GB0112582D0 - Synchronous DC-DC converter - Google Patents

Synchronous DC-DC converter

Info

Publication number
GB0112582D0
GB0112582D0 GBGB0112582.2A GB0112582A GB0112582D0 GB 0112582 D0 GB0112582 D0 GB 0112582D0 GB 0112582 A GB0112582 A GB 0112582A GB 0112582 D0 GB0112582 D0 GB 0112582D0
Authority
GB
United Kingdom
Prior art keywords
synchronous
converter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB0112582.2A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of GB0112582D0 publication Critical patent/GB0112582D0/en
Priority to EP02715646A priority Critical patent/EP1360755A2/en
Priority to KR1020027013321A priority patent/KR20020093022A/en
Priority to JP2002563586A priority patent/JP4053425B2/en
Priority to PCT/IB2002/000246 priority patent/WO2002063752A2/en
Priority to US10/067,046 priority patent/US6661208B2/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of dc power input into dc power output
    • H02M3/22—Conversion of dc power input into dc power output with intermediate conversion into ac
    • H02M3/24—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters
    • H02M3/28—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/4901—Structure
    • H01L2224/4903—Connectors having different sizes, e.g. different diameters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Dc-Dc Converters (AREA)
  • Power Conversion In General (AREA)
GBGB0112582.2A 2001-02-06 2001-05-24 Synchronous DC-DC converter Ceased GB0112582D0 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP02715646A EP1360755A2 (en) 2001-02-06 2002-01-28 Synchronous dc-dc converter
KR1020027013321A KR20020093022A (en) 2001-02-06 2002-01-28 Synchronous dc-dc converter
JP2002563586A JP4053425B2 (en) 2001-02-06 2002-01-28 Synchronous DC-DC converter
PCT/IB2002/000246 WO2002063752A2 (en) 2001-02-06 2002-01-28 Synchronous dc-dc converter
US10/067,046 US6661208B2 (en) 2001-02-06 2002-02-04 Synchronous DC-DC regulator with shoot-through prevention

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0102912.3A GB0102912D0 (en) 2001-02-06 2001-02-06 Switch devices and switching arrangements,e.g. for a dc-dc converter

Publications (1)

Publication Number Publication Date
GB0112582D0 true GB0112582D0 (en) 2001-07-18

Family

ID=9908194

Family Applications (4)

Application Number Title Priority Date Filing Date
GBGB0102912.3A Ceased GB0102912D0 (en) 2001-02-06 2001-02-06 Switch devices and switching arrangements,e.g. for a dc-dc converter
GBGB0112583.0A Ceased GB0112583D0 (en) 2001-02-06 2001-05-24 Switching FET circuit
GBGB0112582.2A Ceased GB0112582D0 (en) 2001-02-06 2001-05-24 Synchronous DC-DC converter
GBGB0112584.8A Ceased GB0112584D0 (en) 2001-02-06 2001-05-24 Integrated FET and driver

Family Applications Before (2)

Application Number Title Priority Date Filing Date
GBGB0102912.3A Ceased GB0102912D0 (en) 2001-02-06 2001-02-06 Switch devices and switching arrangements,e.g. for a dc-dc converter
GBGB0112583.0A Ceased GB0112583D0 (en) 2001-02-06 2001-05-24 Switching FET circuit

Family Applications After (1)

Application Number Title Priority Date Filing Date
GBGB0112584.8A Ceased GB0112584D0 (en) 2001-02-06 2001-05-24 Integrated FET and driver

Country Status (2)

Country Link
KR (3) KR100863879B1 (en)
GB (4) GB0102912D0 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100600452B1 (en) * 2004-12-29 2006-07-13 한국전기연구원 Semiconductor switches drive circuit for pulse generator
KR102044303B1 (en) * 2018-04-27 2019-11-13 퍼스트실리콘 주식회사 Gate driver module, half bridge dc/dc converter and distributed power optimizer using the same

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001003278A1 (en) 1999-07-02 2001-01-11 Koninklijke Philips Electronics N.V. Switching arrangement and switch component for a dc-dc converter

Also Published As

Publication number Publication date
GB0112583D0 (en) 2001-07-18
GB0102912D0 (en) 2001-03-21
KR20020093021A (en) 2002-12-12
KR20020093025A (en) 2002-12-12
KR20020093022A (en) 2002-12-12
KR100863879B1 (en) 2008-10-15
GB0112584D0 (en) 2001-07-18

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)