GB1006807A - Improvements in or relating to methods of manufacturing semiconductor devices - Google Patents

Improvements in or relating to methods of manufacturing semiconductor devices

Info

Publication number
GB1006807A
GB1006807A GB30321/63A GB3032163A GB1006807A GB 1006807 A GB1006807 A GB 1006807A GB 30321/63 A GB30321/63 A GB 30321/63A GB 3032163 A GB3032163 A GB 3032163A GB 1006807 A GB1006807 A GB 1006807A
Authority
GB
United Kingdom
Prior art keywords
coating
mask
semi
wafer
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB30321/63A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB1006807A publication Critical patent/GB1006807A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P36/00—Gettering within semiconductor bodies
    • H10P36/03—Gettering within semiconductor bodies within silicon bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/904—Charge carrier lifetime control
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/938—Lattice strain control or utilization

Landscapes

  • Bipolar Transistors (AREA)
  • Thyristors (AREA)
GB30321/63A 1962-08-28 1963-07-31 Improvements in or relating to methods of manufacturing semiconductor devices Expired GB1006807A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US219880A US3195218A (en) 1962-08-28 1962-08-28 Method of influencing minority carrier lifetime in the semiconductor body of a pn junction device

Publications (1)

Publication Number Publication Date
GB1006807A true GB1006807A (en) 1965-10-06

Family

ID=22821136

Family Applications (1)

Application Number Title Priority Date Filing Date
GB30321/63A Expired GB1006807A (en) 1962-08-28 1963-07-31 Improvements in or relating to methods of manufacturing semiconductor devices

Country Status (7)

Country Link
US (1) US3195218A (enExample)
BE (1) BE636324A (enExample)
CH (1) CH415863A (enExample)
DE (1) DE1464704B2 (enExample)
GB (1) GB1006807A (enExample)
NL (2) NL139628B (enExample)
SE (1) SE314744B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3461547A (en) * 1965-07-13 1969-08-19 United Aircraft Corp Process for making and testing semiconductive devices
US3997368A (en) * 1975-06-24 1976-12-14 Bell Telephone Laboratories, Incorporated Elimination of stacking faults in silicon devices: a gettering process
US5418172A (en) * 1993-06-29 1995-05-23 Memc Electronic Materials S.P.A. Method for detecting sources of contamination in silicon using a contamination monitor wafer
US7723720B2 (en) * 2004-11-09 2010-05-25 University Of Florida Research Foundation, Inc. Methods and articles incorporating local stress for performance improvement of strained semiconductor devices

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2299778A (en) * 1939-06-07 1942-10-27 Haynes Stellite Co Making metal composite articles
US2796562A (en) * 1952-06-02 1957-06-18 Rca Corp Semiconductive device and method of fabricating same
BE589705A (enExample) * 1959-04-15

Also Published As

Publication number Publication date
NL139628B (nl) 1973-08-15
NL296617A (enExample)
DE1464704B2 (de) 1971-11-25
BE636324A (enExample)
US3195218A (en) 1965-07-20
SE314744B (enExample) 1969-09-15
DE1464704A1 (de) 1969-02-13
CH415863A (de) 1966-06-30

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