FR3094470A1 - Thermal regulation device - Google Patents

Abstract

Thermal regulation device The invention relates to a device (1) for thermal regulation of electronic and / or electrical components (3), comprising a stack of plates (5) along a stack axis (A1) and at least one collector ( 7) of heat transfer fluid, the plates (5) defining at least one heat transfer fluid circulation channel in fluid communication with said at least one manifold (7). The plates (5) respectively comprise at least one fluidic connection zone (57) to said at least one coolant fluid manifold (7). Said at least one heat transfer fluid manifold (7) has a first rigid portion (71) at each fluidic connection with a plate (5) and has, between the first rigid portions (71), a second flexible portion (73) along the stacking axis (A1). The first rigid portions (71) have greater rigidity than the second flexible portions (73), and the second flexible portions (73) are deformable along the stack axis (A1) under the application of stress. Figure for the abstract: Fig. 1

Description

Thermal regulation device

The present invention relates to the thermal regulation of electrical and/or electronic components capable of releasing heat during their operation, these components being in particular electrical energy storage elements or a power electronic device, in particular in the field automobile. The invention also relates to a method for assembling a thermal regulation device with a predefined number of electronic and/or electrical components.

The invention finds an advantageous application in the field of thermal regulation devices of a power electronics device or module, that is to say comprising power electronic components, for example in a non-limiting manner semi- conductors, such as diodes or transistors. In operation, the temperature of such a device or power electronics module may rise, which risks damaging some of the power electronics components.

The invention also finds an advantageous application in the field of devices for thermal regulation of electrical energy storage elements, such as batteries of motor vehicles with electric and/or hybrid motorization. The electrical energy of vehicles with electric and/or hybrid motorization is supplied by one or more batteries. During their operation, the electrical energy storage elements such as the batteries are caused to heat up and thus risk being damaged.

A new charging technique, called fast charging, has recently appeared. It consists in charging the energy storage elements under a high voltage and amperage, in a short time, in particular in a maximum time of about twenty minutes. This rapid charge involves significant heating of the electrical energy storage elements that must be treated.

For the thermal regulation, in particular the cooling, of electrical energy storage elements, such as batteries, it is known to use a thermal regulation device.

According to a known solution, the thermal regulation device comprises cooling plates incorporating circulation channels for a heat transfer fluid, such as a cooling liquid, arranged between the electrical energy storage elements. These plates are brazed together and optionally also brazed to coolant inlet and outlet manifolds. In particular, during assembly, such electrical energy storage elements for example and the pairs of plates are stacked successively. However, such an assembly does not offer any assembly flexibility with regard to the insertion of the energy storage elements to be cooled in the thermal regulation device.

The aim of the invention is to allow better insertion into the thermal regulation device of electrical and/or electronic components, such as energy storage elements to be cooled, while ensuring effective cooling of the electrical and/or electronic components. likely to generate heat during operation.

To this end, the subject of the invention is a thermal regulation device for electronic and/or electrical components, in particular for a motor vehicle, said device comprising a predefined number of plates arranged along a stacking axis between which said components are intended to be arranged, and at least one heat transfer fluid manifold, the plates defining at least one heat transfer fluid circulation channel in fluid communication with said at least one heat transfer fluid manifold.

According to the invention, the plates respectively comprise at least one fluidic connection zone to said at least one heat transfer fluid manifold.

In addition, said at least one heat transfer fluid manifold has a first rigid portion at each fluidic connection with a plate and has, between the first rigid portions, a second flexible portion along the stacking axis. The first rigid portions have a stiffness greater than that of the second flexible portions, and the second flexible portions are deformable along the stacking axis under the application of a stress.

By flexible is meant the property of the second portions to stretch or compress along the stacking axis under the effect of a stress exerted in this axis, without undergoing deterioration.

In particular, as opposed to the second flexible portions, the first rigid portions are produced in such a way as not to deform or to deform slightly, in particular to stretch or compress along the stacking axis, when a force or constraint is applied to said device.

The configuration of the or each heat transfer fluid manifold with portions of different rigidity or flexibility makes it possible to guarantee a robust connection thanks to the first rigid portions between the plates and the manifold, while conferring thanks to the second flexible portions, that is to i.e. flexible or extensible/compressible, a flexibility of the device along the stacking axis. This allows compression of the stack of plates and of the electronic and/or electrical components interposed between the plates, when assembling such a device with these components. This can also optionally allow a separation of the plates before insertion of said components.

Said device may further comprise one or more of the following characteristics, taken separately or in combination.

According to one aspect of the invention, the plates define in pairs said at least one coolant fluid circulation channel.

According to another aspect of the invention, said at least one heat transfer fluid collector extends longitudinally along the stacking axis.

