GB0724385D0 - Patterning method - Google Patents

Patterning method

Info

Publication number
GB0724385D0
GB0724385D0 GBGB0724385.0A GB0724385A GB0724385D0 GB 0724385 D0 GB0724385 D0 GB 0724385D0 GB 0724385 A GB0724385 A GB 0724385A GB 0724385 D0 GB0724385 D0 GB 0724385D0
Authority
GB
United Kingdom
Prior art keywords
patterning method
patterning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB0724385.0A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eastman Kodak Co
Original Assignee
Eastman Kodak Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eastman Kodak Co filed Critical Eastman Kodak Co
Priority to GBGB0724385.0A priority Critical patent/GB0724385D0/en
Publication of GB0724385D0 publication Critical patent/GB0724385D0/en
Priority to PCT/GB2008/003827 priority patent/WO2009074765A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/80—Constructional details
    • H10K10/82—Electrodes
    • H10K10/84—Ohmic electrodes, e.g. source or drain electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40—Organic transistors
    • H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
GBGB0724385.0A 2007-12-13 2007-12-13 Patterning method Ceased GB0724385D0 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GBGB0724385.0A GB0724385D0 (en) 2007-12-13 2007-12-13 Patterning method
PCT/GB2008/003827 WO2009074765A1 (en) 2007-12-13 2008-11-13 Patterning method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0724385.0A GB0724385D0 (en) 2007-12-13 2007-12-13 Patterning method

Publications (1)

Publication Number Publication Date
GB0724385D0 true GB0724385D0 (en) 2008-01-23

Family

ID=39016561

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB0724385.0A Ceased GB0724385D0 (en) 2007-12-13 2007-12-13 Patterning method

Country Status (2)

Country Link
GB (1) GB0724385D0 (en)
WO (1) WO2009074765A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6938024B2 (en) * 2015-10-22 2021-09-22 国立研究開発法人産業技術総合研究所 Surface structure of substrate to be printed and its manufacturing method
CN108702844B (en) * 2016-02-18 2021-11-26 3M创新有限公司 Multilayer construction for mounting light emitting devices
EP3572873A1 (en) * 2018-05-24 2019-11-27 Paul Scherrer Institut Method for reducing the width of structures generated by ink deposition on pre-patterned substrates

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2180409B (en) * 1983-02-14 1987-09-23 Jr Raymond E Wiech Method of forming multilayer ceramic substrates
GB0416209D0 (en) * 2004-07-20 2004-08-25 Inverness Medical Switzerland Electrode manufacture
US20060213957A1 (en) * 2005-03-26 2006-09-28 Addington Cary G Conductive trace formation via wicking action
JP2007036117A (en) * 2005-07-29 2007-02-08 Fujifilm Holdings Corp Wiring substrate manufacturing method and liquid discharge head having wiring substrate

Also Published As

Publication number Publication date
WO2009074765A1 (en) 2009-06-18

Similar Documents

Publication Publication Date Title
GB0717054D0 (en) Patterning method
GB0713896D0 (en) Method
GB0712395D0 (en) Method
HK1132637A1 (en) Patterning technique
GB0707096D0 (en) Method
TWI346350B (en) Patterning method
EP2171169A4 (en) Method
GB0714442D0 (en) Method
GB0703366D0 (en) Method
GB0719250D0 (en) Anti-hack method
GB0710321D0 (en) Method
GB0708960D0 (en) Method
GB0714338D0 (en) method
GB0711843D0 (en) Method
GB0705321D0 (en) Method
GB0724385D0 (en) Patterning method
GB0710519D0 (en) Method
GB0719794D0 (en) Method
GB0714239D0 (en) Method
GB0714135D0 (en) Method
GB0710520D0 (en) Method
GB0706833D0 (en) Method
GB0710518D0 (en) Method
GB0710398D0 (en) Method
TWI350570B (en) Patterning method

Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)