GB1000364A - Semiconductor junction devices - Google Patents

Semiconductor junction devices

Info

Publication number
GB1000364A
GB1000364A GB48717/62A GB4871762A GB1000364A GB 1000364 A GB1000364 A GB 1000364A GB 48717/62 A GB48717/62 A GB 48717/62A GB 4871762 A GB4871762 A GB 4871762A GB 1000364 A GB1000364 A GB 1000364A
Authority
GB
United Kingdom
Prior art keywords
wafer
germanium
lead
silicon
dopant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB48717/62A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Radio Corporation of America
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp, Radio Corporation of America filed Critical RCA Corp
Publication of GB1000364A publication Critical patent/GB1000364A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
GB48717/62A 1962-01-19 1962-12-27 Semiconductor junction devices Expired GB1000364A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US167357A US3188251A (en) 1962-01-19 1962-01-19 Method for making semiconductor junction devices

Publications (1)

Publication Number Publication Date
GB1000364A true GB1000364A (en) 1965-08-04

Family

ID=22607037

Family Applications (1)

Application Number Title Priority Date Filing Date
GB48717/62A Expired GB1000364A (en) 1962-01-19 1962-12-27 Semiconductor junction devices

Country Status (4)

Country Link
US (1) US3188251A (enExample)
BE (1) BE627303A (enExample)
GB (1) GB1000364A (enExample)
NL (1) NL287926A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2088067A1 (en) * 1970-05-13 1972-01-07 Tsitovsky Ilya Semiconductor slice - with shaped p-n junctions

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3324015A (en) * 1963-12-03 1967-06-06 Hughes Aircraft Co Electroplating process for semiconductor devices
US3352726A (en) * 1964-04-13 1967-11-14 Philco Ford Corp Method of fabricating planar semiconductor devices
US3384556A (en) * 1964-11-23 1968-05-21 Sperry Rand Corp Method of electrolytically detecting imperfections in oxide passivation layers
US3408271A (en) * 1965-03-01 1968-10-29 Hughes Aircraft Co Electrolytic plating of metal bump contacts to semiconductor devices upon nonconductive substrates
USRE29284E (en) * 1966-09-06 1977-06-28 Rockwell International Corporation Process for forming interconnections in a multilayer circuit board
US3464855A (en) * 1966-09-06 1969-09-02 North American Rockwell Process for forming interconnections in a multilayer circuit board
US3775645A (en) * 1972-08-08 1973-11-27 T Mccarthy Header assembly
US4062750A (en) * 1974-12-18 1977-12-13 James Francis Butler Thin film electrochemical electrode and cell

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL178757B (nl) * 1952-06-02 British Steel Corp Werkwijze en inrichting voor het continu produceren van een metaalstrook uit metaalpoeder.
US2742383A (en) * 1952-08-09 1956-04-17 Hughes Aircraft Co Germanium junction-type semiconductor devices
US2821493A (en) * 1954-03-18 1958-01-28 Hughes Aircraft Co Fused junction transistors with regrown base regions
US2930948A (en) * 1956-03-09 1960-03-29 Sarkes Tarzian Semiconductor device
US2986481A (en) * 1958-08-04 1961-05-30 Hughes Aircraft Co Method of making semiconductor devices
US2944321A (en) * 1958-12-31 1960-07-12 Bell Telephone Labor Inc Method of fabricating semiconductor devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2088067A1 (en) * 1970-05-13 1972-01-07 Tsitovsky Ilya Semiconductor slice - with shaped p-n junctions

Also Published As

Publication number Publication date
US3188251A (en) 1965-06-08
BE627303A (enExample) 1900-01-01
NL287926A (enExample) 1900-01-01

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