GB0503957D0 - Fixed abrasive grinding/polishing tool - Google Patents
Fixed abrasive grinding/polishing toolInfo
- Publication number
- GB0503957D0 GB0503957D0 GBGB0503957.3A GB0503957A GB0503957D0 GB 0503957 D0 GB0503957 D0 GB 0503957D0 GB 0503957 A GB0503957 A GB 0503957A GB 0503957 D0 GB0503957 D0 GB 0503957D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- polishing tool
- fixed abrasive
- abrasive grinding
- grinding
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
- B24B37/245—Pads with fixed abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004108946A JP2005288645A (en) | 2004-04-01 | 2004-04-01 | Grinding/polishing tool with fixed abrasive grains |
Publications (2)
Publication Number | Publication Date |
---|---|
GB0503957D0 true GB0503957D0 (en) | 2005-04-06 |
GB2412663A GB2412663A (en) | 2005-10-05 |
Family
ID=34431663
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0503957A Withdrawn GB2412663A (en) | 2004-04-01 | 2005-02-25 | Fixed abrasive grinding/polishing tool |
Country Status (3)
Country | Link |
---|---|
US (1) | US20050229499A1 (en) |
JP (1) | JP2005288645A (en) |
GB (1) | GB2412663A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009030294B4 (en) * | 2009-06-24 | 2013-04-25 | Siltronic Ag | Process for polishing the edge of a semiconductor wafer |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4576612A (en) * | 1984-06-01 | 1986-03-18 | Ferro Corporation | Fixed ophthalmic lens polishing pad |
US5958794A (en) * | 1995-09-22 | 1999-09-28 | Minnesota Mining And Manufacturing Company | Method of modifying an exposed surface of a semiconductor wafer |
AU2079597A (en) * | 1996-05-08 | 1997-11-26 | Minnesota Mining And Manufacturing Company | Abrasive article comprising an antiloading component |
US6039775A (en) * | 1997-11-03 | 2000-03-21 | 3M Innovative Properties Company | Abrasive article containing a grinding aid and method of making the same |
JP3858462B2 (en) * | 1998-07-30 | 2006-12-13 | 株式会社日立製作所 | Manufacturing method of semiconductor device |
JP4438213B2 (en) * | 1999-11-25 | 2010-03-24 | Jsr株式会社 | Polishing pad composition and polishing pad using the same |
DE60108624T2 (en) * | 2000-04-28 | 2005-12-22 | 3M Innovative Properties Co., Saint Paul | METHOD FOR POLISHING AND CLEANING GLASS |
GB2396157B (en) * | 2001-08-09 | 2005-07-20 | Hitachi Maxell | Non-magnetic particles having a plate shape and method for production thereof,abrasive material,polishing article and abrasive fluid comprising such particles |
-
2004
- 2004-04-01 JP JP2004108946A patent/JP2005288645A/en active Pending
-
2005
- 2005-02-25 US US11/065,452 patent/US20050229499A1/en not_active Abandoned
- 2005-02-25 GB GB0503957A patent/GB2412663A/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
US20050229499A1 (en) | 2005-10-20 |
GB2412663A (en) | 2005-10-05 |
JP2005288645A (en) | 2005-10-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |