GB1018621A - Improvements in or relating to electronic assemblies - Google Patents

Abstract

1,018,621. Circuit assemblies. GENERAL ELECTRIC CO. Ltd., and P. A. BARNET. Feb. 15, 1963 [Feb. 16, 1962; Sept. 24, 1962], Nos. 6058/62 and 36305/62. Heading H1R. In an electric circuit assembly, Fig. 6, modules 30 are formed, each comprising a plurality of components 29 disposed in a line, and the modules 30 are mounted in rows 31 on parallel panels 32, each panel carrying a plurality of conductors to which are connected leads which extend from at least one side of each module. In each module, the components 1, Fig. 1, which are preferably rectangular blocks of uniform dimensions, are mounted on an insulating substrate 9 having on one face copper printed wiring 10 to which the leads from the components are connected. Each component may have four leads (two emerging from each end); where fewer leads are required, the extra leads may be removed, or leads may be duplicated or used as mechanical fixing aids. Transistors may have three through leads emerging at each end; in a modification, a component has two leads at one end and one at the other. Leads may be of flat metal strip or wire. The substrate 9 may carry printed wiring on both sides, interconnection being effected by plated-through holes in the substrate, or by spot-welding through the substrate, and a layer of insulation being provided over the wiring on the reverse side. Fig. 4 shows a copper clad insulating substrate 20 folded to form a two-sided wiring plate; material of the substrate may be removed at 22 to facilitate folding, and connection between wiring on the two sides may be effected by retaining copper 23 round the folded edge. In the modification shown in Fig. 5 the copper-clad substrate 27 is folded around the components 26. Intermodule connections are made via printed wiring (not shown) in the area 41, Fig. 1, of the mounting panel 32 between adjacent rows of modules; for this purpose the leads from components 1 may be made long enough to reach area 41, or the wiring 10 on the substrate 9 may be extended. Connections between panels 32, which are held together by comer tie-bolts 38, Fig. 8, are effected by insulating blocks 37 carrying projecting conductive stakes 36 which are interconnected as necessary by soldered or wrapped slack wire connections 39; the blocks 37 are mounted at one edge only of the panels to facilitate access to the modules. The assembly may be cooled by cold air passing through channels 33, Fig. 6. Over-size components are preferably made in multiples of the standard size and may protrude through apertures in the mounting panels. Panels may have modules mounted on both sides, in staggered array. Power distribution busbars are preferably printed on insulating tapes which are sandwiched between the modules and their mounting panels.