Preferably, said at least one heat transfer fluid collector has a succession of folds at the level of the second flexible portions, so as to form a reserve of material along the stacking axis.

The second flexible portions of said at least one heat transfer fluid manifold are for example made in the form of bellows.

According to yet another aspect of the invention, at least the second flexible portions of the or of each manifold are produced by separate inserts from the plates. In other words, the flexible portions are not made at the level of the plates.

According to a first embodiment, said device comprises a plurality of flexible hollow connectors along the stacking axis and placing the plates in fluid communication, so as to define said at least one heat transfer fluid manifold.

According to this first embodiment, the fluidic connection zones of the plates at least partially define the first rigid portions and the hollow connectors define at least partially the second flexible portions of said at least one heat transfer fluid manifold.

The hollow connectors are for example made of a metallic material, such as aluminum or an aluminum alloy.

At least some plates of the stack may include at least one collar bordering an opening. The collars of the plates are assembled using hollow connectors. Each collar bordering an opening of a fluidic connection zone of the plate forms a first rigid portion of said at least one heat transfer fluid manifold.

According to a second embodiment, said at least one heat transfer fluid manifold is made in a single piece, separate from the plates, and into which the fluidic connection zones of the plates open.

Said at least one heat transfer fluid manifold made in one piece is for example closed off on one side and is placed in fluid communication with a heat transfer fluid circuit on the other side.

According to the second embodiment, the first rigid portions of said at least one heat transfer fluid manifold comprise a plurality of openings lined with collars in which the fluidic connection zones of the plates are received. This makes it possible to ensure a robust connection between the plates and said at least one collector.

According to the second embodiment, the collars of the or each heat transfer fluid manifold can extend inside the volume defined by the heat transfer fluid manifold.

According to a variant embodiment, each connection zone of a plate comprises at least one abutment, called a product abutment, bearing against a first rigid portion of said manifold bordering an opening when the plate is inserted into said at least one manifold. As a variant, the positioning of the plates with respect to the or each heat transfer fluid manifold can be done automatically during the assembly of all the plates to the heat transfer fluid manifold(s).

According to another aspect of the invention, said device comprises at least one stopper for said components. Said at least one stopper allows said components to be locked in position. This blocking comes for example in addition to a compression of the assembly after insertion of said components in the device so as to be each held between two plates of neighboring pairs.

According to an exemplary embodiment, said device has the general shape of a parallelepiped, extending longitudinally along the stacking axis, and the blocking is carried out in the direction of the height of said device.

A predefined number of stops of said components can be formed on the plates. The stops are for example made in the form of pins extending projecting from the general plane defined by the outer surface of a plate, that is to say on the side opposite to said at least one circulation channel heat transfer fluid. As a variant, to ensure the blocking in the direction of the height of said device, said components can bear at least in part against said at least one heat transfer fluid collector after insertion into said device.

According to another aspect of the invention, said device may comprise at least one thermal interface intended to be arranged between a plate and an electronic and/or electrical component. This makes it possible to guarantee heat transfer between the plates and said components, even in the event of insufficient compression and possible micro-spacings between the plates and said components. The thermal interface is for example produced in the form of thermal paste.

According to another aspect of the invention, said device may comprise at least one electrical insulator intended to be arranged between a plate and an electronic and/or electrical component. This ensures the safety of the end user. Electrical insulation can be provided by a coat of paint.

According to a variant, the electrical insulation and the thermal interface can be made in one piece.

According to yet another aspect of the invention, the plates and said at least one heat transfer fluid manifold are metallic and are assembled by brazing. This ensures a strong tight connection between the plates and the or each heat transfer fluid manifold.

The invention also relates to a method for assembling a device as defined above with a predefined number of electronic and/or electrical components. Electronic and/or electrical components are particularly likely to release heat during operation, for example, electrical energy storage elements or power electronic devices.

According to the invention, said method comprises the following steps: inserting said components simultaneously, respectively one by one, between the pairs of plates, and compressing all of said device receiving said components along the stacking axis. Before inserting said components between the plates, the pairs of plates are spaced along the stacking axis, by a predefined gap, which may be standard. This predefined gap is greater than the dimension of said components in the stacking axis, namely the width or depth.

According to an alternative, said method may include a preliminary step in which the pairs of plates are separated simultaneously, respectively one by one, along the stacking axis, before inserting said components between the pairs of plates. Such an alternative can be implemented when the gap between the pairs of plates is not sufficient to allow the insertion of said components, in other words, when the gap is less than the dimension of said components in the axis of stacking.

Other advantages and characteristics of the invention will appear more clearly on reading the following description given by way of illustrative and non-limiting example, and the appended drawings, among which:

Figure 1 is a perspective view of a thermal regulation device comprising a stack of plates and electronic and/or electrical components according to a first embodiment.

