GB0221990D0 - Electronic device, data storage device, data reading device, method of manufacture of an electronic device - Google Patents

Electronic device, data storage device, data reading device, method of manufacture of an electronic device

Info

Publication number
GB0221990D0
GB0221990D0 GB0221990A GB0221990A GB0221990D0 GB 0221990 D0 GB0221990 D0 GB 0221990D0 GB 0221990 A GB0221990 A GB 0221990A GB 0221990 A GB0221990 A GB 0221990A GB 0221990 D0 GB0221990 D0 GB 0221990D0
Authority
GB
United Kingdom
Prior art keywords
electronic device
manufacture
data storage
data reading
data
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0221990A
Other versions
GB2393326A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Priority to GB0221990A priority Critical patent/GB2393326A/en
Publication of GB0221990D0 publication Critical patent/GB0221990D0/en
Publication of GB2393326A publication Critical patent/GB2393326A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/144Stacked arrangements of planar printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745Recess in conductor, e.g. in pad or in metallic substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/1056Metal over component, i.e. metal plate over component mounted on or embedded in PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
GB0221990A 2002-09-21 2002-09-21 Shielding electronic devices from electromagnetic radiation Withdrawn GB2393326A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0221990A GB2393326A (en) 2002-09-21 2002-09-21 Shielding electronic devices from electromagnetic radiation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0221990A GB2393326A (en) 2002-09-21 2002-09-21 Shielding electronic devices from electromagnetic radiation

Publications (2)

Publication Number Publication Date
GB0221990D0 true GB0221990D0 (en) 2002-10-30
GB2393326A GB2393326A (en) 2004-03-24

Family

ID=9944553

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0221990A Withdrawn GB2393326A (en) 2002-09-21 2002-09-21 Shielding electronic devices from electromagnetic radiation

Country Status (1)

Country Link
GB (1) GB2393326A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3886551B1 (en) 2020-03-27 2023-05-10 Hamilton Sundstrand Corporation Apparatus for mitigating electromagnetic interference in an electronic controller

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2013027B (en) * 1978-01-19 1982-09-22 Int Computers Ltd Integrated circuit packages
JPS57154694A (en) * 1981-03-20 1982-09-24 Hitachi Ltd Magnetic bubble memory cassette
US5358774A (en) * 1993-04-26 1994-10-25 Motorola, Inc. Electromagnetic shielding assembly and fabrication method
US5656795A (en) * 1995-04-03 1997-08-12 Schlegel Corporation Segmented shielding structure for connector panels
JP2894325B2 (en) * 1997-06-25 1999-05-24 日本電気株式会社 Electronic circuit shield structure
DE19853144A1 (en) * 1998-11-18 2000-05-25 Orga Kartensysteme Gmbh Smart card
US6477008B1 (en) * 1999-05-24 2002-11-05 International Business Machines Corporation Magnetic recording transducer with electronic shield
JP2001077575A (en) * 1999-09-08 2001-03-23 Mitsubishi Electric Corp Electromagnetic shield structure
US6297551B1 (en) * 1999-09-22 2001-10-02 Agere Systems Guardian Corp. Integrated circuit packages with improved EMI characteristics

Also Published As

Publication number Publication date
GB2393326A (en) 2004-03-24

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)