FR3051978A1 - Circuit integre cascode - Google Patents
Circuit integre cascode Download PDFInfo
- Publication number
- FR3051978A1 FR3051978A1 FR1654715A FR1654715A FR3051978A1 FR 3051978 A1 FR3051978 A1 FR 3051978A1 FR 1654715 A FR1654715 A FR 1654715A FR 1654715 A FR1654715 A FR 1654715A FR 3051978 A1 FR3051978 A1 FR 3051978A1
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- Prior art keywords
- integrated circuit
- chip
- contact pad
- gate
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000463 material Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 5
- 230000005669 field effect Effects 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 230000000903 blocking effect Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 3
- 229910002704 AlGaN Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49575—Assemblies of semiconductor devices on lead frames
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5228—Resistive arrangements or effects of, or between, wiring layers
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/62—Protection against overvoltage, e.g. fuses, shunts
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
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- H01L2224/05552—Shape in top view
- H01L2224/05553—Shape in top view being rectangular
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
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- H—ELECTRICITY
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/0601—Structure
- H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/4811—Connecting to a bonding area of the semiconductor or solid-state body located at the far end of the body with respect to the bonding area outside the semiconductor or solid-state body
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Semiconductor Integrated Circuits (AREA)
- Amplifiers (AREA)
Abstract
Description
Claims (10)
- REVENDICATIONS1. Circuit intégré (300) comprenant un boitier (4), une première puce (1) formée d'un transistor à haute tension en mode déplétion et une deuxième puce (2) formée d'un transistor à basse tension en mode enrichissement connectées en cascode dans le boitier (4), la première (1) et la deuxième (2) puces comportant respectivement des premiers et des deuxièmes plots de contact de grille (13,23), de source (12,22) et de drain (11,21), le circuit intégré (3) étant caractérisé en ce qu'il comprend un composant passif résistif (9) disposé dans le boîtier (4) et connecté électriquement entre le deuxième plot de contact de grille (23) et le deuxième plot de contact de source (22).
- 2. Circuit intégré (300) selon la revendication précédente, dans lequel le composant passif (9) est formé dans une troisième puce (90) reliée électriquement à la deuxième puce (2) par connexion filaire (5).
- 3. Circuit intégré (300) selon la revendication 1, dans lequel le composant passif (9) est formé dans la deuxième puce (2).
- 4. Circuit intégré (300) selon la revendication précédente, dans lequel le composant passif (9) est formé par un serpentin métallique.
- 5. Circuit intégré (300) selon l'une des revendications précédentes, dans lequel le composant passif (9) présente une résistance supérieure à 100 kilo-ohms.
- 6. Circuit intégré (300) selon l'une des revendications précédentes, dans lequel le composant passif (9) présente une résistance inférieure à 1 méga-ohm.
- 7. Circuit intégré (300) selon l'une des revendications précédentes, dans lequel le circuit intégré (300) est muni de broches (31,32,33) sortant de son boitier (4), dont une broche de grille (33) reliée au plot de contact de grille (23) de la deuxième puce (2), une broche de source (32) reliée au plot de contact de source (22) de la deuxième puce (2) et une broche de drain (31) reliée au plot de contact de drain (11) de la première puce (1).
- 8. Circuit intégré (300) selon l'une des revendications précédentes, formant un commutateur de puissance.
- 9. Circuit intégré (300) selon l'une des revendications précédentes, dans lequel le transistor à haute tension en mode déplétion est un transistor à haute mobilité électronique formé à partir de matériaux III-N.
- 10. Circuit intégré (300) selon l'une des revendications précédentes, dans lequel le transistor à basse tension en mode enrichissement est un transistor MOS à effet de champ formé à partir de silicium.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1654715A FR3051978B1 (fr) | 2016-05-26 | 2016-05-26 | Circuit integre cascode |
PCT/FR2017/051316 WO2017203187A1 (fr) | 2016-05-26 | 2017-05-26 | Circuit intégré comprenant une pluralité de puces formées d'un transistor à haute tension et comprenant une puce formée d'un transistor à basse tension |
CN201780031115.9A CN109314107B (zh) | 2016-05-26 | 2017-05-26 | 包括由高压晶体管形成的芯片并且包括由低压晶体管形成的芯片的集成电路 |
US16/304,643 US10777513B2 (en) | 2016-05-26 | 2017-05-26 | Integrated circuit comprising a chip formed by a high-voltage transistor and comprising a chip formed by a low-voltage transistor |
PCT/FR2017/051315 WO2017203186A1 (fr) | 2016-05-26 | 2017-05-26 | Circuit intégré comprenant une puce formée d'un transistor à haute tension et comprenant une puce formée d'un transistor à basse tension |
EP17730872.3A EP3465755A1 (fr) | 2016-05-26 | 2017-05-26 | Circuit intégré comprenant une puce formée d'un transistor à haute tension et comprenant une puce formée d'un transistor à basse tension |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1654715A FR3051978B1 (fr) | 2016-05-26 | 2016-05-26 | Circuit integre cascode |
FR1654715 | 2016-05-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3051978A1 true FR3051978A1 (fr) | 2017-12-01 |
FR3051978B1 FR3051978B1 (fr) | 2018-05-11 |
Family
ID=56943661
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1654715A Active FR3051978B1 (fr) | 2016-05-26 | 2016-05-26 | Circuit integre cascode |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR3051978B1 (fr) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110193619A1 (en) * | 2010-02-05 | 2011-08-11 | Transphorm Inc. | Semiconductor electronic components and circuits |
US20120049929A1 (en) * | 2010-08-31 | 2012-03-01 | Hon Hai Precision Industry Co., Ltd. | Field-effect transistor |
DE102012101127A1 (de) * | 2012-02-14 | 2013-08-14 | Zf Lenksysteme Gmbh | Servolenkvorrichtung eines kraftfahrzeugs |
-
2016
- 2016-05-26 FR FR1654715A patent/FR3051978B1/fr active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110193619A1 (en) * | 2010-02-05 | 2011-08-11 | Transphorm Inc. | Semiconductor electronic components and circuits |
US20120049929A1 (en) * | 2010-08-31 | 2012-03-01 | Hon Hai Precision Industry Co., Ltd. | Field-effect transistor |
DE102012101127A1 (de) * | 2012-02-14 | 2013-08-14 | Zf Lenksysteme Gmbh | Servolenkvorrichtung eines kraftfahrzeugs |
Also Published As
Publication number | Publication date |
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FR3051978B1 (fr) | 2018-05-11 |
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