GB0805438D0 - Compact antenna for wireless device - Google Patents

Compact antenna for wireless device

Info

Publication number
GB0805438D0
GB0805438D0 GBGB0805438.9A GB0805438A GB0805438D0 GB 0805438 D0 GB0805438 D0 GB 0805438D0 GB 0805438 A GB0805438 A GB 0805438A GB 0805438 D0 GB0805438 D0 GB 0805438D0
Authority
GB
United Kingdom
Prior art keywords
wireless device
compact antenna
antenna
compact
wireless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB0805438.9A
Other versions
GB2458656A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LECKEY JONATHAN G
Original Assignee
LECKEY JONATHAN G
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LECKEY JONATHAN G filed Critical LECKEY JONATHAN G
Priority to GB0805438A priority Critical patent/GB2458656A/en
Publication of GB0805438D0 publication Critical patent/GB0805438D0/en
Publication of GB2458656A publication Critical patent/GB2458656A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0421—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with a shorting wall or a shorting pin at one end of the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Aerials (AREA)
GB0805438A 2008-03-26 2008-03-26 Compact integrated circuit antenna Withdrawn GB2458656A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0805438A GB2458656A (en) 2008-03-26 2008-03-26 Compact integrated circuit antenna

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0805438A GB2458656A (en) 2008-03-26 2008-03-26 Compact integrated circuit antenna

Publications (2)

Publication Number Publication Date
GB0805438D0 true GB0805438D0 (en) 2008-04-30
GB2458656A GB2458656A (en) 2009-09-30

Family

ID=39386732

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0805438A Withdrawn GB2458656A (en) 2008-03-26 2008-03-26 Compact integrated circuit antenna

Country Status (1)

Country Link
GB (1) GB2458656A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103066370A (en) * 2012-12-28 2013-04-24 中兴通讯股份有限公司 Grid array encapsulated module and device
CN104900989B (en) * 2015-06-09 2017-12-29 联想(北京)有限公司 Electronic equipment and containment vessel
US11189905B2 (en) * 2018-04-13 2021-11-30 International Business Machines Corporation Integrated antenna array packaging structures and methods

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5886393A (en) * 1997-11-07 1999-03-23 National Semiconductor Corporation Bonding wire inductor for use in an integrated circuit package and method
EP1126522A1 (en) * 2000-02-18 2001-08-22 Alcatel Packaged integrated circuit with radio frequency antenna
US6396137B1 (en) * 2000-03-15 2002-05-28 Kevin Mark Klughart Integrated voltage/current/power regulator/switch system and method
US6586309B1 (en) * 2000-04-24 2003-07-01 Chartered Semiconductor Manufacturing Ltd. High performance RF inductors and transformers using bonding technique

Also Published As

Publication number Publication date
GB2458656A (en) 2009-09-30

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)