FR63292E - Dispositifs de connexion électrique - Google Patents

Dispositifs de connexion électrique

Info

Publication number
FR63292E
FR63292E FR63292DA FR63292E FR 63292 E FR63292 E FR 63292E FR 63292D A FR63292D A FR 63292DA FR 63292 E FR63292 E FR 63292E
Authority
FR
France
Prior art keywords
electrical connection
connection devices
devices
electrical
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Inventor
John Albert Leno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Standard Electric Corp
Original Assignee
International Standard Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Standard Electric Corp filed Critical International Standard Electric Corp
Application granted granted Critical
Publication of FR63292E publication Critical patent/FR63292E/fr
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10651—Component having two leads, e.g. resistor, capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49069—Data storage inductor or core

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Motor Or Generator Current Collectors (AREA)
  • Rectifiers (AREA)
FR63292D 1951-09-14 1952-09-12 Dispositifs de connexion électrique Expired FR63292E (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB21606/51A GB738265A (en) 1951-09-14 1951-09-14 Improvements in or relating to printed or otherwise deposited circuits

Publications (1)

Publication Number Publication Date
FR63292E true FR63292E (fr) 1955-09-12

Family

ID=10165751

Family Applications (2)

Application Number Title Priority Date Filing Date
FR63292D Expired FR63292E (fr) 1951-09-14 1952-09-12 Dispositifs de connexion électrique
FR63291D Expired FR63291E (fr) 1951-09-14 1952-09-12 Dispositifs de connexion électrique

Family Applications After (1)

Application Number Title Priority Date Filing Date
FR63291D Expired FR63291E (fr) 1951-09-14 1952-09-12 Dispositifs de connexion électrique

Country Status (5)

Country Link
US (1) US2902628A (fr)
BE (1) BE514138A (fr)
DE (1) DE923731C (fr)
FR (2) FR63292E (fr)
GB (1) GB738265A (fr)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2990499A (en) * 1958-01-02 1961-06-27 Friden Inc Universal diode board
US3109226A (en) * 1958-12-19 1963-11-05 Bell Telephone Labor Inc Fabrication of printed circuit apparatus
US3235942A (en) * 1959-12-02 1966-02-22 Burroughs Corp Electrode assemblies and methods of making same
US3256589A (en) * 1959-12-22 1966-06-21 Hughes Aircraft Co Method of forming an electrical circuit assembly
US3142783A (en) * 1959-12-22 1964-07-28 Hughes Aircraft Co Electrical circuit system
US3219886A (en) * 1959-12-28 1965-11-23 Bunker Ramo Modular circuit fabrication
US3151277A (en) * 1960-02-01 1964-09-29 Sippican Corp Modular electrical device
US3122680A (en) * 1960-02-25 1964-02-25 Burroughs Corp Miniaturized switching circuit
US3077658A (en) * 1960-04-11 1963-02-19 Gen Dynamics Corp Method of manufacturing molded module assemblies
US3247575A (en) * 1960-05-09 1966-04-26 Burroughs Corp Method for encapsulating electrical components
DE1233924B (de) * 1960-08-22 1967-02-09 Amphenol Corp Als Bauelement ausgebildete mit eingebauten Schaltelementen versehene elektrische Schaltung und Verfahren zu ihrer Herstellung
CH387103A (de) * 1960-09-02 1965-01-31 Schweiz Wagons Aufzuegefab Montageeinheit zur Herstellung logischer Schaltungen
US3164749A (en) * 1961-02-13 1965-01-05 Ibm Electronic component packaging
US3158927A (en) * 1961-06-05 1964-12-01 Burroughs Corp Method of fabricating sub-miniature semiconductor matrix apparatus
US3201655A (en) * 1961-09-01 1965-08-17 Martin Marietta Corp Electronic modules
US3149265A (en) * 1962-02-21 1964-09-15 Lord Mfg Co Damped electric circuit board
US3270399A (en) * 1962-04-24 1966-09-06 Burroughs Corp Method of fabricating semiconductor devices
US3290756A (en) * 1962-08-15 1966-12-13 Hughes Aircraft Co Method of assembling and interconnecting electrical components
US3268778A (en) * 1962-08-17 1966-08-23 Fairchild Camera Instr Co Conductive devices and method for making the same
FR1355034A (fr) * 1963-02-01 1964-03-13 Crouzet S A R L Nouveau mode de construction d'ensembles comportant des éléments à conductibilité asymétrique et analogues
US3205298A (en) * 1963-03-25 1965-09-07 Charles G Kalt Printed circuit board
US3376164A (en) * 1963-08-01 1968-04-02 Globe Union Inc Photovoltaic power assembly
US3419844A (en) * 1965-07-12 1968-12-31 Schmued Edgar Electrical connector
US3417294A (en) * 1966-12-19 1968-12-17 Emc Technology Inc Mounting circuit elements in printed circuit boards
US3509270A (en) * 1968-04-08 1970-04-28 Ney Co J M Interconnection for printed circuits and method of making same
US3545079A (en) * 1968-05-02 1970-12-08 Vitramon Inc Method of making multilayer circuit system
US3946864A (en) * 1974-07-01 1976-03-30 Hutson Jearld L Semiconductor chip package
FR2548457A1 (fr) * 1983-07-01 1985-01-04 Thermocoax Cie Capteur piezoelectrique
US5220488A (en) * 1985-09-04 1993-06-15 Ufe Incorporated Injection molded printed circuits
US4912288A (en) * 1985-09-04 1990-03-27 Allen-Bradley International Limited Moulded electric circuit package
US4922376A (en) * 1989-04-10 1990-05-01 Unistructure, Inc. Spring grid array interconnection for active microelectronic elements
US5457609A (en) * 1994-04-04 1995-10-10 Motorola, Inc. Charging contact for use with a battery powered electronic device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1718993A (en) * 1927-09-09 1929-07-02 Belden Mfg Co Wiring panel for electrical apparatus
FR686445A (fr) * 1929-12-11 1930-07-25 Procédé pour établir des connexions entre les divers organes d'appareils électriques complexes et produit obtenu par ce procédé
US1939130A (en) * 1931-04-14 1933-12-12 Donald H Mills Radio base construction
BE483459A (fr) * 1947-06-25
US2691144A (en) * 1952-07-12 1954-10-05 Fansteel Metallurgical Corp Electroforming apparatus for rectifier disks

Also Published As

Publication number Publication date
FR63291E (fr) 1955-09-12
DE923731C (de) 1955-02-21
GB738265A (en) 1955-10-12
US2902628A (en) 1959-09-01
BE514138A (fr)

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