Figure 2 is a perspective view of a thermal regulation device comprising a stack of plates and electronic and/or electrical components according to a second embodiment.

Figure 3 shows an exploded view of a pair of plates of the device of Figure 1.

Figure 4 shows an exploded view of a pair of plates of the device of Figure 2.

Figure 5 shows a front view of a plate of the device of Figure 1 according to a variant embodiment.

Figure 6 shows a front view of a plate of the device of Figure 2 according to a variant embodiment.

Figure 7 shows a portion of the device comprising a stack of plates according to Figure 5.

Figure 8 shows a portion of the device comprising a stack of plates according to Figure 6.

Figure 9 is an enlarged view of a portion of Figure 1 showing sleeves in the form of bellows between the stack of plates, in an extended state.

Figure 10 shows the device according to the first embodiment before assembly with electronic and/or electrical components.

Figure 11 shows the device of Figure 10 after insertion of the electronic and/or electrical components between the pairs of plates.

Figure 12 shows the device of Figure 11 receiving said components after compression of the assembly.

Figure 13 is an enlarged view of a portion of Figure 12 showing sleeves in the form of bellows between the stack of plates, in a compressed state.

Figure 14 is a perspective view of a coolant manifold of the device according to the second embodiment.

Figure 15 is an enlarged view of one end of the collector of Figure 14.

Figure 16 shows a front view of a plate assembled to the collector according to the second embodiment.

Figure 17 is an enlarged view of a portion of Figure 16 showing the connection between the plate and the collector.

Figure 18 shows the device according to the second embodiment before assembly with electronic and/or electrical components.

Figure 19 shows the device of Figure 18 after insertion of the electronic and/or electrical components between the pairs of plates.

Figure 20 is an enlarged view of a portion of Figure 19 showing the flexible, bellows-like portions of the manifold in an expanded state.

Figure 21 shows the device of Figure 20 receiving said components after compression of the assembly.

Figure 22 is an enlarged view of a portion of Figure 21 showing the flexible, bellows-like portions of the manifold in a compressed state.

In these figures, identical elements bear the same reference numbers.

The following achievements are examples. Although the description refers to one or more embodiments, this does not necessarily mean that each reference is to the same embodiment, or that the features apply only to a single embodiment. Simple features of different embodiments can also be combined or interchanged to provide other embodiments.

In the description, certain elements can be indexed, such as the first element or the second element, for example. In this case, it is a simple indexing to differentiate and name elements that are close but not identical. This indexing does not imply a priority of one element over another and it is easy to interchange such denominations without departing from the scope of the present description. Nor does this indexing imply an order in time.

Figures 1 and 2 each represent a thermal regulation device 1, 101 receiving electronic and/or electrical components 3 capable of releasing heat during their operation, for the thermal regulation of the latter, in particular their cooling. The components 3, shown very schematically in the figures, are in particular electrical energy storage elements or a power electronics device, in particular in the automotive field. By way of example, it may be electric cells making up a battery pack in an electric vehicle.

Such a device 1, 101 is intended in particular to equip a motor vehicle. The entire device 1, respectively 101, can advantageously be soldered in one go.

In general, the device 1, respectively 101, comprises a predefined number of plates 5, respectively 105, arranged along a stacking axis A1. The device 1, respectively 101, comprises at least one collector 7, respectively 107, of heat transfer fluid. In the examples illustrated, the device 1, respectively 101, comprises two collectors 7, respectively 107, for the inlet and for the outlet of the heat transfer fluid. Each coolant manifold 7, 107 extends longitudinally along the stacking axis A1 of the plates 5, 105.

In the particular example illustrated in Figure 1 or 2, the device 1, respectively 101, has the general shape of a parallelepiped, in particular a rectangular parallelepiped, the longitudinal axis of which is the stacking axis A1, and extending in width along an axis A2 transverse to the stacking axis A1, and in height along an axis H, which corresponds to a vertical axis according to the arrangement of the elements in Figures 1 and 2.

The electronic and/or electrical components 3 are intended to be interposed between pairs of plates 5, respectively 105, so as to form a stack of plates 5 or 105 and of components 3 along the stacking axis A1, then the together can be compressed, as described in more detail below.

Optionally, the insertion of these components 3 can be done by separating the pairs of plates 5, respectively 105, along the stacking axis A1.

A thermal interface (not shown) may be provided between each electronic and/or electrical component 3 and the adjacent plates 5, respectively 105, so as to guarantee heat transfer between the plates 5, 105 and the electronic and/or electrical components 3 . The heat transfer can thus be ensured even in the event of insufficient compression and possible micro spacings between the plates 5, 105 and the electronic and/or electrical components 3. The thermal interface is for example produced in the form of thermal paste.

