FR3130051A1 - AUTHENTICATION PROCESS FOR MANUFACTURED OBJECTS - Google Patents

Abstract

The invention relates to a method for manufacturing an authenticatable object (10), comprising the steps of: manufacturing a microcircuit (MC) in a semiconductor substrate formed in a workpiece (1 ), machining the part to a functional part shape (5) of the object, configuring the first microcircuit to be able to couple to an external device (20) and to carry out with the external device a procedure of authentication of the microcircuit, and assembling the functional part to other parts (6) of the object. Figure for the abstract: Fig. 1

Description

AUTHENTICATION PROCESS FOR MANUFACTURED OBJECTS

The present invention relates to the fight against the counterfeiting of objects, in particular of luxury objects and accessories or consumables, or more generally of removable peripheral organs, designed to operate with particular devices. Thus, the invention applies in particular to watches, jewellery, ink cartridges and toners for printers, refills for perfume diffusers or electronic cigarettes, power supply batteries, headphones or audio earphones, etc.

There is a need to fight against counterfeiting and to protect the distribution of objects likely to be counterfeited. To control the marketing and/or use of such objects, it is known to integrate into the object a secure authentication microcircuit storing authentication data and a program capable of carrying out with an external reader a procedure of authentication. This authentication procedure is generally based on a "challenge-response" type protocol which implies that secret data and cryptographic functions are shared between the microcircuit and the reader having to authenticate the object.

The use of such a microcircuit is supposed to offer the greatest security, since it can be very difficult to copy. This solution appears secure if the microcircuit and the reader involved in the authentication procedure are both secure and if the microcircuit cannot be easily separated from the object.

In the field of luxury watches, which are generally entirely mechanical, there is strong opposition from manufacturers to the integration of electronic devices into luxury items such as watches or jewelry.

It is therefore desirable to be able to authenticate an object that does not necessarily have electronic circuits.

Embodiments relate to a method of fabricating an authenticatable object, comprising the steps of: fabricating a first microcircuit in a semiconductor substrate formed in a workpiece, machining the workpiece to a form of a first functional part of the , configuring the first microcircuit to be able to couple to an external device and to conduct with the external device an authentication procedure of the first microcircuit, and assembling the first functional part to other parts of the object.

According to one embodiment, the method comprises steps of manufacturing an antenna coil on a part of the object and of connecting the first microcircuit to the antenna coil, to allow the first microcircuit to communicate via a link without contact with the external device.

According to one embodiment, the antenna coil is formed on the first functional part or on another part of the object, or else the antenna coil is coupled to an external circuit integrated in the object, the external circuit being configured to allow the first microcircuit to establish communication with the external device, or to authenticate the first microcircuit and establish communication with the external device.

According to one embodiment, the method comprises steps of mounting the object in a box, and of connecting the first microcircuit to contacts accessible by opening the box or remoted outside the box, to allow the first microcircuit to establish a connection with the external device.

According to one embodiment, the first functional part has a mechanical and/or electronic function.

According to one embodiment, the method includes steps of: fabricating a second microcircuit in a semiconductor substrate formed in another workpiece, machining the other workpiece to a shape of a second functional part of the object , configuring the second microcircuit to be able to connect to the external device and to the first microcircuit in order to execute with the external device and/or the first microcircuit an authentication procedure, and manufacturing the object by assembling the second functional part to the object.

According to one embodiment, the method comprises steps of forming contact pads on the functional parts and conductive tracks to connect the first microcircuit to the contact pads of the first functional part and the second microcircuit to the contact pads of the second functional part, the functional parts being movable relative to each other in the object, the contact pads being located on the first and second functional parts so as to come into contact with each other only when the first and second functional parts are in a first position relative to each other.

Embodiments may also relate to an authenticatable object comprising a first functional part formed in a wafer integrating a semiconductor substrate in which is formed a first microcircuit, the first microcircuit being configured to couple to an external device and to execute with the external device a microcircuit authentication procedure.

