FR91846E - Improvements in integrated circuits formed of thin film elements and solid semiconductor elements and methods for the manufacture of these integrated circuits - Google Patents

Improvements in integrated circuits formed of thin film elements and solid semiconductor elements and methods for the manufacture of these integrated circuits

Info

Publication number
FR91846E
FR91846E FR94894A FR94894A FR91846E FR 91846 E FR91846 E FR 91846E FR 94894 A FR94894 A FR 94894A FR 94894 A FR94894 A FR 94894A FR 91846 E FR91846 E FR 91846E
Authority
FR
France
Prior art keywords
integrated circuits
manufacture
methods
thin film
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR94894A
Other languages
French (fr)
Inventor
Albert Bobenrieth
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EUROP DES SEMICONDUCTEURS SOC
Original Assignee
EUROP DES SEMICONDUCTEURS SOC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EUROP DES SEMICONDUCTEURS SOC filed Critical EUROP DES SEMICONDUCTEURS SOC
Priority to FR94894A priority Critical patent/FR91846E/en
Application granted granted Critical
Publication of FR91846E publication Critical patent/FR91846E/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
FR94894A 1967-02-14 1967-02-14 Improvements in integrated circuits formed of thin film elements and solid semiconductor elements and methods for the manufacture of these integrated circuits Expired FR91846E (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR94894A FR91846E (en) 1967-02-14 1967-02-14 Improvements in integrated circuits formed of thin film elements and solid semiconductor elements and methods for the manufacture of these integrated circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR94894A FR91846E (en) 1967-02-14 1967-02-14 Improvements in integrated circuits formed of thin film elements and solid semiconductor elements and methods for the manufacture of these integrated circuits

Publications (1)

Publication Number Publication Date
FR91846E true FR91846E (en) 1968-08-16

Family

ID=8625270

Family Applications (1)

Application Number Title Priority Date Filing Date
FR94894A Expired FR91846E (en) 1967-02-14 1967-02-14 Improvements in integrated circuits formed of thin film elements and solid semiconductor elements and methods for the manufacture of these integrated circuits

Country Status (1)

Country Link
FR (1) FR91846E (en)

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