GB1065897A - A semiconductor arrangement - Google Patents

A semiconductor arrangement

Info

Publication number
GB1065897A
GB1065897A GB23520/64A GB2352064A GB1065897A GB 1065897 A GB1065897 A GB 1065897A GB 23520/64 A GB23520/64 A GB 23520/64A GB 2352064 A GB2352064 A GB 2352064A GB 1065897 A GB1065897 A GB 1065897A
Authority
GB
United Kingdom
Prior art keywords
housing
contact plates
joined
metal connecting
connecting parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB23520/64A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens AG
Original Assignee
Siemens Schuckertwerke AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens AG filed Critical Siemens Schuckertwerke AG
Publication of GB1065897A publication Critical patent/GB1065897A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
GB23520/64A 1963-06-15 1964-06-05 A semiconductor arrangement Expired GB1065897A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0085696 1963-06-15

Publications (1)

Publication Number Publication Date
GB1065897A true GB1065897A (en) 1967-04-19

Family

ID=7512520

Family Applications (1)

Application Number Title Priority Date Filing Date
GB23520/64A Expired GB1065897A (en) 1963-06-15 1964-06-05 A semiconductor arrangement

Country Status (5)

Country Link
US (1) US3310716A (US07923587-20110412-C00001.png)
BE (1) BE649191A (US07923587-20110412-C00001.png)
CH (1) CH416842A (US07923587-20110412-C00001.png)
GB (1) GB1065897A (US07923587-20110412-C00001.png)
NL (2) NL141053B (US07923587-20110412-C00001.png)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1248814B (de) * 1962-05-28 1968-03-14 Siemens Ag Halbleiterbauelement und zugehörige Kühlordnung
CH442502A (de) * 1965-04-23 1967-08-31 Siemens Ag Gleichrichteranlage
DE1539645A1 (de) * 1965-05-28 1969-06-26 Asea Ab Halbleiteranordnung
US3437887A (en) * 1966-06-03 1969-04-08 Westinghouse Electric Corp Flat package encapsulation of electrical devices
DE1564665C3 (de) * 1966-07-18 1975-10-30 Siemens Ag, 1000 Berlin Und 8000 Muenchen Halbleiterbauelement und Verfahren zu seiner Herstellung
US3457472A (en) * 1966-10-10 1969-07-22 Gen Electric Semiconductor devices adapted for pressure mounting
US3452254A (en) * 1967-03-20 1969-06-24 Int Rectifier Corp Pressure assembled semiconductor device using massive flexibly mounted terminals
US3532941A (en) * 1967-05-23 1970-10-06 Int Rectifier Corp Pressure-assembled semiconductor device having a plurality of semiconductor wafers
US3577042A (en) * 1967-06-19 1971-05-04 Int Rectifier Corp Gate connection for controlled rectifiers
US5075765A (en) * 1990-09-21 1991-12-24 Unisys Low stress multichip module
FR3027380A1 (fr) * 2014-10-17 2016-04-22 Commissariat Energie Atomique Dispositif de refroidissement par liquide caloporteur pour composants electroniques

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2728881A (en) * 1950-03-31 1955-12-27 Gen Electric Asymmetrically conductive devices
DE1068816B (US07923587-20110412-C00001.png) * 1955-09-12 1959-11-12
US2882116A (en) * 1956-09-20 1959-04-14 Eitel Mccullough Inc Method of making electron tubes
NL281641A (US07923587-20110412-C00001.png) * 1961-08-04 1900-01-01
NL253550A (US07923587-20110412-C00001.png) * 1959-07-22
BE624012A (US07923587-20110412-C00001.png) * 1961-10-27
DE1248808B (US07923587-20110412-C00001.png) * 1962-03-23 1900-01-01

Also Published As

Publication number Publication date
BE649191A (US07923587-20110412-C00001.png) 1964-12-14
US3310716A (en) 1967-03-21
NL302170A (US07923587-20110412-C00001.png)
NL141053B (nl) 1974-01-15
CH416842A (de) 1966-07-15

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