GB0905788D0 - Substrate support structure and method for maintaining a substrate clamped to a substrate support structure - Google Patents

Substrate support structure and method for maintaining a substrate clamped to a substrate support structure

Info

Publication number
GB0905788D0
GB0905788D0 GBGB0905788.6A GB0905788A GB0905788D0 GB 0905788 D0 GB0905788 D0 GB 0905788D0 GB 0905788 A GB0905788 A GB 0905788A GB 0905788 D0 GB0905788 D0 GB 0905788D0
Authority
GB
United Kingdom
Prior art keywords
support structure
substrate
substrate support
maintaining
clamped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB0905788.6A
Other versions
GB2469113A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mapper Lithopraphy IP BV
Original Assignee
Mapper Lithopraphy IP BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mapper Lithopraphy IP BV filed Critical Mapper Lithopraphy IP BV
Priority to GB0905788A priority Critical patent/GB2469113A/en
Publication of GB0905788D0 publication Critical patent/GB0905788D0/en
Publication of GB2469113A publication Critical patent/GB2469113A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
GB0905788A 2009-04-03 2009-04-03 Substrate Support Structure and Method for maintaining a substrate clamped to a substrate support Structure Withdrawn GB2469113A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0905788A GB2469113A (en) 2009-04-03 2009-04-03 Substrate Support Structure and Method for maintaining a substrate clamped to a substrate support Structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0905788A GB2469113A (en) 2009-04-03 2009-04-03 Substrate Support Structure and Method for maintaining a substrate clamped to a substrate support Structure

Publications (2)

Publication Number Publication Date
GB0905788D0 true GB0905788D0 (en) 2009-05-20
GB2469113A GB2469113A (en) 2010-10-06

Family

ID=40750042

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0905788A Withdrawn GB2469113A (en) 2009-04-03 2009-04-03 Substrate Support Structure and Method for maintaining a substrate clamped to a substrate support Structure

Country Status (1)

Country Link
GB (1) GB2469113A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101686549B1 (en) * 2010-02-19 2016-12-14 마퍼 리쏘그라피 아이피 비.브이. Substrate support structure, clamp preparation unit, and lithography system

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE50004935D1 (en) * 2000-10-31 2004-02-05 Sez Ag Villach Device for the liquid treatment of disc-shaped objects
TWI541615B (en) * 2007-07-13 2016-07-11 瑪波微影Ｉｐ公司 Method of exchanging a wafer in a lithography apparatus

Also Published As

Publication number Publication date
GB2469113A (en) 2010-10-06

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)