As a variant or in addition, at least one electrical insulator (not shown) may be provided between the electronic and/or electrical components 3 and the adjacent plates 5, respectively 105, in order to guarantee the safety of the user. Electrical insulation can be provided by a coat of paint. According to a variant not shown, the electrical insulation and the thermal interface can be made in one piece.

The device 1 or 101 can also comprise at least one stopper (not shown in Figures 1 and 2) of the electronic and/or electrical components 3. This is in particular one or more stops allowing the blocking in position of the electronic and/or electrical components 3 along the axis of height H. This blocking comes for example in addition to a compression of the together after inserting the electronic and/or electrical components 3 between the plates 5, 105.

Figures 3 and 4 show in more detail the plates 5, 105 of the device 1, 101 before assembly in pairs. The plates 5, 105 can be made from stamped sheet metal. Preferably, the two plates 5, 105 of a pair are symmetrical with respect to their joint plane. In this way, the heat exchange surface with a component is the same regardless of the side of the pair of plates 5 against which the component is intended to be placed.

The plates 5, 105 extend for example along a plane perpendicular to the stacking axis A1. In this example, the plates 5, 105 extend along the transverse axis A2 and the vertical axis H. Plates 5, 105 may have a generally rectangular shape.

In addition, the plates 5, 105 are shaped to allow the circulation of a heat transfer fluid. In particular, the plates 5, 105 can each have a substantially hollow or bowl shape, so as to allow the heat transfer fluid to flow between the two plates 5, 105 of a pair after assembly.

The heat transfer fluid is for example a cooling liquid. More precisely, the plates 5, respectively 105, define in pairs at least one coolant fluid circulation channel. The heat transfer fluid can flow in the plates 5, 105 in one or more passes, according to a linear flow pattern or not.

To this end, the plates 5, respectively 105, can each have one or more ribs 51. By way of non-limiting example, each plate 5, 105 comprises at least one first rib 51 which can be central, for example of general shape in T. the plates 5, 105 may comprise one or more second ribs 51, for example longitudinal. The ribs 51 may have a rounded end. The ribs 51 are provided on the internal surfaces of the plates 5, 105, that is to say the surfaces intended to be arranged facing a plate 5, 105 associated with the assembly of a pair of plates 5, 105.

Furthermore, the plates 5, 105 may have a multitude of bosses 53 on their internal surface presenting the rib or ribs 51, advantageously in order to ensure the mechanical strength, in particular due to the internal pressure of the heat transfer fluid between two plates 5, the external pressure of the components 3.

The plates 5, 105 are therefore arranged in pairs so that their internal faces having for example the rib or ribs 51, and any bosses 53, face one another. When two plates 5, 105 are assembled, the or each rib 51 of a first plate 5, 105 is held in contact with the corresponding rib 51 facing a second associated plate 5, 105. Thus, the ribs 51 of the two plates 5, 105, and any bosses 53, protrude into the heat transfer fluid flow passage in order to define a flow pattern or path or different passes of the heat transfer fluid. Other flow patterns can be considered.

Each plate 5, 105 may include a peripheral edge 55 over the entire contour of the plate 5, 105. The plates 5, 105 of the same pair are joined together in a sealed manner at their respective peripheral edges 55.

As illustrated in Figures 5 and 6, a predefined number of stops can be formed on the plates 5, respectively 105, for example in the form of pins 56. In particular, each plate 5, respectively 105, can comprise two stops 56 extending from the outer surface of the plate 5, 105, that is to say according to the examples described on the side opposite to any ribs 51 and any bosses 53. The pins 56 project from the general plane defined by the outer surface of the corresponding plate 5, 105. Thus, as shown schematically in Figures 7 and 8, when the electronic and/or electrical components 3 are inserted between the plates 5, respectively 105, these components 3 bear at least in part against the stops, for example in the form pins 56. According to a variant not shown, to ensure blocking along the axis of height H, the electronic and/or electrical components 3 can bear at least in part against the collector 7 or 107 of the coolant.

Furthermore, the plates 5, 105 are advantageously made of a metallic material and can be connected in pairs in a sealed manner, for example by brazing.

Referring again to Figures 1 and 2, the heat transfer fluid circulation channels defined by the plates 5 or 105 are arranged in fluid communication with each heat transfer fluid manifold 7 or 107.

To do this, the plates 5 or 105 respectively comprise at least one fluidic connection zone 57 or 157 to each heat transfer fluid manifold 7 or 107.

According to the examples illustrated in Figures 3 and 4, a fluidic connection zone 57 or 157 is formed at the level of a lateral edge of the plate 5 or 105 and extends from this lateral edge in the direction of the collector 7 or 107 to the assembled state of the device 1, 101. More precisely, each plate 5, 105 comprises at the level of the or each fluidic connection zone 57 or 157 an inlet and an outlet for heat transfer fluid.

