FR3121006B1 - Electronic assembly with cooling circuit - Google Patents

Electronic assembly with cooling circuit Download PDF

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Publication number
FR3121006B1
FR3121006B1 FR2102744A FR2102744A FR3121006B1 FR 3121006 B1 FR3121006 B1 FR 3121006B1 FR 2102744 A FR2102744 A FR 2102744A FR 2102744 A FR2102744 A FR 2102744A FR 3121006 B1 FR3121006 B1 FR 3121006B1
Authority
FR
France
Prior art keywords
cooling circuit
electronic assembly
pressure
guide
abstract
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR2102744A
Other languages
French (fr)
Other versions
FR3121006A1 (en
Inventor
Philippe Mercier
Charles Dumez
Matthieu Treguer
Franck Travagli
Jean Noel Gillion
Keyu Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Equipements Electriques Moteur SAS
Original Assignee
Valeo Equipements Electriques Moteur SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Equipements Electriques Moteur SAS filed Critical Valeo Equipements Electriques Moteur SAS
Priority to FR2102744A priority Critical patent/FR3121006B1/en
Priority to PCT/EP2022/056617 priority patent/WO2022194820A1/en
Publication of FR3121006A1 publication Critical patent/FR3121006A1/en
Application granted granted Critical
Publication of FR3121006B1 publication Critical patent/FR3121006B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Measuring Fluid Pressure (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention concerne un système (7) de pression et de guidage configuré pour permettre l’insertion d’un tube (5) dans un logement (6) d’un circuit de refroidissement d’un ensemble (1) électronique comportant un système électronique (3), le système (7) étant composé d’au moins deux parties (71,72), une première (71) partie comporte au moins un élément (711) de pression et une deuxième partie (72) du système (7) de pression et guidage comporte au moins un élément (721) de guidage. Figure pour l’abrégé : Fig. 2.The present invention relates to a pressure and guidance system (7) configured to allow the insertion of a tube (5) into a housing (6) of a cooling circuit of an electronic assembly (1) comprising a system electronics (3), the system (7) being composed of at least two parts (71,72), a first part (71) comprises at least one pressure element (711) and a second part (72) of the system ( 7) pressure and guide comprises at least one element (721) guide. Figure for abstract: Fig. 2.

FR2102744A 2021-03-18 2021-03-18 Electronic assembly with cooling circuit Active FR3121006B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR2102744A FR3121006B1 (en) 2021-03-18 2021-03-18 Electronic assembly with cooling circuit
PCT/EP2022/056617 WO2022194820A1 (en) 2021-03-18 2022-03-15 Electronic assembly with cooling circuit

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2102744 2021-03-18
FR2102744A FR3121006B1 (en) 2021-03-18 2021-03-18 Electronic assembly with cooling circuit

Publications (2)

Publication Number Publication Date
FR3121006A1 FR3121006A1 (en) 2022-09-23
FR3121006B1 true FR3121006B1 (en) 2023-04-14

Family

ID=78212148

Family Applications (1)

Application Number Title Priority Date Filing Date
FR2102744A Active FR3121006B1 (en) 2021-03-18 2021-03-18 Electronic assembly with cooling circuit

Country Status (2)

Country Link
FR (1) FR3121006B1 (en)
WO (1) WO2022194820A1 (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110203773A1 (en) * 2008-11-04 2011-08-25 Daikin Industries, Ltd. Cooling member, manufacturing method and apparatus thereof
WO2020077336A1 (en) * 2018-10-12 2020-04-16 KSR IP Holdings, LLC Fluid cooled power electronic assembly

Also Published As

Publication number Publication date
FR3121006A1 (en) 2022-09-23
WO2022194820A1 (en) 2022-09-22

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