GB0209015D0 - A sub-mount for an optoelectronic device - Google Patents
A sub-mount for an optoelectronic deviceInfo
- Publication number
- GB0209015D0 GB0209015D0 GBGB0209015.7A GB0209015A GB0209015D0 GB 0209015 D0 GB0209015 D0 GB 0209015D0 GB 0209015 A GB0209015 A GB 0209015A GB 0209015 D0 GB0209015 D0 GB 0209015D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- mount
- sub
- optoelectronic device
- optoelectronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4272—Cooling with mounting substrates of high thermal conductivity
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4273—Thermal aspects, temperature control or temperature monitoring with heat insulation means to thermally decouple or restrain the heat from spreading
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
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- H01L2224/061—Disposition
- H01L2224/0612—Layout
- H01L2224/0613—Square or rectangular array
- H01L2224/06131—Square or rectangular array being uniform, i.e. having a uniform pitch across the array
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- H01L2224/1147—Manufacturing methods using a lift-off mask
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- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0209015A GB2387715A (en) | 2002-04-19 | 2002-04-19 | A sub-mount for an optoelectronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0209015A GB2387715A (en) | 2002-04-19 | 2002-04-19 | A sub-mount for an optoelectronic device |
Publications (2)
Publication Number | Publication Date |
---|---|
GB0209015D0 true GB0209015D0 (en) | 2002-05-29 |
GB2387715A GB2387715A (en) | 2003-10-22 |
Family
ID=9935167
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0209015A Withdrawn GB2387715A (en) | 2002-04-19 | 2002-04-19 | A sub-mount for an optoelectronic device |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2387715A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107591475B (en) * | 2017-09-29 | 2018-11-30 | 旭宇光电(深圳)股份有限公司 | High power LED device and LED chip die-bonding method |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6444563B1 (en) * | 1999-02-22 | 2002-09-03 | Motorlla, Inc. | Method and apparatus for extending fatigue life of solder joints in a semiconductor device |
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2002
- 2002-04-19 GB GB0209015A patent/GB2387715A/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
GB2387715A (en) | 2003-10-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |