GB0408461D0 - Lead-free, bismuth-free, solder alloy powders and pastes to minimise tombstone defects and methods of production thereof - Google Patents

Lead-free, bismuth-free, solder alloy powders and pastes to minimise tombstone defects and methods of production thereof

Info

Publication number
GB0408461D0
GB0408461D0 GBGB0408461.2A GB0408461A GB0408461D0 GB 0408461 D0 GB0408461 D0 GB 0408461D0 GB 0408461 A GB0408461 A GB 0408461A GB 0408461 D0 GB0408461 D0 GB 0408461D0
Authority
GB
United Kingdom
Prior art keywords
free
minimise
pastes
bismuth
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB0408461.2A
Other versions
GB2413565A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel Loctite Adhesives Ltd
Original Assignee
Henkel Loctite Adhesives Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Loctite Adhesives Ltd filed Critical Henkel Loctite Adhesives Ltd
Priority to GB0408461A priority Critical patent/GB2413565A/en
Publication of GB0408461D0 publication Critical patent/GB0408461D0/en
Priority to PCT/GB2005/001460 priority patent/WO2005099961A1/en
Publication of GB2413565A publication Critical patent/GB2413565A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/34—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
GB0408461A 2004-04-15 2004-04-15 Lead-free, bismuth-free solder alloy powders and a method of production thereof Withdrawn GB2413565A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB0408461A GB2413565A (en) 2004-04-15 2004-04-15 Lead-free, bismuth-free solder alloy powders and a method of production thereof
PCT/GB2005/001460 WO2005099961A1 (en) 2004-04-15 2005-04-15 Lead-free, bismuth-free solder alloy powders and pastes and methods of production thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0408461A GB2413565A (en) 2004-04-15 2004-04-15 Lead-free, bismuth-free solder alloy powders and a method of production thereof

Publications (2)

Publication Number Publication Date
GB0408461D0 true GB0408461D0 (en) 2004-05-19
GB2413565A GB2413565A (en) 2005-11-02

Family

ID=32320910

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0408461A Withdrawn GB2413565A (en) 2004-04-15 2004-04-15 Lead-free, bismuth-free solder alloy powders and a method of production thereof

Country Status (2)

Country Link
GB (1) GB2413565A (en)
WO (1) WO2005099961A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2092560B1 (en) * 2006-12-13 2013-06-12 Halliburton Energy Services, Inc. Lead-free solder alloy for printed circuit board assemblies for high-temperature environments
CN102896439B (en) * 2011-07-28 2015-08-26 北京有色金属研究总院 A kind of Sn-Sb-X high-temperature lead-free solder
DE112016000614T5 (en) 2015-09-17 2017-10-19 Fuji Electric Co., Ltd. Solder material for semiconductor elements
DE102016112390B4 (en) 2016-07-06 2021-08-12 Infineon Technologies Ag Solder pad and method for improving the solder pad surface
JP2020049543A (en) * 2018-09-28 2020-04-02 株式会社ケーヒン Solder material
US11267080B2 (en) 2019-05-09 2022-03-08 Indium Corporation Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders
US20220395936A1 (en) * 2021-06-11 2022-12-15 Indium Corporation High reliability lead-free solder pastes with mixed solder alloy powders

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5229070A (en) * 1992-07-02 1993-07-20 Motorola, Inc. Low temperature-wetting tin-base solder paste
US5405577A (en) * 1993-04-29 1995-04-11 Seelig; Karl F. Lead-free and bismuth-free tin alloy solder composition
TW369451B (en) * 1996-05-10 1999-09-11 Ford Motor Co Solder composition and method of using to interconnect electronic components to circuits on thermoplastic substrates
US5837191A (en) * 1996-10-22 1998-11-17 Johnson Manufacturing Company Lead-free solder
JPH11291083A (en) * 1998-04-14 1999-10-26 Murata Mfg Co Ltd Solder alloy
GB9903552D0 (en) * 1999-02-16 1999-04-07 Multicore Solders Ltd Reflow peak temperature reduction of solder alloys
EP1180411A1 (en) * 2000-08-17 2002-02-20 Senju Metal Industry Co., Ltd. Lead-free paste for reflow soldering
ES2541439T3 (en) * 2001-03-01 2015-07-20 Senju Metal Industry Co., Ltd Lead-free solder paste

Also Published As

Publication number Publication date
GB2413565A (en) 2005-11-02
WO2005099961A1 (en) 2005-10-27

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GB0408461D0 (en) Lead-free, bismuth-free, solder alloy powders and pastes to minimise tombstone defects and methods of production thereof

Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)