GB1032574A - Electrical resistors - Google Patents

Electrical resistors

Info

Publication number
GB1032574A
GB1032574A GB2193963A GB2193963A GB1032574A GB 1032574 A GB1032574 A GB 1032574A GB 2193963 A GB2193963 A GB 2193963A GB 2193963 A GB2193963 A GB 2193963A GB 1032574 A GB1032574 A GB 1032574A
Authority
GB
United Kingdom
Prior art keywords
coating
base
pores
resistor
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2193963A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daystrom Inc
Original Assignee
Daystrom Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daystrom Inc filed Critical Daystrom Inc
Publication of GB1032574A publication Critical patent/GB1032574A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/232—Adjusting the temperature coefficient; Adjusting value of resistance by adjusting temperature coefficient of resistance
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1644—Composition of the substrate porous substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1678—Heating of the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/001—Mass resistors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Chemically Coating (AREA)

Abstract

An electrical resistor is made by depositing a coating of an electrically conductive material on a non-conductive porous base member so that the conductive material fills at least part of the pores of the base member, and then heat-treating the unit to stabilize its temperature coefficient of resistance. The porous base may be of sintered glass, porcelain, ceramic, or plastic. The coating is preferably applied by an autocatalytic reduction process in which a coating of a catalytic metal Fe, Co, Ni, Pt, Pd, Ru, Rh, Os, lr is first formed on the base which is then immersed in a solution containing nickel chloride, sodium hypophosphite as a reducing agent, and sodium acetate as a buffer and complexing agent for form a coating consisting of a mixture or compound of nickel and phosphorus; a coating containing cobalt may be formed similarly. If the pores are small, the treating solution may be subjected to ultra-sonic vibrations and may be applied under pressure; or the base may be evacuated before applying the solution. For more even distribution of the coating, an electric current may be passed through electrodes attached to each end of the base. Other methods of applying the coating are (a) deposition of aluminium from the vaporized metal in a carrier gas; (b) immersion in a slurry of nickel oxide, followed by drying and heating in a reducing atmosphere; (c) filling the pores with a gaseous or liquid hydrocarbon and reduction to carbon by heating. Terminals may be attached to the resistor by chemical deposition, electroplating, or direct bonding, or by fitting metal end caps. The resistor may be encapsulated in silicone, silicate, or epoxy resin.
GB2193963A 1962-06-06 1963-05-31 Electrical resistors Expired GB1032574A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US20046162A 1962-06-06 1962-06-06

Publications (1)

Publication Number Publication Date
GB1032574A true GB1032574A (en) 1966-06-08

Family

ID=22741820

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2193963A Expired GB1032574A (en) 1962-06-06 1963-05-31 Electrical resistors

Country Status (2)

Country Link
FR (1) FR1409711A (en)
GB (1) GB1032574A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2416958A1 (en) * 1978-02-09 1979-09-07 Bunker Ramo Forming metallic coating on small workpiece - by chemical deposition from a soln. which is mechanically and ultrasonically agitated
EP0717120A3 (en) * 1994-12-15 1997-06-25 Sumitomo Electric Industries Porous metal body, process for producing the same and battery plate formed therefrom
GB2413337A (en) * 2004-04-21 2005-10-26 Hydrogen Solar Ltd Electrodes with tungsten oxide films
WO2012090152A3 (en) * 2010-12-27 2014-01-30 Council Of Scientific & Industrial Research An electroless plating process

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2416958A1 (en) * 1978-02-09 1979-09-07 Bunker Ramo Forming metallic coating on small workpiece - by chemical deposition from a soln. which is mechanically and ultrasonically agitated
EP0717120A3 (en) * 1994-12-15 1997-06-25 Sumitomo Electric Industries Porous metal body, process for producing the same and battery plate formed therefrom
GB2413337A (en) * 2004-04-21 2005-10-26 Hydrogen Solar Ltd Electrodes with tungsten oxide films
WO2012090152A3 (en) * 2010-12-27 2014-01-30 Council Of Scientific & Industrial Research An electroless plating process

Also Published As

Publication number Publication date
FR1409711A (en) 1965-09-03

Similar Documents

Publication Publication Date Title
US3157541A (en) Precipitating highly pure compact silicon carbide upon carriers
US2438892A (en) Electrical translating materials and devices and methods of making them
US2552626A (en) Silicon-germanium resistor and method of making it
SE8305319D0 (en) BINDING OF SILVER PARTICLES IN SILVER COATING ON ELECTRIC SUBSTRATE
KR950031213A (en) Electrically heatable desorption activated carbon body and its manufacturing method
US3200011A (en) Electrically heatable filaments
US3732519A (en) Semiconductor gas detecting device
US2438110A (en) Electrical translating materials and devices and method of making them
US3172074A (en) Electrical resistors
US2530546A (en) Electrophoretic deposition of insulating coating
GB1032574A (en) Electrical resistors
US3883307A (en) Gas analyzer resistance element
US2487581A (en) Electrical resistor and method of making same
US3013328A (en) Method of forming a conductive film
US3107337A (en) Electrical element having a conductive film
GB938365A (en) Method of making printed circuits
US3214381A (en) Barium oxide moisture getter preparation
US2921871A (en) Method of increasing electrical resistance of gas plated nickel coatings and resulting article
CN210916243U (en) Support plate for vacuum coating equipment
US3835529A (en) Gas detecting device and method of making same
US3586534A (en) Ohmic contact electrode to semiconducting ceramics and a method for making the same
US3721870A (en) Capacitor
US2215999A (en) Selenium rectifier having an insulating layer
US3163733A (en) Slow blow fuse
US3445720A (en) Monolithic electric lamps,mountable on cords and elsewhere