GB1035530A - Improvements in or relating to thermoelectric heat pump units - Google Patents
Improvements in or relating to thermoelectric heat pump unitsInfo
- Publication number
- GB1035530A GB1035530A GB43489/63A GB4348963A GB1035530A GB 1035530 A GB1035530 A GB 1035530A GB 43489/63 A GB43489/63 A GB 43489/63A GB 4348963 A GB4348963 A GB 4348963A GB 1035530 A GB1035530 A GB 1035530A
- Authority
- GB
- United Kingdom
- Prior art keywords
- bridges
- plates
- assembly
- elements
- areas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 abstract 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 abstract 2
- 229910000914 Mn alloy Inorganic materials 0.000 abstract 1
- PCEXQRKSUSSDFT-UHFFFAOYSA-N [Mn].[Mo] Chemical compound [Mn].[Mo] PCEXQRKSUSSDFT-UHFFFAOYSA-N 0.000 abstract 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- 230000000712 assembly Effects 0.000 abstract 1
- 238000000429 assembly Methods 0.000 abstract 1
- 239000011230 binding agent Substances 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 230000005855 radiation Effects 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- 239000000725 suspension Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
1,035,530. Thermocouple assemblies. T. M. ELFVING. Nov. 4, 1963 [Nov. 9, 1962], No. 43489/63. Heading H1K. A thermocouple assembly comprises pairs of thermo-elements connected in series by conducting bridges arranged in parallel planes on opposite sides of the elements. The assembly is mounted between ceramic plates of high heat conductivity having metallized areas in contact with the bridges, the edge of the plates being sealed off by a thermally insulating member. In a typical arrangement a sub-assembly consisting of thermo-elements about 1-3 mm. long with a length-diameter ratio of 1 to 3 or less soldered to copper bridges 11, 12 is assembled within heat insulating ring 18 between alumina or beryllia cover-plates 16, 17. The plates are metallized on the outer surfaces and on areas of the inner surfaces corresponding to the bridges, and pieces of soft solder placed between these areas and the bridges. Metallizing is effected by applying molybdenum-manganese alloy or a suspension of silver in an organic binder followed by heating. While clamped the assembly is heated to solder on the plates without melting the solder between the bridges and thermo-elements. Finally, the edges are sealed with epoxy resin and the assembly evacuated and sealed off. To reduce heat leakage by radiation, the inner surfaces of the bridges, and of the cover-plates between the metallized areas may be silvered.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US23662062A | 1962-11-09 | 1962-11-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1035530A true GB1035530A (en) | 1966-07-13 |
Family
ID=22890268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB43489/63A Expired GB1035530A (en) | 1962-11-09 | 1963-11-04 | Improvements in or relating to thermoelectric heat pump units |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB1035530A (en) |
-
1963
- 1963-11-04 GB GB43489/63A patent/GB1035530A/en not_active Expired
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