According to one embodiment, the first microcircuit comprises an antenna coil to establish a contactless link with the external device, or else the object comprises an antenna coil connected to the first microcircuit to establish a contactless link between the microcircuit and the external device.

According to one embodiment, the object comprises an external circuit connected to the first microcircuit, the external circuit being configured to allow the first microcircuit to communicate with the external device.

According to one embodiment, the object comprises a box and contacts connected to the first microcircuit and accessible by opening the box or deported outside the box, to allow the first microcircuit to establish a connection with the external device.

According to one embodiment, in which the first functional part has a mechanical and/or electronic function in the object.

According to one embodiment, the first microcircuit is configured to: conduct a mutual authentication procedure with the external device, and/or authorize the execution of a function of the object only if the authentication procedure is executed with success with the external device.

According to one embodiment, the object comprises a second functional part on which a second microcircuit is formed, the second microcircuit being configured to be able to be connected to the external device and/or to the first microcircuit to execute with the external device and/or the first microcircuit an authentication procedure.

According to one embodiment, the first and second functional parts comprise contact pads and conductive tracks for connecting the first microcircuit to the contact pads of the first functional part and the second microcircuit to the contact pads of the second functional part, the functional parts being movable relative to each other in the object, the contact pads being located on the first and second functional parts so as to come into contact with each other only when the first and second functional parts are in a first position relative to each other.

Examples of embodiments of the invention will be described in the following, on a non-limiting basis in relation to the appended figures, among which:

FIG. 1 schematically represents steps of the method for protecting an object by authentication of the latter, according to one embodiment,

f igure 2 schematically represents a secure microcircuit, according to one embodiment,

f igure 3 schematically represents a secure microcircuit, according to another embodiment,

f igure 4 schematically represents a secure microcircuit, according to another embodiment,

f igure 5 schematically represents secure microcircuits, according to another embodiment,

f igure 6 schematically represents secure microcircuits, according to another embodiment,

f igure 7 schematically represents a printer comprising a print head,

f igures 8 and 8A schematically represent an object incorporating microcircuits, according to another embodiment, f igure 8A being a detail view of part of the object shown in f igure 8;

f igure 9 schematically represents a device comprising an electronic component such as a sensor or a laser diode, according to another embodiment.

Figure 1 shows steps in the method for protecting an object, according to one embodiment, the object thus protected being able to be authenticated with certainty. In a first series of steps, a secure microcircuit MC is fabricated on a plate 3 comprising a layer of a semiconductor material, such as silicon. The manufacture of the MC microcircuit can be carried out by conventional microelectronic techniques using a photolithography system 3.

In a second series of steps, the plate 1 is machined in the shape of a functional part 5 of an object 10 to be protected. The machining of the part 5 is for example carried out using a laser cutting tool 4. The position of the microcircuit MC on the plate 1 is such that the microcircuit MC is located in a location provided on the functional part 5 obtained after machining. Part 5 is said to be "functional" insofar as, without it, object 10 cannot carry out its main function. The function of part 5 within object 10 can be only mechanical or only electronic, or even a combination of mechanical and electronic functions.

In a third series of steps, the object 10 is manufactured by assembling different parts 5, 6 including part 5.

Part 5 may originally comprise a semiconductor substrate, in particular due to the fact that the object in the unprotected state comprises a microcircuit and/or a MEMS ("Micro Electro Mechanical System") micro-electromechanical device. In this case, the microcircuit MC can be formed in this substrate.

The object 10 in the unprotected state may also not comprise any semiconductor substrate. In this case, the whole of a functional part of the object 10 can be replaced by the part 5 formed in the plate 1 integrating a semiconductor substrate.

According to one embodiment, the part 5 is chosen in the object 10 from among the functional parts of the object which are the most difficult to replace or to manufacture.

According to one embodiment, the microcircuit MC is configured to establish a connection with a terminal 20 and conduct an authentication procedure with the latter. If the authentication procedure fails, the object is considered not authentic.

