 10. Heating is provided by high-frequency coil 14, and as the polished silicon substrates 13 are slowly rotated, reaction gas passes into the top of the vessel 1 at 3 and out at 4, so that a zone of substantially static reaction gas is maintained around the substrates. Alternatively, the chamber may be filled with the appropriate reaction gas, and tubes 3 and 4 sealed whilst the reaction takes place.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE1965W0038836 DE1239281B (en) | 1965-03-25 | 1965-03-25 | Process for the production of mono- or polycrystalline silicon layers |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1146273A true GB1146273A (en) | 1969-03-26 |
Family
ID=7601910
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1335666A Expired GB1146273A (en) | 1965-03-25 | 1966-03-25 | Method for the preparation of semiconductor monocrystalline or polycrystalline layers |
Country Status (3)
Country | Link |
---|---|
BE (1) | BE678371A (en) |
DE (1) | DE1239281B (en) |
GB (1) | GB1146273A (en) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1159407B (en) * | 1962-08-29 | 1963-12-19 | Bbc Brown Boveri & Cie | Process for the oriented crystal deposition of silicon on a silicon support |
-
1965
- 1965-03-25 DE DE1965W0038836 patent/DE1239281B/en active Pending
-
1966
- 1966-03-24 BE BE678371D patent/BE678371A/xx unknown
- 1966-03-25 GB GB1335666A patent/GB1146273A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
DE1239281B (en) | 1967-04-27 |
BE678371A (en) | 1966-09-26 |
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