GB0706287D0 - A laser method and apparatus - Google Patents

A laser method and apparatus

Info

Publication number
GB0706287D0
GB0706287D0 GBGB0706287.0A GB0706287A GB0706287D0 GB 0706287 D0 GB0706287 D0 GB 0706287D0 GB 0706287 A GB0706287 A GB 0706287A GB 0706287 D0 GB0706287 D0 GB 0706287D0
Authority
GB
United Kingdom
Prior art keywords
laser method
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB0706287.0A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Powerlase Ltd
Original Assignee
Powerlase Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Powerlase Ltd filed Critical Powerlase Ltd
Priority to GBGB0706287.0A priority Critical patent/GB0706287D0/en
Publication of GB0706287D0 publication Critical patent/GB0706287D0/en
Priority to PCT/GB2008/001062 priority patent/WO2008119949A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/20—Manufacture of screens on or from which an image or pattern is formed, picked up, converted or stored; Applying coatings to the vessel
    • H01J9/22—Applying luminescent coatings
    • H01J9/227—Applying luminescent coatings with luminescent material discontinuously arranged, e.g. in dots or lines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133512—Light shielding layers, e.g. black matrix

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)
GBGB0706287.0A 2007-03-30 2007-03-30 A laser method and apparatus Ceased GB0706287D0 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GBGB0706287.0A GB0706287D0 (en) 2007-03-30 2007-03-30 A laser method and apparatus
PCT/GB2008/001062 WO2008119949A1 (en) 2007-03-30 2008-03-27 A method of and an apparatus for laser removing coating material, the laser beam passing through the substrate towards the coating material; flat panel display with such removed coating material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0706287.0A GB0706287D0 (en) 2007-03-30 2007-03-30 A laser method and apparatus

Publications (1)

Publication Number Publication Date
GB0706287D0 true GB0706287D0 (en) 2007-05-09

Family

ID=38050588

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB0706287.0A Ceased GB0706287D0 (en) 2007-03-30 2007-03-30 A laser method and apparatus

Country Status (2)

Country Link
GB (1) GB0706287D0 (en)
WO (1) WO2008119949A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5394046B2 (en) * 2008-11-26 2014-01-22 三桜工業株式会社 Method for removing coated resin layer of resin-coated metal pipe
US8749747B2 (en) 2009-04-30 2014-06-10 Sharp Kabushiki Kaisha Method of manufacturing liquid crystal panel, glass substrate for liquid crystal panel, and liquid crystal panel including the same
WO2013068471A1 (en) 2011-11-09 2013-05-16 Institutt For Energiteknikk Method and apparatus for ablating a dielectric from a semiconductor substrate
GB2509985A (en) * 2013-01-22 2014-07-23 M Solv Ltd Method of forming patterns on coatings on opposite sides of a transparent substrate
WO2016019071A1 (en) 2014-07-29 2016-02-04 Gentex Corporation Laser ablation with reduced visual effects
US9895772B2 (en) 2014-10-03 2018-02-20 Gentex Corporation Second surface laser ablation
JP6745822B2 (en) 2015-06-19 2020-08-26 ジェンテックス コーポレイション Laser ablation of second surface
US11904410B2 (en) 2015-10-07 2024-02-20 Corning Incorporated Laser surface preparation of coated substrate
WO2018054569A1 (en) * 2016-09-23 2018-03-29 Tata Steel Nederland Technology B.V. Method and arrangement for the liquid-assisted laser texturing of moving steel strip
US11009760B2 (en) 2017-05-05 2021-05-18 Gentex Corporation Interleaving laser ablation
US10607975B2 (en) 2018-01-18 2020-03-31 Gentex Corporation Hexagonal packing laser ablation

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1039129A (en) * 1996-07-22 1998-02-13 Kansai Paint Co Ltd Forming method for color pattern having black matrix
DE19715702A1 (en) * 1997-04-15 1998-10-22 Fraunhofer Ges Forschung Process for the selective removal of one or more layers
BE1013237A3 (en) * 2000-01-20 2001-11-06 Wallonia Space Logistics En Ab Local removal process a coating applied on a transparent or translucent substrate.
JP2002018586A (en) * 2000-07-03 2002-01-22 Ricoh Microelectronics Co Ltd Method of laser beam machining and device for laser beam machining
JP2002243927A (en) * 2001-02-14 2002-08-28 Toshiba Corp Method for manufacturing display device and manufacturing device for display panel
DE10303063A1 (en) * 2003-01-27 2004-08-05 Delphi Technologies, Inc., Troy Method of laser metal removal involves covering metal surface with fluid prior to heating to prevent spatter

Also Published As

Publication number Publication date
WO2008119949A1 (en) 2008-10-09

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)