Figures 2 and 3 represent various components of the microcircuit MC. The microcircuit MC comprises a microprocessor PRC, an input/output circuit IOC, memories M1, M2, M3 connected to the microprocessor by a data and address bus and, optionally, a coprocessor CP for cryptographic calculation or arithmetic accelerator, and a random number generator RGN. The memory M1 can be a RAM ("Random Access Memory") type memory containing volatile application data. The memory M2 can be a read-only memory or ROM memory ("Read-Only Memory") for example containing the operating system of the microprocessor ("Operating System"). The memory M3 can be a non-volatile memory, for example a memory of the EEPROM ("Electrically Erasable Programmable ROM") or Flash type, containing application programs and non-volatile data. The microcircuit MC is secure insofar as it comprises elements designed to counter attacks aimed at discovering data to be kept secret, such as cryptography keys, stored by the microcircuit.

The communication interface circuit IOC of the microcircuit MC can be connected to contacts CT making it possible to establish a wired connection 21a with the terminal 20 (F igure 2). The communication interface circuit IOC can be connected to a contactless interface comprising an antenna AT external to the microcircuit MC (FIG. 3) which can be formed on or outside the part 5. The microcircuit MC is then configured to establish a contactless link 21b with the terminal 20.

FIG. 4 represents a microcircuit MC1 according to another embodiment. The MC1 microcircuit differs from the MC microcircuit in that it incorporates an AT1 antenna. The antenna AT1 is therefore directly formed on part 5.

To achieve a longer contactless communication distance, the antenna AT, AT1 can follow the contour of part 5.

In the embodiments of FIGS. 3 and 4, the contactless interface can be of the inductive coupling type, for example according to the ISO/IEC 14443A/B or ISO/IEC 15693 standard, or of the electrically coupled type (circuit UHF interface).

According to one embodiment, the PRC processor is configured to establish communication with the terminal 20 and conduct authentication operations with the terminal 20 with which it is coupled, either by the wired link 21a (F igure 2) or either by the contactless link 21b (FIGURES 3 and 4). To this end, the PRC processor is configured to execute message transmission/reception operations via the IOC interface (and possibly IO1), encryption, decryption and/or signature operations of messages sent to it , using cryptographic functions. These cryptography functions can be executed partially by the processor PRC and the coprocessor CP or totally by the processor PRC or the coprocessor CP1.

According to an embodiment illustrated by FIG. 5, a contactless communication interface circuit IO1 is integrated into another microcircuit MC2 on which is formed an antenna AT2 connected to the interface circuit IO1. The interface circuit IO1 of the microcircuit MC2 is connected to the contact interface CT of the microcircuit MC by a wired link CL. The microcircuit MC2 can be powered by the contactless link 21b when it is in the field emitted by a terminal, such as the terminal 20. The microcircuit MC can then be powered by the microcircuit MC2, via the link wired CL.

The microcircuit MC being integrated into part 5 of the object 10, the microcircuit MC2 on its substrate can be placed in the object 10 in a location free of a metal screen that could prevent contactless communications with the terminal 20.

For example, the part 5 integrating the microcircuit MC is housed in a metal box, and the antenna AT (f igure 3) or the microcircuit MC2 (f igure 5) is integrated in a part not masked by a metal screen likely to disturb contactless communications via the antenna AT, AT2, between the microcircuit MC and the terminal 20.

According to one embodiment, the object comprises two parts, including part 5, in which are respectively integrated two microcircuits MC, MC1 interconnected by a wired or contactless link, one of the two microcircuits being configured to establish a connection with an external terminal such as terminal 20. According to one embodiment, the two microcircuits MC, MC1 integrated in object 10 are configured to execute between them an authentication procedure, and to inform terminal 20 of the result of this authentication procedure, when a link is established between the latter and the microcircuit MC1. Furthermore, the terminal 20 can consider that the object 10 is authenticated only when the authentication procedures executed between the microcircuits MC and MC1 and between the microcircuit MC1 and the terminal 20 have succeeded.

