FR3105651B1 - ELECTRICAL DISTRIBUTOR - Google Patents

ELECTRICAL DISTRIBUTOR Download PDF

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Publication number
FR3105651B1
FR3105651B1 FR1915573A FR1915573A FR3105651B1 FR 3105651 B1 FR3105651 B1 FR 3105651B1 FR 1915573 A FR1915573 A FR 1915573A FR 1915573 A FR1915573 A FR 1915573A FR 3105651 B1 FR3105651 B1 FR 3105651B1
Authority
FR
France
Prior art keywords
electrical
electrodes
electrical conductor
external device
electrical distributor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1915573A
Other languages
French (fr)
Other versions
FR3105651A1 (en
Inventor
Toni Youssef
Stéphane Joseph Azzopardi
Rabih Khazaka
Thanh Long Le
Donatien Henri Edouard Martineau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Safran SA
Original Assignee
Safran SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Safran SA filed Critical Safran SA
Priority to FR1915573A priority Critical patent/FR3105651B1/en
Publication of FR3105651A1 publication Critical patent/FR3105651A1/en
Application granted granted Critical
Publication of FR3105651B1 publication Critical patent/FR3105651B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5386—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/08—Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
    • H02M1/088—Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters for the simultaneous control of series or parallel connected semiconductor devices
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
    • H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
    • H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/53—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M7/537—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters
    • H02M7/5387—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Geometry (AREA)
  • Inverter Devices (AREA)
  • Ignition Installations For Internal Combustion Engines (AREA)

Abstract

Le distributeur électrique comporte : - au moins trois composants électriques (T_HS) présentant des électrodes respectives (G) ; et - un conducteur électrique (140) destiné à connecter toutes les électrodes (G) à un même dispositif externe (135), ce conducteur électrique (140) comportant une partie allongée commune (302) conçue pour être connectée au dispositif externe (135). Le conducteur électrique (140) comporte en outre une étoile de distribution (312) au contact d’une extrémité (314) de la partie allongée commune (302) et comportant des branches (318) ayant des extrémités distales (320) respectivement connectées aux électrodes (G) et toutes situées, à 5% près, sur un cercle (C1). Figure pour l'abrégé : Figure 3The electrical distributor comprises: - at least three electrical components (T_HS) having respective electrodes (G); and - an electrical conductor (140) intended to connect all the electrodes (G) to the same external device (135), this electrical conductor (140) comprising a common elongated part (302) designed to be connected to the external device (135) . The electrical conductor (140) further comprises a distribution star (312) in contact with one end (314) of the common elongated part (302) and comprising branches (318) having distal ends (320) respectively connected to the electrodes (G) and all located, to within 5%, on a circle (C1). Figure for abstract: Figure 3

FR1915573A 2019-12-24 2019-12-24 ELECTRICAL DISTRIBUTOR Active FR3105651B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR1915573A FR3105651B1 (en) 2019-12-24 2019-12-24 ELECTRICAL DISTRIBUTOR

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1915573A FR3105651B1 (en) 2019-12-24 2019-12-24 ELECTRICAL DISTRIBUTOR
FR1915573 2019-12-24

Publications (2)

Publication Number Publication Date
FR3105651A1 FR3105651A1 (en) 2021-06-25
FR3105651B1 true FR3105651B1 (en) 2023-10-06

Family

ID=70978031

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1915573A Active FR3105651B1 (en) 2019-12-24 2019-12-24 ELECTRICAL DISTRIBUTOR

Country Status (1)

Country Link
FR (1) FR3105651B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4297087A1 (en) * 2022-06-24 2023-12-27 Airbus S.A.S. Power electronic module with parallely connected power electronic devices

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3910470C2 (en) * 1988-03-31 1995-03-09 Toshiba Kawasaki Kk Power semiconductor switch device with reduced thermal load in the chips involved, especially thermal stress
US5528073A (en) * 1994-07-05 1996-06-18 Allen-Bradley Company, Inc. Bus bar having reduced parasitic inductances and equal current path lengths
WO2016080519A1 (en) * 2014-11-20 2016-05-26 日本精工株式会社 Heat dissipation substrate for mounting electric component
US9972607B2 (en) * 2016-08-08 2018-05-15 Semiconductor Components Industries, Llc Semiconductor device and method of integrating power module with interposer and opposing substrates
US11183485B2 (en) * 2016-11-24 2021-11-23 Sumitomo Electric Industries, Ltd. Semiconductor module

Also Published As

Publication number Publication date
FR3105651A1 (en) 2021-06-25

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