GB1074861A - Improvements in tin-lead base solders - Google Patents

Improvements in tin-lead base solders

Info

Publication number
GB1074861A
GB1074861A GB446565A GB446565A GB1074861A GB 1074861 A GB1074861 A GB 1074861A GB 446565 A GB446565 A GB 446565A GB 446565 A GB446565 A GB 446565A GB 1074861 A GB1074861 A GB 1074861A
Authority
GB
United Kingdom
Prior art keywords
tin
lead base
base solders
solders
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB446565A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PETER SIEGFRIED MUETZEL
Original Assignee
PETER SIEGFRIED MUETZEL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PETER SIEGFRIED MUETZEL filed Critical PETER SIEGFRIED MUETZEL
Priority to GB446565A priority Critical patent/GB1074861A/en
Publication of GB1074861A publication Critical patent/GB1074861A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268—Pb as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A wiping solder consists of .Sn 1.- 35% .Te and/or.Se - 0.5% ..Pb the remainder The alloy may also include 0.02 - 0.5% Cu and known amounts of Ag, Cd, Hg, In or Bi.
GB446565A 1965-02-02 1965-02-02 Improvements in tin-lead base solders Expired GB1074861A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB446565A GB1074861A (en) 1965-02-02 1965-02-02 Improvements in tin-lead base solders

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB446565A GB1074861A (en) 1965-02-02 1965-02-02 Improvements in tin-lead base solders

Publications (1)

Publication Number Publication Date
GB1074861A true GB1074861A (en) 1967-07-05

Family

ID=9777699

Family Applications (1)

Application Number Title Priority Date Filing Date
GB446565A Expired GB1074861A (en) 1965-02-02 1965-02-02 Improvements in tin-lead base solders

Country Status (1)

Country Link
GB (1) GB1074861A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4112141A (en) * 1976-05-06 1978-09-05 Nissan Motor Company, Limited Method of using filling solder for automobile body
GB2171415A (en) * 1985-02-21 1986-08-28 London Scandinavian Metall Grain refining a solder alloy
WO1993003884A1 (en) * 1991-08-22 1993-03-04 Multicore Solders Limited Lead-based solder alloy and its use in soft soldering
CN102848097A (en) * 2012-09-18 2013-01-02 南京航空航天大学 Sn-Zn lead-free solder containing Nd, Ga and Se

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4112141A (en) * 1976-05-06 1978-09-05 Nissan Motor Company, Limited Method of using filling solder for automobile body
GB2171415A (en) * 1985-02-21 1986-08-28 London Scandinavian Metall Grain refining a solder alloy
WO1993003884A1 (en) * 1991-08-22 1993-03-04 Multicore Solders Limited Lead-based solder alloy and its use in soft soldering
CN102848097A (en) * 2012-09-18 2013-01-02 南京航空航天大学 Sn-Zn lead-free solder containing Nd, Ga and Se
CN102848097B (en) * 2012-09-18 2015-03-25 南京航空航天大学 Sn-Zn lead-free solder containing Nd, Ga and Se

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