According to an embodiment illustrated by f igure 6, the object 10 comprises two parts, including part 5, in which the two microcircuits MC1, MC2 are respectively integrated. The two microcircuits MC1, MC2 are configured and placed in the object 10 to be able to establish a contactless link 12b between them. Furthermore, the circuit MC2 is placed in the object 10 and configured to be connected by a wired link 21a with an external terminal such as the terminal 20. The microcircuit MC2 can be powered by the terminal 20, and the microcircuit MC1 can be power by recovering the energy supplied by the microcircuit MC2 to the antenna AT2 and transmitted to the antenna AT1.

According to one embodiment, the two microcircuits MC1, MC2 integrated in the object 10 are configured to execute between them an authentication procedure, and to inform the terminal 20 of the result of this authentication procedure, when a link is established between the latter and the microcircuit MC2. Furthermore, the terminal 20 can consider that the object 10 is authenticated only when the authentication procedures executed between the microcircuits MC1 and MC2 and between the microcircuit MC2 and the terminal 20 have been executed successfully.

The terminal 20 can be dedicated to the authentication of objects of the type of the object 10, or memorize an application dedicated to such authentication.

According to one embodiment, the authentication procedure executed by the microcircuits MC, MC1 and the terminal 20 is a mutual authentication procedure.

According to one embodiment, the terminal 20 once authenticated by the microcircuit MC, MC1, can write in a non-volatile memory M2 of the microcircuit MC, MC1 information relating to the object 10 and its owner, and read this information. However, provision may be made for this information to be read without the terminal 20 being authenticated by the microcircuit MC, MC1.

According to one embodiment, the connection between the microcircuit MC, MC1 and the terminal 20 can be established by opening a box of the object 10 in which the part 5 is housed, or by means of connecting wires connecting the interface to contact CT to contacts accessible from outside the box, for example placed on the box. The AT antenna (FIG. 3) can also be formed on an external face of the box.

The object 10 can for example be a watch, the part 5 being a cog or a fixed internal part such as a bearing support part or the dial of the watch. If part 5 is visible from outside the case of the watch, the microcircuit MC1 (f igure 4) can be integrated into part 5, a contactless connection being able to be established from outside the watch with the microcircuit.

In the case where the object in the unprotected state comprises a micro-machined component (microcircuit and/or MEMS) formed in a substrate, the part 5 chosen can be that which comprises the substrate in which the micro-component is formed. factory. Thus, the object 10 can also be a consumable such as an inkjet printer ink cartridge. In this application, part 5 can be a print head integrated into the cartridge or a substrate in which are integrated a MEMS component forming one or more ink ejection nozzles. According to one embodiment, the microcircuit MC, MC1 is formed in the semiconductor substrate where the MEMS component is formed so that the microcircuit can prevent the print head from operating if the microcircuit has not successfully conducted the authentication procedure with another microcircuit associated with the cartridge or with the printer in which the cartridge is inserted.

Figure 6 shows a PTR printer comprising PTC printer circuits connected to a CTD ink cartridge comprising a PHD board on which are formed PHC driver circuits of a printhead of the CTD cartridge. According to one embodiment, a microcircuit MC3 and a switch IT are also integrated into the wafer PHD, for example when manufacturing the control circuits PHC. The switch IT controlled by the microcircuit MC3, is interposed on a link between the printer circuits PTC and the control circuits PHC of the print head. The circuit MC3 is configured to establish contactless or contact communication with a secure microcircuit MC4 housed in the CTD cartridge or a secure microcircuit MC5 housed in the printer, to execute an authentication procedure with the microcircuit MC4 or MC5, and to close the IT switch only if the authentication procedure ends successfully, so as to prevent the print head from operating. The microcircuit MC3 may differ from the microcircuit MC or MC1 only by the presence of a control link for the switch IT, for example between the processor PRC and a control terminal of the switch. Here again, the authentication procedure can be simple or mutual, the switch being closed if the microcircuit MC3 authenticates the microcircuit MC4 or MC5 and/or if the microcircuit MC4 or MC5 authenticates the microcircuit MC3.

