GB1117535A - Soldering electrical components to substrates - Google Patents

Soldering electrical components to substrates

Info

Publication number
GB1117535A
GB1117535A GB3653466A GB3653466A GB1117535A GB 1117535 A GB1117535 A GB 1117535A GB 3653466 A GB3653466 A GB 3653466A GB 3653466 A GB3653466 A GB 3653466A GB 1117535 A GB1117535 A GB 1117535A
Authority
GB
United Kingdom
Prior art keywords
tool
substrate
pillar
support
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3653466A
Inventor
Brian Herbert Shaw
Richard Patrick Caine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB3653466A priority Critical patent/GB1117535A/en
Publication of GB1117535A publication Critical patent/GB1117535A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/759—Means for monitoring the connection process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

1,117,535. Soldering. STANDARD TELEPHONES & CABLES Ltd. 16 Aug., 1966, No. 36534/66. Heading B3R. Apparatus for soldering a component having solder coated electrodes to metallized bands on a substrate comprises a support 10 for the substrate, an electrically heatable tool to hold the electrodes in contact with the substrate and to apply heat by conduction to the electrodes to melt the solder thereon, means 25 to apply a force to the tool to urge it into contact with the component, temperature sensing means in thermally conductive contact with the tool and an electrical power supply controlled by the sensing means. A platform 6 supports a holder 2, having a flux bottle 4 and dishes 1 for semiconductors dies having solder coated electrodes, on a pillar 5 and supports arm rests 7, 8 by ball and-socket joints 8. A substrate support 10 consists of two relatively rotatable parts separated by a P.T.F.E. washer and is mounted movably on another pillar and a further pillar 15 on the platform carries a soldering tool assembly 16 and a microscope assembly 17. The tool assembly comprises an arm 20 clamped to the pillar 15 which carries a tool by means of leaf springs 21. The tool comprises large area current supply members bridged by a heating member of small area which is ground flat to contact the back face of the semi-conductor die and to which is bonded a thermocouple to control the current supply. A coil spring 25 operated by a lever 26 urges the tool towards the support 10. In operation with the die to be bonded in position on a substrate the tool is lowered to apply a load to the die and the power supply is energized to pass a heavy current through the heating member. The temperature is maintained by the thermocouple control and then power is cut off and the bond cools. The substrate may be pre-heated by a separate heater in the support 10.
GB3653466A 1966-08-16 1966-08-16 Soldering electrical components to substrates Expired GB1117535A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB3653466A GB1117535A (en) 1966-08-16 1966-08-16 Soldering electrical components to substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3653466A GB1117535A (en) 1966-08-16 1966-08-16 Soldering electrical components to substrates

Publications (1)

Publication Number Publication Date
GB1117535A true GB1117535A (en) 1968-06-19

Family

ID=10389034

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3653466A Expired GB1117535A (en) 1966-08-16 1966-08-16 Soldering electrical components to substrates

Country Status (1)

Country Link
GB (1) GB1117535A (en)

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