According to the embodiments illustrated in Figures 1 and 2, the two collectors 7, respectively 107 are connected to the same end of each plate 5, respectively 105.

In addition, the heat transfer fluid collectors 7, respectively 107, each comprise a first rigid portion 71, at the level of each fluidic connection with a plate 5, 105, that is to say at the level of the connection with the connection zones 57, 157 of the plates 5, 105. The heat transfer fluid collectors 7, respectively 107, further comprise second flexible portions 73 along the stacking axis A1. Each second flexible portion 73 is arranged between two first rigid portions 71.

The second flexible portions 73 can be deformed, in particular compressed and possibly stretched, in the stacking axis A1. This confers flexibility on the device 1, 101 along the stacking axis A1, and allows compression of the plates 5, 105 between which the electronic and/or electrical components 3 are arranged. In other words, an important characteristic of the second flexible portions 73 is to be flexible enough to be able to accept a compression for example on the end plates 5, 105 of the device 1, 101 and to deform in order to ensure the thermal contact necessary to thermal regulation, in particular cooling, of the components 3 via the plates 5, 105.

In particular, each collector 7, respectively 107, can present, at the level of the second flexible portions 73, a succession of folds or grooves or undulations, so as to form a reserve of material along the stacking axis A1. The folds are for example made on the outer surface of each flexible portion 73 of the collector 7, 107. The outer surface located opposite, or on the outside, of the flow passage of the heat transfer fluid inside the collector 7, 107. The depth of the folds can be in the direction of the height of the device 1, 101, along the vertical axis H in the examples illustrated. The depth and the number of folds or grooves or undulations can be determined according to the extension to be achieved along the stacking axis A1, the material thickness at the level of the second flexible portions 73, and the internal mechanical stresses and external to the manifold 7, 107, for example as a function of the pressure of the heat transfer fluid intended to circulate in the manifold. The second flexible portions 73 are for example made in the form of bellows.

The first rigid portions 71 at the level of the fluidic connections with the plates 5, 105 have a greater rigidity than the rigidity of the second flexible portions 73.

Furthermore, at least the second flexible portions 73 of the or each manifold 7, respectively 107, are produced by one or more separate inserts of the plates 5, respectively 105.

Two embodiments of the heat transfer fluid collectors 7, 107 and of the connection with the plates 5, 105 are described in more detail below.

First embodiment

According to the first embodiment of Figure 1, the device 1 comprises a plurality of hollow connectors 9, better visible in Figure 9, flexible or deformable along the stacking axis A1. These are, for example, sleeves.

The hollow connectors 9 are arranged to place the pairs of plates 5 in fluid communication, so as to define a collector 7 of heat transfer fluid. More precisely, the hollow connectors 9 are arranged between the fluidic connection zones 57 of the plates 5 of neighboring pairs.

Thus, the fluidic connection zones 57 of the plates 5 define at least in part the first rigid portions 71 of the manifold 7 and the hollow connectors 9 define at least in part the second flexible portions 73 of the manifold 7.

According to this first embodiment, the plates 5 include, for example, openings 58 forming an inlet and an outlet for heat transfer fluid. In this example, each connection zone 57 has two openings 58, also referring to Figures 3 and 5. The first rib 51 and a second rib 51 can extend on either side of each opening 58.

At least one plate 5 of each pair has a collar 59 bordering each opening 58, and extending in the direction of a plate 5 of an adjacent pair. In particular, two plates 5 facing two neighboring pairs each have a collar 59. Each collar 59 can be made in one piece with a plate 5.

The collars 59 are oriented towards the outside of the coolant fluid flow passage, defined between two plates 5 of the same pair. In other words, the collars 59 extend from the outer surfaces of the plates 5 opposite to the inner surfaces of the plates 5.

The stack of plates 5 comprises a plurality of intermediate plates 5 between two end plates 5 along the stacking axis A1. The collars 59 of the intermediate plates 5 extend in the direction of a pair of adjacent or adjacent plates 5. The collar or collars 59 of an end plate 5 extend for example in the direction of a connecting element (not shown) to a circuit of the heat transfer fluid, such as a pipe. The other end plate 5 may have no collar or have closed collars.

The collars 59 of a plate 5 of a given pair are in fluid communication with the collars 59 of a plate 5 of a neighboring pair. In particular, the collars 59 of the pairs of neighboring plates 5 are assembled by means of the hollow connectors 9, as is best seen in Figure 9.

Each collar 59 bordering an opening 58 on a plate 5 is therefore formed on a fluidic connection zone 57 of the plate 5 and forms a first rigid portion 71 of the collector 7 of heat transfer fluid.