The f igures 8, 8A illustrate a mode of integration in the object 10 of two microcircuits, for example the microcircuits MC, MC2 of the f igure 5. The microcircuits MC, MC2 are formed in two mechanical parts 5, 6, mobile one in relation to the other. According to one embodiment, each of the microcircuits MC, MC2 is connected to respective contact pads CT1-CT2, CT3-CT4. The contact pads CT1-CT2, CT3-CT4 are placed on the parts 5, 6 so that they can momentarily come into contact with each other when the parts 5,6 are in a certain position relative to each other. 'other. In the example of Figure 8A, parts 5, 6 are toothed wheels meshed with each other. The contact pads CT1, CT2 connected to the microcircuit MC simultaneously come into contact with the contact pads CT3, CT4 connected to the microcircuit MC2, when the toothed wheels 5, 6 occupy a certain respective angular position around their axis of rotation. If one of the two microcircuits MC, MC2 is energized when the contact pad CT1 is in contact with the contact pad CT3, and the contact pad CT2 is in contact with the contact pad CT4, a procedure of authentication can be conducted by the microcircuits MC, MC2. The contact pads CT1-CT4 can be made by forming in the substrate metallized holes placed in the substrate so as to be located on the 5' cutting line of the substrate to form the parts 5, 6.

It will clearly appear to those skilled in the art that the present invention is capable of various variant embodiments and various applications. In particular, embodiments include all the possible combinations of the embodiment variants previously described.

The substrate in which the microcircuit MC, MC1, MC2, MC3 and the functional part 5 can be formed from a semiconductor material such as silicon (Si), gallium arsenide (AsGa), or germanium (Ge). This semiconductor substrate can also be formed by doped diamond. Thus, the invention can also be applied to the protection of a diamond or a jewel comprising a diamond.

The present invention can be applied to integrated circuits such as sensors or components transmitting communication signals. Thus, FIG. 9 represents a DC device comprising an SCW substrate on which an integrated circuit SSR is formed, the integrated circuit supplying signals SS.

According to one embodiment, a secure microcircuit MC6 is also formed on the substrate SCW. The microcircuit MC6 is configured to conduct an authentication procedure with the integrated circuit SSR, and/or to encrypt and/or sign the signals SS. The ES signals provided by the device DC include either an encrypted version of the ES signals provided by the integrated circuit SSR, possibly associated with a signature of this encrypted version, or the SS signals and a signature of the SS signals. Thus, the signals ES make it possible to determine with certainty, the integrated circuit SSR having produced the signals SS.

The SSR IC can be an imag or fingerprint sensor. In the case where the signals SS are images, the signature produced by the microcircuit MC6 can be inserted into the image, for example by "watermarking". The SSR integrated circuit can also be a telecommunication component such as a laser diode used for optical telecommunications. In this application, the microcircuit MC6 can encrypt and/or sign the data transmitted by the diode.

Claims (15)

