FR952619A - Improvements relating to electrolytic processes for forming fine-grained ductile copper deposits, to the copper plating bath used in said process and to the industrial copper-coated product resulting from said process - Google Patents

Improvements relating to electrolytic processes for forming fine-grained ductile copper deposits, to the copper plating bath used in said process and to the industrial copper-coated product resulting from said process

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Publication number
FR952619A
FR952619A FR952619DA FR952619A FR 952619 A FR952619 A FR 952619A FR 952619D A FR952619D A FR 952619DA FR 952619 A FR952619 A FR 952619A
Authority
FR
France
Prior art keywords
copper
plating bath
improvements relating
coated product
product resulting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Houdaille Hershey Corp
Original Assignee
Houdaille Hershey Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Houdaille Hershey Corp filed Critical Houdaille Hershey Corp
Application granted granted Critical
Publication of FR952619A publication Critical patent/FR952619A/en
Expired legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
FR952619D 1947-02-14 1947-09-01 Improvements relating to electrolytic processes for forming fine-grained ductile copper deposits, to the copper plating bath used in said process and to the industrial copper-coated product resulting from said process Expired FR952619A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US952619XA 1947-02-14 1947-02-14

Publications (1)

Publication Number Publication Date
FR952619A true FR952619A (en) 1949-11-21

Family

ID=22251004

Family Applications (1)

Application Number Title Priority Date Filing Date
FR952619D Expired FR952619A (en) 1947-02-14 1947-09-01 Improvements relating to electrolytic processes for forming fine-grained ductile copper deposits, to the copper plating bath used in said process and to the industrial copper-coated product resulting from said process

Country Status (1)

Country Link
FR (1) FR952619A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1027482B (en) * 1954-09-28 1958-04-03 Riedel & Co Direct copper plating of iron in acidic electrolytes without intermediate treatment
DE1078839B (en) * 1957-09-20 1960-03-31 Axel Springer & Sohn Shine for galvanic baths

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1027482B (en) * 1954-09-28 1958-04-03 Riedel & Co Direct copper plating of iron in acidic electrolytes without intermediate treatment
DE1078839B (en) * 1957-09-20 1960-03-31 Axel Springer & Sohn Shine for galvanic baths

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