The collars 59 are for example generally cylindrical in shape. The hollow connectors 9 are of a shape complementary to the shape of the collars 59, in this example the hollow connectors 9 are of generally cylindrical shape, the axis of revolution of which coincides with the stacking axis A1 when the hollow connectors are assembled. 9 with plates 105.

According to the variant embodiment in which the second flexible portions 73, for example in the form of bellows, have a succession of folds or grooves or undulations, the folds are made over the entire circumference of a hollow connector 9. This is example of folds made radially on the outer surface of each hollow connector 9. The outer surface of a hollow connector 9 is the surface located opposite, or outside, the heat transfer fluid flow passage. This flow passage is defined inside the collector 7 formed by the assembly of the collars 59 and the hollow connectors 9.

In the example illustrated, the number of patterns such as folds, of each hollow connector 9 or sleeve, for example in the form of a bellows, is three. This number can be adapted in particular according to the length of the sleeve, the play to be compensated and the maximum acceptable forces during compression.

In addition, the hollow connectors 9 can each have two ends 91 for connection to the collars 59 of the plates 5. The two ends 91 of the hollow connector 9 are in the example illustrated on either side of the succession of folds according to the stacking axis A1.

The hollow connectors 9 can be fitted onto the collars 59 of the plates 5. The connection elements 91 of the hollow connectors 9 are in the example illustrated arranged around the collars 59 of the plates 5. Alternatively, the collars 59 of the plates 5 can be arranged around the connecting elements 91 of the hollow connectors 9.

Furthermore, the hollow connectors 9 are advantageously made of metallic material, such as aluminum or aluminum alloy. All of the plates 5 and the hollow connectors 9 can advantageously be soldered in one go. This ensures a strong sealed connection between the plates 5 and the hollow connectors 9.

Thus, the device 1 shown in Figure 10, comprising a plurality of plates 5 assembled to the hollow connectors 9 as defined above, in a robust manner, in particular by brazing, then has the general shape of a comb. It can be delivered to the end customer before assembly with the electronic and/or electrical components, in order to form an electrical module, for example ready to be mounted in the motor vehicle. The pairs of plates 5 of such a device 1 are advantageously spaced along the stacking axis A1, by a predefined gap, which may be standard. In order to allow the insertion of said components, this predefined gap is greater than the dimension of said components in the stacking axis A1, namely their width or depth.

The hollow connectors 9, for example in the form of bellows, can be more or less relaxed as shown in Figure 9. In other words, the folds of the bellows are further apart or shallower.

Then, the electronic and/or electrical components 3 can be inserted simultaneously, or alternatively one by one, between the pairs of plates 5, as shown in Figure 11.

After insertion, the assembly can be compressed along the stacking axis A1, preferably on both sides of the device 1, as shown schematically by the arrows F in Figure 12. As shown schematically in Figure 13, the hollow connectors 9 by example in the form of bellows are in a compressed state. In other words, the folds of the bellows are tighter or closer together than in the illustration in Figure 9 before compression.

Thus, the distance between the pairs of plates 5 is sufficient to allow the insertion of the components without requiring a prior separation of the plates 5, the bellows making it possible to absorb any assembly play, and the assembly can be compressed once the components 3 interposed between the pairs of plates 5, due to the flexibility of the collectors 7.

Optionally, in particular when the gap between the pairs of plates 5 is not sufficient to allow the insertion of the electronic and/or electrical components 3, during a preliminary step, the pairs of plates 5 can be separated or remote from each other along the stacking axis A1 simultaneously, or alternatively one by one. This spacing is possible thanks to the extension or lengthening along the stacking axis A1 of the elastically deformable portions 73, for example in the form of bellows, of the hollow connectors 9.

Second embodiment

According to the second embodiment illustrated in Figure 2, the or each heat transfer fluid manifold 107 is made in a single piece which is separate from the plates 105.

One of the manifolds 107 allows the heat transfer fluid, in particular cold, to circulate and be distributed to the various plates 105, the other ensures the return of the heat transfer fluid, in particular hot, after it has passed through the plates 105.

In this case, the fluidic connection zones 157 of the plates 105 open into the collector 107 of heat transfer fluid.

Only the differences of the second embodiment with respect to the first embodiment are explained below.

A collector 107 made in one piece is shown in Figure 14. It is for example extruded.

The sizing of such a collector 107, in particular the thickness of the collector 107 and the sizing of these rigid 71 and flexible 73 portions, takes into account internal mechanical constraints, for example the internal pressure of the heat transfer fluid, and external to the collector 107 .

In a non-limiting way, the collector 107 can have the general shape of a rectangular parallelepiped extending longitudinally along the stacking axis A1 in the assembled state of the device 101. This collector 107 can be closed on one side and be placed in fluid communication with a heat transfer fluid circuit on the other side. According to the particular example shown, these are the sides along the longitudinal axis of the collector 107, that is to say along the stacking axis A1.

