GB0717997D0 - Substrate for high frequency integrated circuit - Google Patents
Substrate for high frequency integrated circuitInfo
- Publication number
- GB0717997D0 GB0717997D0 GB0717997A GB0717997A GB0717997D0 GB 0717997 D0 GB0717997 D0 GB 0717997D0 GB 0717997 A GB0717997 A GB 0717997A GB 0717997 A GB0717997 A GB 0717997A GB 0717997 D0 GB0717997 D0 GB 0717997D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- substrate
- integrated circuit
- high frequency
- frequency integrated
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0717997A GB0717997D0 (en) | 2007-09-14 | 2007-09-14 | Substrate for high frequency integrated circuit |
PCT/GB2008/003131 WO2009034362A1 (en) | 2007-09-14 | 2008-09-15 | Substrate for high frequency integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0717997A GB0717997D0 (en) | 2007-09-14 | 2007-09-14 | Substrate for high frequency integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
GB0717997D0 true GB0717997D0 (en) | 2007-10-24 |
Family
ID=38659000
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0717997A Ceased GB0717997D0 (en) | 2007-09-14 | 2007-09-14 | Substrate for high frequency integrated circuit |
Country Status (2)
Country | Link |
---|---|
GB (1) | GB0717997D0 (en) |
WO (1) | WO2009034362A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150037967A1 (en) | 2011-04-06 | 2015-02-05 | Peter Wilshaw | Controlling impurities in a wafer for an electronic circuit |
GB2489924A (en) * | 2011-04-06 | 2012-10-17 | Isis Innovation | Integrating III-V or II-VI devices with high resistivity silicon or germanium substrates |
GB2489923A (en) * | 2011-04-06 | 2012-10-17 | Isis Innovation | Processing a silicon wafer for a high frequency electronic circuit |
US20150371905A1 (en) * | 2014-06-20 | 2015-12-24 | Rf Micro Devices, Inc. | Soi with gold-doped handle wafer |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE511721C2 (en) * | 1997-06-18 | 1999-11-15 | Ericsson Telefon Ab L M | Substrates for integrated high frequency circuits and method for substrate production |
KR100304197B1 (en) * | 1998-03-30 | 2001-11-30 | 윤종용 | Method for manufacturing silicon on insulator |
-
2007
- 2007-09-14 GB GB0717997A patent/GB0717997D0/en not_active Ceased
-
2008
- 2008-09-15 WO PCT/GB2008/003131 patent/WO2009034362A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2009034362A1 (en) | 2009-03-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AT | Applications terminated before publication under section 16(1) |