FR3119240B3 - Integrated circuit wafer electrical test system under magnetic field - Google Patents

Integrated circuit wafer electrical test system under magnetic field Download PDF

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Publication number
FR3119240B3
FR3119240B3 FR2113061A FR2113061A FR3119240B3 FR 3119240 B3 FR3119240 B3 FR 3119240B3 FR 2113061 A FR2113061 A FR 2113061A FR 2113061 A FR2113061 A FR 2113061A FR 3119240 B3 FR3119240 B3 FR 3119240B3
Authority
FR
France
Prior art keywords
integrated circuit
magnetic field
test system
electrical test
system under
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR2113061A
Other languages
French (fr)
Other versions
FR3119240A3 (en
Inventor
Siamak Salimy
Gilles Zahnd
Laurent Lebrun
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hprobe SA
Original Assignee
Hprobe SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FR2100813A external-priority patent/FR3119239A1/en
Priority claimed from FR2100816A external-priority patent/FR3119241A1/en
Application filed by Hprobe SA filed Critical Hprobe SA
Publication of FR3119240A3 publication Critical patent/FR3119240A3/en
Application granted granted Critical
Publication of FR3119240B3 publication Critical patent/FR3119240B3/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

Système de test électrique de plaquette de circuits intégrés sous champ magnétique La présente description concerne un système (200) comportant : un support (210) de plaquette de circuits intégrés ; une carte à pointes (220) reliée à un dispositif de mesure électrique (230) ; et un générateur magnétique (250) porté par une nacelle robotisée (240), la carte à pointes étant disposée entre le support et le générateur. Figure pour l'abrégé : Fig. 2Magnetic Field Integrated Circuit Board Electrical Test System A system (200) comprising: an integrated circuit board carrier (210); a probe card (220) connected to an electrical measuring device (230); and a magnetic generator (250) carried by a robotic pod (240), the probe card being disposed between the support and the generator. Figure for the abstract: Fig. 2

FR2113061A 2021-01-28 2021-12-07 Integrated circuit wafer electrical test system under magnetic field Active FR3119240B3 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
FR2100813A FR3119239A1 (en) 2021-01-28 2021-01-28 Field calibration unit with multi-axis robot for electric test head under magnetic field
FR2100816 2021-01-28
FR2100813 2021-01-28
FR2100816A FR3119241A1 (en) 2021-01-28 2021-01-28 Robotic system integrated in an electrical test head under magnetic field

Publications (2)

Publication Number Publication Date
FR3119240A3 FR3119240A3 (en) 2022-07-29
FR3119240B3 true FR3119240B3 (en) 2023-02-10

Family

ID=79269948

Family Applications (2)

Application Number Title Priority Date Filing Date
FR2113061A Active FR3119240B3 (en) 2021-01-28 2021-12-07 Integrated circuit wafer electrical test system under magnetic field
FR2113059A Active FR3119238B3 (en) 2021-01-28 2021-12-07 Integrated circuit wafer electrical test system under magnetic field

Family Applications After (1)

Application Number Title Priority Date Filing Date
FR2113059A Active FR3119238B3 (en) 2021-01-28 2021-12-07 Integrated circuit wafer electrical test system under magnetic field

Country Status (3)

Country Link
FR (2) FR3119240B3 (en)
TW (2) TWM630083U (en)
WO (2) WO2022161675A1 (en)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3732243A (en) 1970-06-23 1973-05-08 Sankyo Co 2-(p-bromophenyl)-9-dimethyl-amino-propyl-9h-imidazo(1,2-a)benzimidazole
DE2032424A1 (en) 1970-06-23 1972-01-20 Schering AG, Berlin und Bergkamen, 1000 Berlin 2 Thio 5 aza cytosine and its nucleosides
US5150042A (en) * 1991-09-23 1992-09-22 The United States Of America As Represented By The Secretary Of The Air Force On-wafer Hall-effect measurement system
JP2006024845A (en) * 2004-07-09 2006-01-26 Yamaha Corp Probe card and inspecting method for magnetic sensor
US8451016B2 (en) * 2009-12-30 2013-05-28 Stmicroelectronics Pte Ltd. Device and method for testing magnetic switches at wafer-level stage of manufacture
JP2013036941A (en) * 2011-08-10 2013-02-21 Yamaha Corp Inspection device and inspection method of magnetic sensor
US9678169B2 (en) * 2014-07-09 2017-06-13 Voltafield Technology Corp. Testing assembly for testing magnetic sensor and method for testing magnetic sensor
FR3046695B1 (en) 2016-01-11 2018-05-11 Centre National De La Recherche Scientifique MAGNETIC FIELD GENERATOR
US10126355B1 (en) * 2017-05-11 2018-11-13 Infineon Technologies Austria Ag Semiconductor probe test card with integrated hall measurement features

Also Published As

Publication number Publication date
WO2022161674A1 (en) 2022-08-04
TWM630083U (en) 2022-08-01
FR3119238A3 (en) 2022-07-29
FR3119238B3 (en) 2023-02-10
WO2022161675A1 (en) 2022-08-04
TWM632522U (en) 2022-10-01
FR3119240A3 (en) 2022-07-29

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