FR3089057B1 - System including an electric power module and a sheath against electric arcs - Google Patents

System including an electric power module and a sheath against electric arcs Download PDF

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Publication number
FR3089057B1
FR3089057B1 FR1872030A FR1872030A FR3089057B1 FR 3089057 B1 FR3089057 B1 FR 3089057B1 FR 1872030 A FR1872030 A FR 1872030A FR 1872030 A FR1872030 A FR 1872030A FR 3089057 B1 FR3089057 B1 FR 3089057B1
Authority
FR
France
Prior art keywords
housing
system including
power module
module
ribs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1872030A
Other languages
French (fr)
Other versions
FR3089057A1 (en
Inventor
Hugo Reynes
Cyril Buttay
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Centre National de la Recherche Scientifique CNRS
Universite Claude Bernard Lyon 1 UCBL
Ecole Centrale de Lyon
Institut National des Sciences Appliquees de Lyon
SuperGrid Institute SAS
Original Assignee
Centre National de la Recherche Scientifique CNRS
Universite Claude Bernard Lyon 1 UCBL
Ecole Centrale de Lyon
Institut National des Sciences Appliquees de Lyon
SuperGrid Institute SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Centre National de la Recherche Scientifique CNRS, Universite Claude Bernard Lyon 1 UCBL, Ecole Centrale de Lyon, Institut National des Sciences Appliquees de Lyon , SuperGrid Institute SAS filed Critical Centre National de la Recherche Scientifique CNRS
Priority to FR1872030A priority Critical patent/FR3089057B1/en
Priority to EP19805690.5A priority patent/EP3874538A1/en
Priority to PCT/EP2019/082120 priority patent/WO2020109138A1/en
Priority to CN201980077911.5A priority patent/CN113454775A/en
Publication of FR3089057A1 publication Critical patent/FR3089057A1/en
Application granted granted Critical
Publication of FR3089057B1 publication Critical patent/FR3089057B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/62—Protection against overvoltage, e.g. fuses, shunts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14329—Housings specially adapted for power drive units or power converters specially adapted for the configuration of power bus bars

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Casings For Electric Apparatus (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Emergency Protection Circuit Devices (AREA)

Abstract

L’invention concerne un système incluant : -un module de puissance électrique haute tension (1), comportant un boîtier diélectrique (2) logeant des composants électroniques dudit module, et comportant au moins des première (101) et deuxième (102) bornes de connexion accessibles depuis l’extérieur du module et entre lesquelles les composants électroniques du module sont susceptibles d’appliquer une différence de potentiel au moins égale à 1kV, lesdites première et deuxième bornes étant séparées par au moins une alternance de gorges (6) et de nervures (7) ménagées dans une face externe du boîtier diélectrique (2) ; -un élément de protection diélectrique (10) s’étendant entre les première et deuxième bornes de connexion (101, 102), l’élément de protection (10) recouvrant les nervures du boîtier et comportant des nervures (17) logées dans des gorges (6) du boîtier. Figure à publier avec l’abrégé : Fig. 3The invention relates to a system including: -a high voltage electrical power module (1), comprising a dielectric housing (2) housing electronic components of said module, and comprising at least first (101) and second (102) terminals. connection accessible from outside the module and between which the electronic components of the module are capable of applying a potential difference at least equal to 1 kV, said first and second terminals being separated by at least one alternation of grooves (6) and of ribs (7) formed in an external face of the dielectric housing (2); -a dielectric protection element (10) extending between the first and second connection terminals (101, 102), the protection element (10) covering the ribs of the housing and comprising ribs (17) housed in grooves (6) of the housing. Figure to be published with the abstract: Fig. 3

FR1872030A 2018-11-28 2018-11-28 System including an electric power module and a sheath against electric arcs Active FR3089057B1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR1872030A FR3089057B1 (en) 2018-11-28 2018-11-28 System including an electric power module and a sheath against electric arcs
EP19805690.5A EP3874538A1 (en) 2018-11-28 2019-11-21 System including an electrical power module and an electric arc sheath
PCT/EP2019/082120 WO2020109138A1 (en) 2018-11-28 2019-11-21 System including an electrical power module and an electric arc sheath
CN201980077911.5A CN113454775A (en) 2018-11-28 2019-11-21 System comprising a power supply module and an arc flash sheath

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1872030A FR3089057B1 (en) 2018-11-28 2018-11-28 System including an electric power module and a sheath against electric arcs

Publications (2)

Publication Number Publication Date
FR3089057A1 FR3089057A1 (en) 2020-05-29
FR3089057B1 true FR3089057B1 (en) 2021-09-10

Family

ID=66218206

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1872030A Active FR3089057B1 (en) 2018-11-28 2018-11-28 System including an electric power module and a sheath against electric arcs

Country Status (4)

Country Link
EP (1) EP3874538A1 (en)
CN (1) CN113454775A (en)
FR (1) FR3089057B1 (en)
WO (1) WO2020109138A1 (en)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10242181A (en) * 1997-02-28 1998-09-11 Taiwan Moshii Denshi Kofun Yugenkoshi Method for forming dielectric layer to make it as protective layer
US7763970B2 (en) * 2008-02-27 2010-07-27 Infineon Technologies Ag Power module
JP6233507B2 (en) * 2014-05-15 2017-11-22 富士電機株式会社 Power semiconductor modules and composite modules
US9839146B2 (en) * 2015-10-20 2017-12-05 Cree, Inc. High voltage power module
US10541204B2 (en) * 2015-10-20 2020-01-21 Taiwan Semiconductor Manufacturing Co., Ltd. Interconnection structure and method of forming the same
US10153237B2 (en) * 2016-03-21 2018-12-11 Xintec Inc. Chip package and method for forming the same
US10068851B1 (en) * 2017-05-30 2018-09-04 Advanced Semiconductor Engineering, Inc. Semiconductor package structure and method for manufacturing the same

Also Published As

Publication number Publication date
FR3089057A1 (en) 2020-05-29
CN113454775A (en) 2021-09-28
EP3874538A1 (en) 2021-09-08
WO2020109138A1 (en) 2020-06-04

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