The first rigid portions 71 of the heat transfer fluid manifold comprise a plurality of openings 711. These openings 711 are lined with collars 713 as is best seen in Figure 15. The collars 713 of each heat transfer fluid manifold 107 extend to inside the volume defined by the collector 107 of heat transfer fluid.

The fluidic connection zones 157 of the plates 105 are intended to be received in the openings 711 bordered by collars 713 of the first rigid portions 71 of the manifold 107, as shown in Figures 16 and 17. A robust connection is thus ensured between the plates 105 and each manifold 107.

By way of example, the plates 105 may have two extensions 159 extending from a fluidic connection zone 157 in the direction of the heat transfer fluid manifold 107 (also referring to Figures 4 and 6). The first rib 51 and a second rib 51 can extend on either side of each extension 159. When two plates 105 of a pair are assembled, the facing extensions 159 form the inlet and outlet 158 of heat transfer fluid.

Furthermore, according to an exemplary embodiment, each connection zone 157 of a plate 105 may comprise at least one stop 161, better visible in Figure 17, called product stop. Such a stop 161 comes to bear against a region of a first rigid portion 71 of the collector 107 around an opening 711, when the plate 105, more precisely the pair of plates 105 is inserted into the collector 107. This makes it possible to wedge the positioning of the plates 105 with respect to the collectors 107 according to the height of the device 101, that is to say along the vertical axis H in this example.

By way of example, in the case of plates 105 assembled by brazing, their contour may have a brazing flat which can be removed at the level of the extensions 159, in order to ensure fitting in the corresponding manifold 107. In this case, the remaining brazing flat makes it possible to form the product stop 161 during the assembly of the device 101 before brazing.

Alternatively, the positioning of the plates along the H axis with respect to the or each collector 107 of heat transfer fluid can be done automatically when assembling all of the plates 105 to the collector(s) 107 of fluid coolant, without requiring product abutments on the plates 105. In this case, there would be no abutment formed by a brazing plate.

In addition, according to the variant embodiment in which the second flexible portions 73, for example in the form of bellows, have a succession of folds or grooves or undulations, the folds are made over the entire periphery of a section of each collector 107. These are, for example, folds made on the outer surface of each collector 7. The outer surface is located opposite, or on the outside, of the flow passage of the coolant fluid. In the example illustrated, the number of patterns such as folds, of each collector section 107, for example in the form of bellows, is three. This number can be adapted in particular according to the length of the flexible section, the play to be compensated and the maximum acceptable forces during compression.

Finally, the manifolds 107 made in one piece can be made of a metallic material, for example aluminum or an aluminum alloy. All of the plates 105, and the collectors 107, forming the device 101, can advantageously be brazed in one go. This ensures a strong sealed connection between the plates 105, and the or each heat transfer fluid manifold 107.

Furthermore, the dimensioning of the various elements of the device 101 for the flow of the heat transfer fluid, namely the width of the circulation channel(s) defined by the plates 105 as well as of each collector 107, is a function in particular of the space available for manifolds 107 in the final environment and the desired device pressure drop.

According to a preferred embodiment, the passage section is greater at the level of the collectors 107 in order to limit the pressure drop therein as much as possible. The distribution of the heat transfer fluid between the different pairs of plates 105 is identical or almost identical. The pressure drop in each pair of plates 105 can be greater than that in each collector 107, so as to ensure as much as possible the same flow rate between each pair of plates 5, to ensure uniform cooling.

Thus, the device 101 shown in Figure 18, comprising a plurality of plates 105 assembled to the collectors 107 as defined above, in a robust manner, in particular by brazing, then has the general shape of a comb. It can be delivered to the end customer before assembly with the electronic and/or electrical components, in order to form an electrical module, for example ready to be mounted in the motor vehicle. Similarly to the first embodiment, the pairs of plates 105 of such a device 101 are advantageously spaced along the stacking axis A1, by a predefined gap, which may be standard. In order to allow the insertion of said components, this predefined gap is greater than the dimension of said components in the stacking axis A1, namely their width or depth.

Then, the electronic and/or electrical components 3 can be inserted simultaneously, or alternatively one by one, between the pairs of plates 105, as shown in Figure 19.

Before compression, the second deformable or flexible portions 73, for example in the form of bellows, can be more or less relaxed as shown in Figure 20.

The assembly can be compressed along the stacking axis A1, preferably on both sides of the device 101, as shown schematically by the arrows F' in Figure 21. In particular, the compression can take place by coming to press at the end of the two collectors 107, or even by also pressing at the level of the top of the plates 105 according to the arrangement of the elements in Figure 21, to ensure homogeneous compression. After compression, the second flexible portions 73, for example in the form of bellows, are in a more compressed state than with respect to FIG. 20 before compression. In other words, the folds of the bellows are tighter.