Method for manufacturing an authenticatable object (10), comprising steps consisting in:
fabricating a first microcircuit (MC, MC1, MC3) in a semiconductor substrate formed in a workpiece (1),
machining the part to a first functional part shape (5) of the object,
configure the first microcircuit to be able to couple to an external device (20, MC2, MC4, MC5) and to conduct with the external device an authentication procedure of the first microcircuit, and
assembling the first functional part to other parts (6) of the object. Method according to claim 1, comprising the steps of manufacturing an antenna coil (AT, AT1) on a part of the object (10) and of connecting the first microcircuit (MC) to the antenna coil, for allowing the first microcircuit to communicate via a contactless link with the external device (20, MC2, MC4, MC5). A method according to claim 2, wherein:
the antenna coil (AT, AT1) is formed on the first functional part (5) or on another part of the object, or else
the antenna coil (AT2) is coupled to an external circuit (MC2) integrated in the object (10), the external circuit being configured to allow the first microcircuit (MC, MC3) to establish communication with the external device (20, MC2, MC4, MC5), or to authenticate the first microcircuit and establish communication with the external device. Method according to claim 1, comprising steps of mounting the object in a box (11), and of connecting the first microcircuit (MC) to contacts (CT) accessible by opening the box or remoted outside the box , to allow the first microcircuit to establish a link with the external device (20, MC2, MC4, MC5). Method according to one of Claims 1 to 4, in which the first functional part has a mechanical and/or electronic function. Method according to one of Claims 1 to 5, comprising steps consisting in:
fabricating a second microcircuit (MC2) in a semiconductor substrate formed in another workpiece,
machining the other workpiece to a shape of a second functional part (6) of the object,
configure the second microcircuit to be able to connect to the external device (20) and to the first microcircuit (MC) to execute an authentication procedure with the external device and/or the first microcircuit, and
manufacturing the object by assembling the second functional part (6) to the object. Method according to claim 6, comprising steps of forming contact pads (CT1-CT4) on the functional parts (5, 6) and conductive tracks to connect the first microcircuit (MC) to the contact pads of the first functional part and the second microcircuit (MC2) to the contact pads of the second functional part, the functional parts being movable relative to each other in the object, the contact pads being located on the first and second functional parts of so as to come into contact with each other only when the first and second functional parts are in a first position with respect to each other. Authenticable object (10) comprising a first functional part (5) formed in a wafer (1) integrating a semiconductor substrate in which a first microcircuit (MC, MC1, MC3) is formed, the first microcircuit being configured to be coupled to a device external (20, MC2, MC4, MC5) and to execute with the external device a microcircuit authentication procedure. Object according to claim 8, in which:
the first microcircuit (MC1) comprises an antenna coil (AT1) to establish a contactless link with the external device (20, MC2, MC4, MC5), or else
the object (10) comprises an antenna coil (AT) connected to the first microcircuit (MC) to establish a contactless link between the microcircuit and the external device (20, MC2, MC4, MC5). Object according to claim 8, comprising an external circuit (MC2, IT) connected to the first microcircuit (MC, MC3), the external circuit being configured to allow the first microcircuit to communicate with the external device (20, MC2, MC4, MC5) . Object according to claim 8, comprising a box (11) and contacts (CT) connected to the first microcircuit (MC) and accessible by opening the box or offset outside the box, to allow the first microcircuit to establish a connection with the external device (20, MC2, MC4, MC5). Object according to one of Claims 8 to 11, in which the first functional part (5) has a mechanical and/or electronic function in the object (10). Object according to one of Claims 8 to 12, in which the first microcircuit (MC, MC1, MC3) is configured for:
conduct a mutual authentication procedure with the external device (20, MC2, MC4, MC5), and/or
allowing the execution of a function of the object (CTD) only if the authentication procedure is successfully executed with the external device (20, MC2, MC4, MC5). Object according to one of Claims 8 to 13, comprising a second functional part (6) on which a second microcircuit (MC2) is formed, the second microcircuit being configured to be able to be connected to the external device (20) and/or to the first microcircuit (MC) to execute with the external device and/or the first microcircuit an authentication procedure. Object according to Claim 14, in which the first and second functional parts comprise contact pads (CT1-CT4) and conductive tracks for connecting the first microcircuit (MC) to the contact pads (CT1, CT2) of the first functional part (5) and the second microcircuit (MC2) to the contact pads (CT3, CT4) of the second functional part (6), the functional parts being movable relative to each other in the object (10), the contact pads being located on the first and second functional parts so as to come into contact with each other only when the first and second functional parts are in a first position with respect to each other.