FR3130824B1 - Composition photopolymérisable adhésive pour l’encapsulation de dispositifs électroniques ou optoélectroniques - Google Patents

Composition photopolymérisable adhésive pour l’encapsulation de dispositifs électroniques ou optoélectroniques

Info

Publication number
FR3130824B1
FR3130824B1 FR2114208A FR2114208A FR3130824B1 FR 3130824 B1 FR3130824 B1 FR 3130824B1 FR 2114208 A FR2114208 A FR 2114208A FR 2114208 A FR2114208 A FR 2114208A FR 3130824 B1 FR3130824 B1 FR 3130824B1
Authority
FR
France
Prior art keywords
electronic
optoelectronic devices
encapsulation
adhesive composition
photopolymerizable adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR2114208A
Other languages
English (en)
French (fr)
Other versions
FR3130824A1 (fr
Inventor
Stéphane Cros
Céline Labarthe
Christian Laurichesse
Mathis Majorel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Arkema France SA
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Arkema France SA
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR2114208A priority Critical patent/FR3130824B1/fr
Application filed by Commissariat a lEnergie Atomique CEA, Arkema France SA, Commissariat a lEnergie Atomique et aux Energies Alternatives CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to KR1020247024656A priority patent/KR20240134327A/ko
Priority to PCT/EP2022/087431 priority patent/WO2023118410A1/fr
Priority to EP22843738.0A priority patent/EP4453117A1/fr
Priority to JP2024538048A priority patent/JP2025503489A/ja
Priority to US18/723,324 priority patent/US20250066649A1/en
Priority to CN202280085514.4A priority patent/CN118696103A/zh
Publication of FR3130824A1 publication Critical patent/FR3130824A1/fr
Application granted granted Critical
Publication of FR3130824B1 publication Critical patent/FR3130824B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/10—Homopolymers or copolymers of methacrylic acid esters
    • C09J133/12—Homopolymers or copolymers of methyl methacrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/14—Methyl esters, e.g. methyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1804—C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/106—Esters of polycondensation macromers
    • C08F222/1065—Esters of polycondensation macromers of alcohol terminated (poly)urethanes, e.g. urethane(meth)acrylates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F230/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
    • C08F230/04—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal
    • C08F230/08—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon
    • C08F230/085—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon the monomer being a polymerisable silane, e.g. (meth)acryloyloxy trialkoxy silanes or vinyl trialkoxysilanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F287/00—Macromolecular compounds obtained by polymerising monomers on to block polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
    • H10F19/804—Materials of encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80—Constructional details
    • H10K30/88—Passivation; Containers; Encapsulations
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2453/00—Presence of block copolymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electroluminescent Light Sources (AREA)
  • Polymerisation Methods In General (AREA)
  • Polymerization Catalysts (AREA)
  • Graft Or Block Polymers (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Sealing Material Composition (AREA)
  • Photovoltaic Devices (AREA)
FR2114208A 2021-12-22 2021-12-22 Composition photopolymérisable adhésive pour l’encapsulation de dispositifs électroniques ou optoélectroniques Active FR3130824B1 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FR2114208A FR3130824B1 (fr) 2021-12-22 2021-12-22 Composition photopolymérisable adhésive pour l’encapsulation de dispositifs électroniques ou optoélectroniques
PCT/EP2022/087431 WO2023118410A1 (fr) 2021-12-22 2022-12-22 Composition photopolymerisable adhesive pour l'encapsulation de dispositifs electroniques ou optoelectroniques
EP22843738.0A EP4453117A1 (fr) 2021-12-22 2022-12-22 Composition photopolymerisable adhesive pour l'encapsulation de dispositifs electroniques ou optoelectroniques
JP2024538048A JP2025503489A (ja) 2021-12-22 2022-12-22 電子又は光電子デバイスのカプセル化のための光重合性接着剤組成物
KR1020247024656A KR20240134327A (ko) 2021-12-22 2022-12-22 전자 또는 광전자 장치의 캡슐화를 위한 광중합성 접착제 조성물
US18/723,324 US20250066649A1 (en) 2021-12-22 2022-12-22 Photopolymerizable adhesive composition for encapsulating electronic or optoelectronic devices
CN202280085514.4A CN118696103A (zh) 2021-12-22 2022-12-22 用于封装电子器件或光电子器件的可光聚合粘合剂组合物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2114208 2021-12-22
FR2114208A FR3130824B1 (fr) 2021-12-22 2021-12-22 Composition photopolymérisable adhésive pour l’encapsulation de dispositifs électroniques ou optoélectroniques

Publications (2)

Publication Number Publication Date
FR3130824A1 FR3130824A1 (fr) 2023-06-23
FR3130824B1 true FR3130824B1 (fr) 2026-01-02

Family

ID=80786456

Family Applications (1)

Application Number Title Priority Date Filing Date
FR2114208A Active FR3130824B1 (fr) 2021-12-22 2021-12-22 Composition photopolymérisable adhésive pour l’encapsulation de dispositifs électroniques ou optoélectroniques

Country Status (7)

Country Link
US (1) US20250066649A1 (https=)
EP (1) EP4453117A1 (https=)
JP (1) JP2025503489A (https=)
KR (1) KR20240134327A (https=)
CN (1) CN118696103A (https=)
FR (1) FR3130824B1 (https=)
WO (1) WO2023118410A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2730240A1 (fr) 1995-02-07 1996-08-09 Atochem Elf Sa Stabilisation d'un polymere par un radical libre stable
FR2794459B1 (fr) 1999-05-19 2004-09-03 Atofina Polyalcoxyamines issues de nitroxydes beta-substitues
US7927703B2 (en) * 2003-04-11 2011-04-19 3M Innovative Properties Company Adhesive blends, articles, and methods
EP2102298B1 (fr) * 2006-12-27 2017-09-06 Jacret Composition pour adhesif structural
JP2011026551A (ja) * 2009-05-21 2011-02-10 Kaneka Corp 紫外線硬化型粘接着剤組成物
WO2011138630A1 (en) * 2010-05-03 2011-11-10 Arkema France Uv curable encapsulant
KR101549726B1 (ko) * 2012-12-20 2015-09-02 제일모직주식회사 봉지용 조성물, 이를 포함하는 장벽층 및 이를 포함하는 봉지화된 장치

Also Published As

Publication number Publication date
EP4453117A1 (fr) 2024-10-30
KR20240134327A (ko) 2024-09-09
JP2025503489A (ja) 2025-02-04
CN118696103A (zh) 2024-09-24
FR3130824A1 (fr) 2023-06-23
US20250066649A1 (en) 2025-02-27
WO2023118410A1 (fr) 2023-06-29

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