Thus, the distance between the pairs of plates 105 is sufficient to allow the insertion of the components 3 without requiring prior spacing of the plates 105, the bellows making it possible to absorb any assembly play, and the assembly can be compressed once the components 3 interposed between the pairs of plates 105, due to the flexibility of the collectors 107.

Optionally, in particular when the gap between the pairs of plates 105 is not sufficient to allow the insertion of the electronic and/or electrical components 3, during a preliminary step, the pairs of plates 105 can be separated or remote from each other along the stacking axis A1 simultaneously, or alternatively one by one. This spacing is possible thanks to the extension or lengthening along the stacking axis A1 of the elastically deformable portions 73, for example in the form of bellows.

Thus, a device 1, 101 according to one or other of the embodiments described, with the plates 5, 105 and the collector(s) 7, 107 of the heat transfer fluid can be assembled in a robust manner, in particular by brazing, to be delivered to the end customer before assembly of the components and assembly on the vehicle, for example.

Flexibility/tolerance on assembly in the direction of the stacking of the plates 5, 105 is provided by the plurality of second flexible portions 73, for example in the form of bellows of the or each manifold 7, 107, which makes it possible to compress everything, when the components 3 are inserted between the pairs of plates 5, 105, to ensure that the components 3 are held in position by the plates 5, 105, and to ensure the thermal contact necessary for thermal regulation such as the cooling of the components 3.

In addition to the advantage of being able to insert, for example, all the components 3 simultaneously into the device 1 or 101, the brazed device 1, 101 also makes it possible to gain in reliability compared to a device with O-rings or flat seals to ensure sealing.

Finally, the fact of using hollow connectors 9, such as sleeves as described in the first embodiment, or heat transfer fluid collectors 107 as described in the second embodiment, produced separately from the plates 5, respectively 105, as transport vectors of the heat transfer fluid to the pairs of plates 5, 105, makes it possible to accept all thicknesses of components 3. Indeed, the invention is not limited by the stamping height at the level of the plates for form a fluidic and mechanical connection between the pairs of plates as in certain solutions of the prior art.

Claims (10)

Device (1, 101) for thermal regulation of electronic and/or electrical components (3), in particular for a motor vehicle, said device (1, 101) comprising a predefined number of plates (5, 105) arranged along a stacking axis (A1) between which said components (3) are intended to be arranged, and at least one heat transfer fluid manifold (7, 107), the plates (5, 105) defining at least one heat transfer fluid circulation channel in fluid communication with said at least one collector (7, 107) of heat transfer fluid,
characterized in that:
- the plates (5, 105) respectively comprise at least one fluidic connection zone (57, 157) to said at least one heat transfer fluid manifold (7, 107), and in that
- said at least one collector (7, 107) of heat transfer fluid has a first rigid portion (71) at the level of each fluidic connection with a plate (5, 105) and has, between the first rigid portions (71), a second flexible portion (73) along the stacking axis (A1), such as
the first rigid portions (71) have greater rigidity than the second flexible portions (73), and that
the second flexible portions (73) are deformable along the stacking axis (A1) under the application of a stress. Device (1, 101) according to the preceding claim, in which said at least one collector (7, 107) of heat transfer fluid has a succession of folds at the level of the second flexible portions (73), so as to form a reserve of material according to the stacking axis (A1). Device (1, 101) according to the preceding claim, in which the second flexible portions (73) of said at least one collector (7, 107) of heat transfer fluid are made in the form of bellows. Device (1) according to any one of claims 1 to 3, comprising a plurality of hollow connectors (9) flexible along the stacking axis (A1) and placing the plates (5) in fluid communication, so as to define said at least one coolant manifold (7). Device (1) according to the preceding claim, in which at least certain plates (5) comprise at least one collar (59) bordering an opening (58), and in which the collars (59) of the plates (5) are assembled by intermediary of the hollow connectors (9). Device (101) according to any one of Claims 1 to 3, in which the said at least one collector (107) of heat transfer fluid is produced in a single piece, separate from the plates (105), and into which the zones of fluidic connection (157) of the plates (105). Device (101) according to the preceding claim, in which the first rigid portions (71) of the said at least one heat transfer fluid manifold (107) comprise a plurality of openings (711) bordered by collars (713) and in which the zones of fluid connection (157) plates (105) are received. Device (1, 101) according to any one of the preceding claims, comprising at least one abutment (56) of said components (3). Device (1, 101) according to the preceding claim, in which a predefined number of stops (56) of said components (3) is formed on the plates (5, 105). Device (1, 101) according to any one of the preceding claims, in which the plates (5, 105) and the said at least one collector (7, 107) of heat transfer fluid are metallic and are assembled by brazing.